Datasheet HCPL-2201, HCPL-2202, HCPL-2211, HCPL-2212, HCPL-2231, HCPL-2232, HCPL-0201, HCPL-0211, HCNW2201, HCNW2211 (Avago Technologies) - 6
| Hersteller | Avago Technologies |
| Beschreibung | Very High CMR, Wide VCC Logic Gate Optocouplers |
| Seiten / Seite | 22 / 6 — HCPL-2201, HCPL-2202, HCPL-2211, HCPL-2212, HCPL-2231, HCPL-2232, … |
| Dateiformat / Größe | PDF / 943 Kb |
| Dokumentensprache | Englisch |
HCPL-2201, HCPL-2202, HCPL-2211, HCPL-2212, HCPL-2231, HCPL-2232, HCPL-0201, HCPL-0211, HCNW2201, HCNW2211
Modelllinie für dieses Datenblatt
- HCPL-0201 HCPL-0201#060 HCPL-0201#500 HCPL-0201#560 HCPL-0201-000E HCPL-0201-060E HCPL-0201-500E HCPL-0201-560E
- HCPL-0211 HCPL-0211#060 HCPL-0211#500 HCPL-0211#560 HCPL-0211-000E HCPL-0211-060E HCPL-0211-500E HCPL-0211-560E
- HCPL-2201 HCPL-2201#060 HCPL-2201#300 HCPL-2201#360 HCPL-2201#500 HCPL-2201#560 HCPL-2201-000E HCPL-2201-060E HCPL-2201-300E HCPL-2201-360E HCPL-2201-500E HCPL-2201-560E
- HCPL-2202 HCPL-2202#060 HCPL-2202#300 HCPL-2202#360 HCPL-2202#500 HCPL-2202#560 HCPL-2202-000E HCPL-2202-060E HCPL-2202-300E HCPL-2202-360E HCPL-2202-500E HCPL-2202-560E
- HCPL-2211 HCPL-2211#060 HCPL-2211#300 HCPL-2211#360 HCPL-2211#500 HCPL-2211#560 HCPL-2211-000E HCPL-2211-060E HCPL-2211-300E HCPL-2211-360E HCPL-2211-500E HCPL-2211-560E
- HCPL-2212 HCPL-2212#060 HCPL-2212#300 HCPL-2212#360 HCPL-2212#500 HCPL-2212#560 HCPL-2212-000E HCPL-2212-060E HCPL-2212-300E HCPL-2212-360E HCPL-2212-500E HCPL-2212-560E
Textversion des Dokuments
HCPL-2201, HCPL-2202, HCPL-2211, HCPL-2212, HCPL-2231, HCPL-2232, HCPL-0201, HCPL-0211, HCNW2201, HCNW2211
Data Sheet Very High CMR, Wide VCC Logic Gate Optocouplers
Small-Outline SO-8 Package (HCPL-0201/11) LAND PATTERN RECOMMENDATION 8 7 6 5 5.994 ± 0.203 XXX (0.236 ± 0.008) 3.937 ± 0.127 YYWW TYPE NUMBER 7.49 (0.295) (0.155 ± 0.005) (LAST 3 DIGITS) EEE DATE CODE LOT ID PIN ONE 1 2 3 4 1.9 (0.075) 0.406 ± 0.076 (0.016 ± 0.003) 1.270 BSC (0.050) 0.64 (0.025) * 5.080 ± 0.127 7o (0.200 ± 0.005) 45
°
X 0.432 (0.017) 3.175 ± 0.127 (0.125 ± 0.005) 0 ~ 7
°
1.524 0.228 ± 0.025 (0.060) (0.009 ± 0.001) 0.203 ± 0.102 * TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH) (0.008 ± 0.004) 5.207 ± 0.254 (0.205 ± 0.010) 0.305 MIN. (0.012) DIMENSIONS IN MILLIMETERS (INCHES). LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX. NOTE: FLOATING LEAD PROTRUSION IS 0.15 mm (6 mils) MAX. 8-Pin Widebody DIP Package (HCNW2201/11) 11.23 ± 0.15 11.00 MAX. (0.442 ± 0.006) (0.433) 9.00 ± 0.15 8 7 6 5 (0.354 ± 0.006) TYPE NUMBER A HCNWXXXX DATE CODE LOT ID YYWW EEE 1 2 3 4 10.16 (0.400) TYP. 1.55 (0.061) MAX. 7
°
TYP. 0.254 + 0.076 - 0.0051 (0.010 + 0.003) - 0.002) 5.10 (0.201) MAX. 3.10 (0.122) 3.90 (0.154) 0.51 (0.021) MIN. 2.54 (0.100) TYP. DIMENSIONS IN MILLIMETERS (INCHES). 1.80 ± 0.15 0.40 (0.016) (0.071 ± 0.006) 0.56 (0.022) NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
