Datasheet MCP6V36, MCP6V36U, MCP6V37, MCP6V39 (Microchip) - 5

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MCP6V36/6U/7/9 TABLE 1-2: AC ELECTRICAL SPECIFICATIONS Electrical Characteristics:
Unless otherwise indicated, TA = +25°C, VDD = +1.8V to +5.5V, VSS = GND, VCM = VDD/3, VOUT = VDD/2, VL = VDD/2, RL = 100 kΩ to VL and CL = 20 pF (refer to Figure 1-4 and Figure 1-5).
Parameters Sym. Min. Typ. Max. Units Conditions Amplifier AC Response
Gain Bandwidth Product GBWP — 300 — kHz Slew Rate SR — 0.13 — V/µs Phase Margin PM — 70 — ° G = +1
Amplifier Noise Response
Input Noise Voltage Eni — 0.33 — µVP-P f = 0.01 Hz to 1 Hz Eni — 1.0 — µVP-P f = 0.1 Hz to 10 Hz Input Noise Voltage Density eni — 50 — nV/√Hz f < 2 kHz Input Noise Current Density ini — 5 — fA/√Hz
Amplifier Distortion (Note 1 )
Intermodulation Distortion (AC) IMD — 52 — µVPK VCM tone = 50 mVPK at 100 Hz, GN = 1
Amplifier Step Response
Start Up Time tSTR — 2 — ms G = +1, 0.1% VOUT settling
(Note 2 )
Offset Correction Settling Time tSTL — 100 — µs G = +1, VIN step of 2V, VOS within 100 µV of its final value Output Overdrive Recovery Time tODR — 120 — µs G = -10, ±0.5V input overdrive to VDD/2, VIN 50% point to VOUT 90% point
(Note 3) Note 1:
These parameters were characterized using the circuit in
Figure 1-6
. In
Figure 2-33
and
Figure 2-34
, there is an IMD tone at DC, a residual tone at 100 Hz and other IMD tones and clock tones.
2:
High gains behave differently; see
Section 4.3.3, Offset at Power Up
.
3:
tODR includes some uncertainty due to clock edge timing.
TABLE 1-3: TEMPERATURE SPECIFICATIONS Electrical Characteristics:
Unless otherwise indicated, all limits are specified for: VDD = +1.8V to +5.5V, VSS = GND.
Parameters Sym. Min. Typ. Max. Units Conditions Temperature Ranges
Specified Temperature Range TA -40 — +125 °C Operating Temperature Range TA -40 — +125 °C
(Note 1 )
Storage Temperature Range TA -65 — +150 °C
Thermal Package Resistances
Thermal Resistance, 5L-SC-70 JA — 209 — °C/W Thermal Resistance, 5L-SOT-23 JA — 201 — °C/W Thermal Resistance, 8L-2×3 TDFN θJA — 53 — °C/W Thermal Resistance, 8L-MSOP θJA — 211 — °C/W Thermal Resistance, 14L-TSSOP θJA — 100 — °C/W
Note 1:
Operation must not cause TJ to exceed Maximum Junction Temperature specification (+150°C).  2019 Microchip Technology Inc. DS20006209A-page 5 Document Outline 23 µA, 300 kHz Zero-Drift Op Amps Features Typical Applications Design Aids Related Parts Description Package Types Typical Application Circuit 1.0 Electrical Characteristics 1.1 Absolute Maximum Ratings 1.2 Specifications TABLE 1-1: DC Electrical Specifications TABLE 1-2: AC Electrical Specifications TABLE 1-3: Temperature Specifications 1.3 Timing Diagrams FIGURE 1-1: Amplifier Start Up. FIGURE 1-2: Offset Correction Settling Time. FIGURE 1-3: Output Overdrive Recovery. 1.4 Test Circuits FIGURE 1-4: AC and DC Test Circuit for Most Noninverting Gain Conditions. FIGURE 1-5: AC and DC Test Circuit for Most Inverting Gain Conditions. FIGURE 1-6: Test Circuit for Dynamic Input Behavior. 2.0 Typical Performance Curves 2.1 DC Input Precision FIGURE 2-1: Input Offset Voltage. FIGURE 2-2: Input Offset Voltage Drift. FIGURE 2-3: Input Offset Voltage Quadratic Temp. Co. FIGURE 2-4: Input Offset Voltage vs. Power Supply Voltage with VCM = VCML. FIGURE 2-5: Input Offset Voltage vs. Power Supply Voltage with VCM = VCMH. FIGURE 2-6: Input Offset Voltage vs. Output Voltage. FIGURE 2-7: Input Offset Voltage vs. Common-Mode Voltage with VDD = 1.8V. FIGURE 2-8: Input Offset Voltage vs. Common-Mode Voltage with VDD = 5.5V. FIGURE 2-9: CMRR and PSRR vs. Ambient Temperature. FIGURE 2-10: DC Open-Loop Gain vs. Ambient Temperature. FIGURE 2-11: Input Bias and Offset Currents vs. Common-Mode Input Voltage with TA = +85°C. FIGURE 2-12: Input Bias and Offset Currents vs. Common-Mode Input Voltage with TA = +125°C. FIGURE 2-13: Input Bias and Offset Currents vs. Ambient Temperature with VDD = +5.5V. FIGURE 2-14: Input Bias Current vs. Input Voltage (below VSS). 