Datasheet ADXL1005 (Analog Devices) - 4

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ADXL1005 Data Sheet ABSOLUTE MAXIMUM RATINGS Table 2. Table 4. Recommended Soldering Profile Parameter Rating Condition
Acceleration
Profile Feature Sn63/Pb37 Pb-Free
Mechanical Shock: Any Axis, Powered 10,000 g Average Ramp Rate (TL to TP) 3°C/sec 3°C/sec or Unpowered per IEC 60068-2-27 maximum maximum Drop Test (Concrete Surface), per 1.2 m Preheat AEC-Q100 Test G5 Minimum Temperature (TSMIN) 100°C 150°C V Maximum Temperature (TSMAX) 150°C 200°C DD −0.3 V to +5.5 V Output Short-Circuit Duration Indefinite Time (TSMIN to TSMAX)(tS) 60 sec to 60 sec to 120 sec 180 sec (Any Pin to Common Ground) T Temperature Range (Storage) −55°C to +150°C SMAX to TL Ramp-Up Rate 3°C/sec 3°C/sec Stresses at or above those listed under Absolute Maximum maximum maximum Ratings may cause permanent damage to the product. This is a Time Maintained Above stress rating only; functional operation of the product at these Liquidous (TL) or any other conditions above those indicated in the operational Liquidous Temperature (TL) 183°C 217°C section of this specification is not implied. Operation beyond Time (tL) 60 sec to 60 sec to 150 sec 150 sec the maximum operating conditions for extended periods may Peak Temperature (TP) 240 + 0/−5°C 260 + 0/−5°C affect product reliability. Time Within 5°C of Actual Peak 10 sec to 20 sec to
THERMAL RESISTANCE
Temperature (tP) 30 sec 40 sec Ramp-Down Rate 6°C/sec 6°C/sec Thermal performance is directly linked to printed circuit board maximum maximum (PCB) design and operating environment. Careful attention to Time 25°C to Peak Temperature 6 min 8 min PCB thermal design is required. (t25°C) maximum maximum θJA is the natural convection junction to ambient thermal resistance measured in a one cubic foot sealed enclosure.
ESD CAUTION
θJC is the junction to case thermal resistance.
Table 3. Package Characteristics Package Type θJA θJC Device Weight
CP-32-261 48°C/W 14.1°C/W <0.2 g 1 Thermal impedance simulated values are based on a JEDEC 2S2P thermal test board with nine thermal vias. See JEDEC JESD51.
RECOMMENDED SOLDERING PROFILE
Figure 2 and Table 4 provide details about the recommended soldering profile.
CRITICAL ZONE tP TL TO TP TP RAMP-UP E TL T tL UR SMAX AT R E TSMIN P M E T tS PREHEAT RAMP-DOWN t25°C TO PEAK
002
TIME
16589- Figure 2. Recommended Soldering Profile Rev. 0 | Page 4 of 14 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE RECOMMENDED SOLDERING PROFILE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION MECHANICAL DEVICE OPERATION OPERATING MODES Measure Mode Standby Mode BANDWIDTH APPLICATIONS INFORMATION APPLICATION CIRCUIT ON DEMAND SELF TEST RATIOMETRIC OUTPUT VOLTAGE INTERFACING ANALOG OUTPUT BELOW 10 kHz INTERFACING ANALOG OUTPUT BEYOND 10 kHz OVERRANGE MECHANICAL CONSIDERATIONS FOR MOUNTING LAYOUT AND DESIGN RECOMMENDATIONS OUTLINE DIMENSIONS ORDERING GUIDE