link to page 3 link to page 3 link to page 3 link to page 3 link to page 3 HCPL-2201, HCPL-2202, HCPL-2211, HCPL-2212, HCPL-2231, HCPL-2232, HCPL-0201, HCPL-0211, HCNW2201, HCNW2211 Data Sheet Very High CMR, Wide VCC Logic Gate Optocouplers Selection GuideSmall OutlineWidebodyMinimum CMR Input8-Pin DIP (300 Mil)SO-8(400 Mil)HermeticdV/dtVCMOn Current Single ChannelDual Channel Single Channel Single ChannelSingle and Dual(V/μs)(V)(mA)PackagePackagePackagePackageChannel Packages 1,000 50 1.6 HCPL-2200a,b HCPL-0201 HCNW2201 HCPL-2201 HCPL-2202 1.8 HCPL-2231 2,500 400 1.6 HCPL-2219a,b 5,000c 300c 1.6 HCPL-2211 HCPL-0211 HCNW2211 HCPL-2212 1.8 HCPL-2232 1,000 50 2.0 HCPL-52XXb HCPL-62XXb a. HCPL-2200/2219 devices include output enable/disable function. b. Technical data for the HCPL-2200/2219, HCPL-52XX, and HCPL-62XX are on separate Broadcom publications. c. Minimum CMR of 10 kV/μs with VCM = 1000V can be achieved with input current, IF, of 5 mA. SchematicICCVCC8IF1IO11+VO1V7IF1CCV–CC82ISHIELDFIO2+VOVF– 3IO2GND3–VSHIELD5O26VF2HCPL-2201/02/11/12+HCPL-0201/114 IF2HCNW2201/11GNDSHIELD5HCPL-2231/32 Broadcom AV02-0674EN 3 Document Outline Description Features Applications Functional Diagram Selection Guide Schematic Ordering Information Package Outline Drawings 8-Pin DIP Package (HCPL-2201/02/11/12/31/32) 8-Pin DIP Package with Gull Wing Surface Mount Option 300 (HCPL-2201/02/11/12/31/32) Small-Outline SO-8 Package (HCPL-0201/11) 8-Pin Widebody DIP Package (HCNW2201/11) 8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300 (HCNW2201/11) Solder Reflow Profile Regulatory Information Insulation and Safety Related Specifications IEC/EN/DIN EN 60747-5-5 Insulation Characteristics (Option 060) IEC/EN/DIN EN 60747-5-5 Insulation Characteristics (HCNW22xx Option 060 ONLY) Absolute Maximum Ratings Recommended Operating Conditions Electrical Specifications Switching Specifications (AC) Package Characteristics