Datasheet RV1S2281A (Renesas) - 10

RV1S2281A 章題 NOTES ON HANDLING 1. Recommended soldering conditions (1) Infrared reflow soldering • Peak reflow temperature 260C or below (package surface temperature) • Time of peak reflow temperature 10 seconds or less • Time of temperature higher than 220C 60 seconds or less • Time to preheat temperature from 120 to 180C 12030 s • Number of reflows Three • Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) Recommended Temperature Profile of Infrared Reflow ) (heating) to 10 s T (°C re 260°C MAX. ratu 220°C e p to 60 s em T 180°C rface e Su 120°C 120±30 s ackag (preheating) P Time (s) (2) Wave soldering • Temperature 260C or below (molten solder temperature) • Time 10 seconds or less • Preheating conditions 120C or below (package surface temperature) • Number of times One (Al owed to be dipped in solder including plastic mold portion.) • Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) (3) Soldering by Soldering Iron • Peak Temperature (lead part temperature) 350C or below • Time (each pins) 3 seconds or less • Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) (a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead (b) Please be sure that the temperature of the package would not be heated over 100C (4) Cautions • Flux Cleaning Avoid cleaning with Freon based or halogen-based (chlorinated etc.) solvents. • Do not use fixing agents or coatings containing halogen-based substances. 2. Cautions regarding noise Be aware that when voltage is applied suddenly between the photocoupler’s input and output or between collector- emitters at startup, the output transistor may enter the on state, even if the voltage is within the absolute maximum ratings. R08DS0185EJ0100 Rev.1.00 Page 10 of 14 Nov 11,2019