2.2 Other DC Voltages and Currents FIGURE 2-15: Input Common-Mode Voltage Headroom (Range) vs. Ambient Temperature. FIGURE 2-16: Output Voltage Headroom vs. Output Current. FIGURE 2-17: Output Voltage Headroom vs. Ambient Temperature. FIGURE 2-18: Output Short Circuit Current vs. Power Supply Voltage. FIGURE 2-19: Supply Current vs. Power Supply Voltage. FIGURE 2-20: Power-on Reset Voltage vs. Ambient Temperature. 2.3 Frequency Response FIGURE 2-21: CMRR and PSRR vs. Frequency. FIGURE 2-22: Open-Loop Gain vs. Frequency with VDD = 1.8V. FIGURE 2-23: Open-Loop Gain vs. Frequency with VDD = 5.5V. FIGURE 2-24: Gain Bandwidth Product and Phase Margin vs. Ambient Temperature. FIGURE 2-25: Gain Bandwidth Product and Phase Margin vs. Common-Mode Input Voltage. FIGURE 2-26: Gain Bandwidth Product and Phase Margin vs. Output Voltage. FIGURE 2-27: Closed-Loop Output Impedance vs. Frequency with VDD = 1.8V. FIGURE 2-28: Closed-Loop Output Impedance vs. Frequency with VDD = 5.5V. FIGURE 2-29: Channel-to-Channel Separation vs. Frequency. FIGURE 2-30: Maximum Output Voltage Swing vs. Frequency. 2.4 Input Noise and Distortion FIGURE 2-31: Input Noise Voltage Density and Integrated Input Noise Voltage vs. Frequency. FIGURE 2-32: Input Noise Voltage Density vs. Input Common-Mode Voltage. FIGURE 2-33: Intermodulation Distortion vs. Frequency with VCM Disturbance (see Figure 1-6). FIGURE 2-34: Intermodulation Distortion vs. Frequency with VDD Disturbance (see Figure 1-6). FIGURE 2-35: Input Noise vs. Time with 1 Hz and 10 Hz Filters and VDD = 1.8V. FIGURE 2-36: Input Noise vs. Time with 1 Hz and 10 Hz Filters and VDD = 5.5V. 2.5 Time Response FIGURE 2-37: Input Offset Voltage vs. Time at Power Up. FIGURE 2-38: The MCP6V36/6U/7/9 Family Shows No Input Phase Reversal with Overdrive. FIGURE 2-39: Noninverting Small Signal Step Response. FIGURE 2-40: Noninverting Large Signal Step Response. FIGURE 2-41: Inverting Small Signal Step Response. FIGURE 2-42: Inverting Large Signal Step Response. FIGURE 2-43: Slew Rate vs. Ambient Temperature. FIGURE 2-44: Output Overdrive Recovery vs. Time with G = -10 V/V. FIGURE 2-45: Output Overdrive Recovery Time vs. Inverting Gain. 3.0 Pin Descriptions TABLE 3-1: Pin Function Table 3.1 Analog Outputs 3.2 Analog Inputs 3.3 Power Supply Pins 3.4 Exposed Thermal Pad (EP) 4.0 Applications 4.1 Overview of Zero-Drift Operation FIGURE 4-1: Simplified Zero-Drift Op Amp Functional Diagram. FIGURE 4-2: First Chopping Clock Phase; Equivalent Amplifier Diagram. FIGURE 4-3: Second Chopping Clock Phase; Equivalent Amplifier Diagram. 4.2 Other Functional Blocks FIGURE 4-4: Simplified Analog Input ESD Structures. FIGURE 4-5: Protecting the Analog Inputs Against High Voltages. FIGURE 4-6: Protecting the Analog Inputs Against High Currents. 4.3 Application Tips FIGURE 4-7: Output Resistor, RISO, Stabilizes Capacitive Loads. FIGURE 4-8: Recommended RISO values for Capacitive Loads. FIGURE 4-9: Output Load. FIGURE 4-10: Amplifier with Parasitic Capacitance. 4.4 Typical Applications FIGURE 4-11: Simple Design. FIGURE 4-12: RTD Sensor. FIGURE 4-13: Offset Correction. FIGURE 4-14: Precision Comparator. 5.0 Design Aids 5.1 SPICE Macro Model 5.2 Microchip Advanced Part Selector (MAPS) 5.3 Analog Demonstration and Evaluation Boards 5.4 Application Notes 6.0 Packaging Information 6.1 Package Marking Information Appendix A: REVISION HISTORY Revision A (July 2019) Product Identification System Trademarks Worldwide Sales and Service