Datasheet NL27WZ14 (ON Semiconductor) - 8

NL27WZ14 PACKAGE DIMENSIONS SC−88/SC70−6/SOT−363
CASE 419B−02 ISSUE Y
2X
aaa H D NOTES:
D H
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS.
A
3. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH,
D
PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRU-
GAGE
SIONS, OR GATE BURRS SHALL NOT EXCEED 0.20 PER END.
PLANE
4. DIMENSIONS D AND E1 AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY AND DATUM H.
6 5 4
5. DATUMS A AND B ARE DETERMINED AT DATUM H.
L2 L
6. DIMENSIONS b AND c APPLY TO THE FLAT SECTION OF THE
E E1
LEAD BETWEEN 0.08 AND 0.15 FROM THE TIP.
DETAIL A
7. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION.
1 2 3
ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 TOTAL IN EXCESS OF DIMENSION b AT MAXIMUM MATERIAL CONDI- aaa C
2X
TION. THE DAMBAR CANNOT BE LOCATED ON THE LOWER
2X 3 TIPS
RADIUS OF THE FOOT. bbb H D
e MILLIMETERS INCHES DIM MIN NOM MAX MIN NOM MAX B 6X b A
−−− −−− 1.10 −−− −−− 0.043 ddd M C
A1
0.00 −−− 0.10 0.000 −−− 0.004
TOP VIEW
A-B D
A2
0.70 0.90 1.00 0.027 0.035 0.039
b
0.15 0.20 0.25 0.006 0.008 0.010
C
0.08 0.15 0.22 0.003 0.006 0.009
A2 D
1.80 2.00 2.20 0.070 0.078 0.086
DETAIL A A E
2.00 2.10 2.20 0.078 0.082 0.086
E1
1.15 1.25 1.35 0.045 0.049 0.053
e
0.65 BSC 0.026 BSC
L
0.26 0.36 0.46 0.010 0.014 0.018
L2
0.15 BSC 0.006 BSC
aaa
0.15 0.006
bbb
0.30 0.012
ccc
0.10 0.004
6X
ccc C
A1 SEATING C c ddd
0.10 0.004
SIDE VIEW PLANE END VIEW RECOMMENDED SOLDERING FOOTPRINT*
6X 6X 0.30 0.66 2.50 0.65 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com 8