Datasheet ALED1262ZT (STMicroelectronics) - 2
| Hersteller | STMicroelectronics |
| Beschreibung | Automotive-grade 12-channel LED driver with open detection, local dimming, busdriven and standalone operations |
| Seiten / Seite | 69 / 2 — ALED1262ZT. Pin description. Figure 1. HTSSOP24 pinout. Table 1. Pin … |
| Dateiformat / Größe | PDF / 3.4 Mb |
| Dokumentensprache | Englisch |
ALED1262ZT. Pin description. Figure 1. HTSSOP24 pinout. Table 1. Pin description. HTSSOP24. Symbol. Name and function. DS12631. Rev 4
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ALED1262ZT Pin description 1 Pin description Figure 1. HTSSOP24 pinout Table 1. Pin description HTSSOP24 Symbol Name and function
1 VDDD Digital supply terminal 2 SDA I²C serial data input terminal 3 SCL I²C clock input terminal 4 VDDA Analog supply terminal and internal LDO input 5 LDO3 3.3 V internal LDO output 6 R-EXT Terminal for external resistor for constant current programming 7 GND Ground terminal 8 FLG Fault flag: open-drain PMOS output for wired-OR connection 9 GPWM Global PWM control. To be connected to LDO3 if it is not used Power Good pin. Connect to an external resistor divider to set a proper power supply 10 PG voltage threshold for detection enabling 11 OTP1/2 Digital input for internal OTP register selection 12 CS Chip-select and power supply (15 V) for OTP burning 13 to 24 OUT0 to OUT11 Output terminals (low-side current generators) Exposed pad(1) - Additional device ground terminal to be connected to pin 7 (GND) 1. The device exposed pad must be connected to GND, moreover it should be soldered directly to a PCB copper area to maximize thermal dissipation.
DS12631
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Rev 4 page 2/69
Document Outline 1 Pin description 2 Absolute maximum ratings 3 Thermal characteristics 4 Electrical characteristics 4.1 Switching characteristics 5 Device pin functions 6 Driver dropout voltage 7 Device functional description 8 Error detection 9 Gradual output delay 10 Thermal warning and protection 11 Device local dimming function 12 Local dimming non-linear step table 13 Register descriptions 13.1 BDM_conf_1 / Enable_CH_1 register 13.2 BDM_conf_2 / Enable_CH_2 register 13.3 BDM_status register 13.4 Faulty_ch_1 register 13.5 Faulty_ch_2 register 13.6 PWM_gain_x register 13.7 LDD register (LED driver device versioning) 13.8 OTP/SAM_conf_1_2 register 13.9 OTP/SAM_conf_1 register 13.10 OTP/SAM_conf_2 register 13.11 OTP/BA_n_SAM_setting register 14 I²C bus operations 14.1 I²C main concepts 15 I²C addressing for the ALED1262ZT 16 I²C selectable Hamming (8, 4) encoding 17 Message structure 17.1 Available commands 17.2 Pattern symbols 17.3 Write operations 17.3.1 BDM configuration register write 17.3.2 FAULTY_ch1[7] bit register write (prescaler) 17.3.3 PWM_gain_x register write 17.3.4 BDM_conf and PWM_gain_x register write 17.3.5 Direct write on registers 17.4 Read operations 17.4.1 Status register 17.4.2 Faulty_ch registers 17.4.3 PWM_gain_x registers 17.4.4 BDM_conf, status, Faulty_ch, PWM_gain_x registers 17.4.5 Direct read from registers 18 OTP operations 18.1 OTP emulate 18.2 OTP burn 18.3 OTP read 19 I²C communication examples 19.1 Communication without parity detection 19.1.1 OTP burning with double zap and read back 19.1.2 All LEDs with power-ON 19.1.3 110 Hz dimming prescaler bit 19.1.4 All LEDs with PWM dimming at 50% (full configuration) 19.1.5 Device status read back 19.1.6 Device full status read back 19.1.7 LDD read back (device identifier) 19.2 Communication with parity detection 19.2.1 All LEDs with power-ON 20 LED supply voltage 21 Higher current requests (outputs in parallel) 22 PCB layout and external component guidelines 22.1 Signal integrity and EMI radiated/conducted immunity 22.2 Radiated emission reduction (EMI) 22.3 Device thermal management 22.4 PCB layout example 23 Package information 23.1 HTSSOP24 exposed pad package information Revision history
