Datasheet NL27WZ14 (ON Semiconductor) - 3
| Hersteller | ON Semiconductor |
| Beschreibung | Dual Inverter with Schmitt Trigger Input |
| Seiten / Seite | 12 / 3 — NL27WZ14. MAXIMUM RATINGS. Symbol. Characteristics. Value. Units. … |
| Revision | 15 |
| Dateiformat / Größe | PDF / 190 Kb |
| Dokumentensprache | Englisch |
NL27WZ14. MAXIMUM RATINGS. Symbol. Characteristics. Value. Units. RECOMMENDED OPERATING CONDITIONS. Parameter. Min. Max. Unit. www.onsemi.com
Modelllinie für dieses Datenblatt
Textversion des Dokuments
link to page 3 link to page 3 link to page 3 link to page 3 link to page 3 link to page 3
NL27WZ14 MAXIMUM RATINGS Symbol Characteristics Value Units
VCC DC Supply Voltage SC−88 (NLV) −0.5 to +7.0 V SC−88, SC−74, TSOP−6, UDFN6 −0.5 to +6.5 VIN DC Input Voltage SC−88 (NLV) −0.5 to +7.0 V SC−88, SC−74, TSOP−6, UDFN6 −0.5 to +6.5 VOUT DC Output Voltage Active−Mode (High or Low State) −0.5 to VCC +0.5 V SC−88 (NLV) Tri−State Mode (Note 1) −0.5 to +7.0 Power−Down Mode (VCC = 0 V) −0.5 to +7.0 DC Output Voltage Active−Mode (High or Low State) −0.5 to VCC +0.5 V SC−88, SC−74, TSOP−6, UDFN6 Tri−State Mode (Note 1) −0.5 to +6.5 Power−Down Mode (VCC = 0 V) −0.5 to +6.5 IIK DC Input Diode Current, VIN < GND −50 mA IOK DC Output Diode Current, VOUT < GND ±50 mA IOUT DC Output Source/Sink Current ±50 mA ICC or IGND DC Supply Current per Supply Pin or Ground Pin ±100 mA TSTG Storage Temperature Range −65 to +150 °C TL Lead Temperature, 1 mm from Case for 10 secs 260 °C TJ Junction Temperature under Bias +150 °C qJA Thermal Resistance (Note 2) SC−88 659 °C/W SC−74 555 UDFN6 382 PD Power Dissipation in Still Air SC−88 190 mW SC−74 225 UDFN6 327 MSL Moisture Sensitivity Level 1 − FR Flamebility Rating Oxygen Index: 28 to 34 UL 94−V−0 @ 0.125 in − VESD ESD Withstand Voltage (Note 3) Human Body Model 2000 V Charged Device Model 1000 (NLV) Charged Device Model N/A ILATCHUP Latchup Performance (Note 4) ±100 mA Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Applicable to devices with outputs that may be tri−stated. 2. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow. 3. HBM tested to ANSI/ESDA/JEDEC JS−001−2017. CDM tested to EIA/JESD22−C101−F. JEDEC recommends that ESD qualification to EIA/JESD22−A115−A (Machine Model) be discontinued per JEDEC/JEP172A. 4. Tested to EIA/JESD78 Class II.
RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Unit
VCC Positive DC Supply Voltage 1.65 5.5 V VIN DC Input Voltage 0 5.5 V VOUT DC Output Voltage Active−Mode (High or Low State) 0 VCC V Tri−State Mode (Note 1) 0 5.5 Power−Down Mode (VCC = 0 V) 0 5.5 TA Operating Temperature Range −55 +125 °C tr , tf Input Transition Rise or Fall Rate VCC = 1.65 V to 1.95 V No Limit ns VCC = 2.3 V to 2.7 V 0 No Limit VCC = 3.0 V to 3.6 V 0 No Limit VCC = 4.5 V to 5.5 V 0 No Limit Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability.
www.onsemi.com 3
NL27WZ14 MAXIMUM RATINGS Symbol Characteristics Value Units
VCC DC Supply Voltage SC−88 (NLV) −0.5 to +7.0 V SC−88, SC−74, TSOP−6, UDFN6 −0.5 to +6.5 VIN DC Input Voltage SC−88 (NLV) −0.5 to +7.0 V SC−88, SC−74, TSOP−6, UDFN6 −0.5 to +6.5 VOUT DC Output Voltage Active−Mode (High or Low State) −0.5 to VCC +0.5 V SC−88 (NLV) Tri−State Mode (Note 1) −0.5 to +7.0 Power−Down Mode (VCC = 0 V) −0.5 to +7.0 DC Output Voltage Active−Mode (High or Low State) −0.5 to VCC +0.5 V SC−88, SC−74, TSOP−6, UDFN6 Tri−State Mode (Note 1) −0.5 to +6.5 Power−Down Mode (VCC = 0 V) −0.5 to +6.5 IIK DC Input Diode Current, VIN < GND −50 mA IOK DC Output Diode Current, VOUT < GND ±50 mA IOUT DC Output Source/Sink Current ±50 mA ICC or IGND DC Supply Current per Supply Pin or Ground Pin ±100 mA TSTG Storage Temperature Range −65 to +150 °C TL Lead Temperature, 1 mm from Case for 10 secs 260 °C TJ Junction Temperature under Bias +150 °C qJA Thermal Resistance (Note 2) SC−88 659 °C/W SC−74 555 UDFN6 382 PD Power Dissipation in Still Air SC−88 190 mW SC−74 225 UDFN6 327 MSL Moisture Sensitivity Level 1 − FR Flamebility Rating Oxygen Index: 28 to 34 UL 94−V−0 @ 0.125 in − VESD ESD Withstand Voltage (Note 3) Human Body Model 2000 V Charged Device Model 1000 (NLV) Charged Device Model N/A ILATCHUP Latchup Performance (Note 4) ±100 mA Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Applicable to devices with outputs that may be tri−stated. 2. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow. 3. HBM tested to ANSI/ESDA/JEDEC JS−001−2017. CDM tested to EIA/JESD22−C101−F. JEDEC recommends that ESD qualification to EIA/JESD22−A115−A (Machine Model) be discontinued per JEDEC/JEP172A. 4. Tested to EIA/JESD78 Class II.
RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Unit
VCC Positive DC Supply Voltage 1.65 5.5 V VIN DC Input Voltage 0 5.5 V VOUT DC Output Voltage Active−Mode (High or Low State) 0 VCC V Tri−State Mode (Note 1) 0 5.5 Power−Down Mode (VCC = 0 V) 0 5.5 TA Operating Temperature Range −55 +125 °C tr , tf Input Transition Rise or Fall Rate VCC = 1.65 V to 1.95 V No Limit ns VCC = 2.3 V to 2.7 V 0 No Limit VCC = 3.0 V to 3.6 V 0 No Limit VCC = 4.5 V to 5.5 V 0 No Limit Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability.
www.onsemi.com 3