HCPL-2201, HCPL-2202, HCPL-2211, HCPL-2212, HCPL-2231, HCPL-2232, HCPL-0201, HCPL-0211, HCNW2201, HCNW2211 Data Sheet Very High CMR, Wide VCC Logic Gate Optocouplers Solder Reflow Profile Recommended reflow condition as per JEDEC Standard, J-STD-020 (latest revision). Non-Halide Flux should be used. Regulatory Information The HCPL-22XX/02XX and HCNW22XX have been approved by the following organizations: UL Recognized under UL 1577, Component Recognition Program, File E55361. CSA Approved under CSA Component Acceptance Notice #5, File CA 88324. IEC/EN/DIN EN 60747-5-5 (Option 060 and HCNW only.) Insulation and Safety Related Specifications8-Pin DIPWidebody(300 Mil)SO-8(400 Mil)ParameterSymbolValueValueValueUnitConditions Minimum External Air Gap L(101) 7.1 4.9 9.6 mm Measured from input terminals to output (External Clearance) terminals, shortest distance through air. Minimum External Tracking L(102) 7.4 4.8 10.0 mm Measured from input terminals to output (External Creepage) terminals, shortest distance path along body. Minimum Internal Plastic Gap 0.08 0.08 1.0 mm Through insulation distance, conductor (Internal Clearance) to conductor, usually the direct distance between the photoemitter and photodetector inside the optocoupler cavity. Minimum Internal Tracking NA NA 4.0 mm Measured from input terminals to output (Internal Creepage) terminals, along internal cavity. Tracking Resistance CTI 200 200 200 V DIN IEC 112/VDE 0303 Part 1. (Comparative Tracking Index) Isolation Group IIIa IIIa IIIa Material Group (DIN VDE 0110, 1/89, Table 1). NOTE: Option 300 - surface mount classification is Class A in accordance with CECC 00802. Broadcom AV02-0674EN 8 Document Outline Description Features Applications Functional Diagram Selection Guide Schematic Ordering Information Package Outline Drawings 8-Pin DIP Package (HCPL-2201/02/11/12/31/32) 8-Pin DIP Package with Gull Wing Surface Mount Option 300 (HCPL-2201/02/11/12/31/32) Small-Outline SO-8 Package (HCPL-0201/11) 8-Pin Widebody DIP Package (HCNW2201/11) 8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300 (HCNW2201/11) Solder Reflow Profile Regulatory Information Insulation and Safety Related Specifications IEC/EN/DIN EN 60747-5-5 Insulation Characteristics (Option 060) IEC/EN/DIN EN 60747-5-5 Insulation Characteristics (HCNW22xx Option 060 ONLY) Absolute Maximum Ratings Recommended Operating Conditions Electrical Specifications Switching Specifications (AC) Package Characteristics