ALED1262ZT Pin description 1 Pin description Figure 1. HTSSOP24 pinout Table 1. Pin description HTSSOP24 Symbol Name and function
1 VDDD Digital supply terminal 2 SDA I²C serial data input terminal 3 SCL I²C clock input terminal 4 VDDA Analog supply terminal and internal LDO input 5 LDO3 3.3 V internal LDO output 6 R-EXT Terminal for external resistor for constant current programming 7 GND Ground terminal 8 FLG Fault flag: open-drain PMOS output for wired-OR connection 9 GPWM Global PWM control. To be connected to LDO3 if it is not used Power Good pin. Connect to an external resistor divider to set a proper power supply 10 PG voltage threshold for detection enabling 11 OTP1/2 Digital input for internal OTP register selection 12 CS Chip-select and power supply (15 V) for OTP burning 13 to 24 OUT0 to OUT11 Output terminals (low-side current generators) Exposed pad(1) - Additional device ground terminal to be connected to pin 7 (GND) 1. The device exposed pad must be connected to GND, moreover it should be soldered directly to a PCB copper area to maximize thermal dissipation.
DS12631
-
Rev 4 page 2/69
Document Outline 1 Pin description 2 Absolute maximum ratings 3 Thermal characteristics 4 Electrical characteristics 4.1 Switching characteristics 5 Device pin functions 6 Driver dropout voltage 7 Device functional description 8 Error detection 9 Gradual output delay 10 Thermal warning and protection 11 Device local dimming function 12 Local dimming non-linear step table 13 Register descriptions 13.1 BDM_conf_1 / Enable_CH_1 register 13.2 BDM_conf_2 / Enable_CH_2 register 13.3 BDM_status register 13.4 Faulty_ch_1 register 13.5 Faulty_ch_2 register 13.6 PWM_gain_x register 13.7 LDD register (LED driver device versioning) 13.8 OTP/SAM_conf_1_2 register 13.9 OTP/SAM_conf_1 register 13.10 OTP/SAM_conf_2 register 13.11 OTP/BA_n_SAM_setting register 14 I²C bus operations 14.1 I²C main concepts 15 I²C addressing for the ALED1262ZT 16 I²C selectable Hamming (8, 4) encoding 17 Message structure 17.1 Available commands 17.2 Pattern symbols 17.3 Write operations 17.3.1 BDM configuration register write 17.3.2 FAULTY_ch1[7] bit register write (prescaler) 17.3.3 PWM_gain_x register write 17.3.4 BDM_conf and PWM_gain_x register write 17.3.5 Direct write on registers 17.4 Read operations 17.4.1 Status register 17.4.2 Faulty_ch registers 17.4.3 PWM_gain_x registers 17.4.4 BDM_conf, status, Faulty_ch, PWM_gain_x registers 17.4.5 Direct read from registers 18 OTP operations 18.1 OTP emulate 18.2 OTP burn 18.3 OTP read 19 I²C communication examples 19.1 Communication without parity detection 19.1.1 OTP burning with double zap and read back 19.1.2 All LEDs with power-ON 19.1.3 110 Hz dimming prescaler bit 19.1.4 All LEDs with PWM dimming at 50% (full configuration) 19.1.5 Device status read back 19.1.6 Device full status read back 19.1.7 LDD read back (device identifier) 19.2 Communication with parity detection 19.2.1 All LEDs with power-ON 20 LED supply voltage 21 Higher current requests (outputs in parallel) 22 PCB layout and external component guidelines 22.1 Signal integrity and EMI radiated/conducted immunity 22.2 Radiated emission reduction (EMI) 22.3 Device thermal management 22.4 PCB layout example 23 Package information 23.1 HTSSOP24 exposed pad package information Revision history