Broadcom AV02-0674EN 6 Document Outline Description Features Applications Functional Diagram Selection Guide Schematic Ordering Information Package Outline Drawings 8-Pin DIP Package (HCPL-2201/02/11/12/31/32) 8-Pin DIP Package with Gull Wing Surface Mount Option 300 (HCPL-2201/02/11/12/31/32) Small-Outline SO-8 Package (HCPL-0201/11) 8-Pin Widebody DIP Package (HCNW2201/11) 8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300 (HCNW2201/11) Solder Reflow Profile Regulatory Information Insulation and Safety Related Specifications IEC/EN/DIN EN 60747-5-5 Insulation Characteristics (Option 060) IEC/EN/DIN EN 60747-5-5 Insulation Characteristics (HCNW22xx Option 060 ONLY) Absolute Maximum Ratings Recommended Operating Conditions Electrical Specifications Switching Specifications (AC) Package Characteristics
Data Sheet Very High CMR, Wide VCC Logic Gate Optocouplers
Small-Outline SO-8 Package (HCPL-0201/11) LAND PATTERN RECOMMENDATION 8 7 6 5 5.994 ± 0.203 XXX (0.236 ± 0.008) 3.937 ± 0.127 YYWW TYPE NUMBER 7.49 (0.295) (0.155 ± 0.005) (LAST 3 DIGITS) EEE DATE CODE LOT ID PIN ONE 1 2 3 4 1.9 (0.075) 0.406 ± 0.076 (0.016 ± 0.003) 1.270 BSC (0.050) 0.64 (0.025) * 5.080 ± 0.127 7o (0.200 ± 0.005) 45
°
X 0.432 (0.017) 3.175 ± 0.127 (0.125 ± 0.005) 0 ~ 7
°
1.524 0.228 ± 0.025 (0.060) (0.009 ± 0.001) 0.203 ± 0.102 * TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH) (0.008 ± 0.004) 5.207 ± 0.254 (0.205 ± 0.010) 0.305 MIN. (0.012) DIMENSIONS IN MILLIMETERS (INCHES). LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX. NOTE: FLOATING LEAD PROTRUSION IS 0.15 mm (6 mils) MAX. 8-Pin Widebody DIP Package (HCNW2201/11) 11.23 ± 0.15 11.00 MAX. (0.442 ± 0.006) (0.433) 9.00 ± 0.15 8 7 6 5 (0.354 ± 0.006) TYPE NUMBER A HCNWXXXX DATE CODE LOT ID YYWW EEE 1 2 3 4 10.16 (0.400) TYP. 1.55 (0.061) MAX. 7
°
TYP. 0.254 + 0.076 - 0.0051 (0.010 + 0.003) - 0.002) 5.10 (0.201) MAX. 3.10 (0.122) 3.90 (0.154) 0.51 (0.021) MIN. 2.54 (0.100) TYP. DIMENSIONS IN MILLIMETERS (INCHES). 1.80 ± 0.15 0.40 (0.016) (0.071 ± 0.006) 0.56 (0.022) NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
Broadcom AV02-0674EN 6 Document Outline Description Features Applications Functional Diagram Selection Guide Schematic Ordering Information Package Outline Drawings 8-Pin DIP Package (HCPL-2201/02/11/12/31/32) 8-Pin DIP Package with Gull Wing Surface Mount Option 300 (HCPL-2201/02/11/12/31/32) Small-Outline SO-8 Package (HCPL-0201/11) 8-Pin Widebody DIP Package (HCNW2201/11) 8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300 (HCNW2201/11) Solder Reflow Profile Regulatory Information Insulation and Safety Related Specifications IEC/EN/DIN EN 60747-5-5 Insulation Characteristics (Option 060) IEC/EN/DIN EN 60747-5-5 Insulation Characteristics (HCNW22xx Option 060 ONLY) Absolute Maximum Ratings Recommended Operating Conditions Electrical Specifications Switching Specifications (AC) Package Characteristics