Datasheet DA9121 (Dialog Semiconductor) - 20

DA9121 High-Performance, 10 A, Dual-Phase DC-DC Converter 4.1.6 Thermal Protection
DA9121 is protected from internal overheating by thermal shutdown. There are two kinds of flags concerning thermal protection, thermal warning and thermal critical. The warning flag is asserted when TJ > TWARN and the critical flag is asserted when TJ > TCRIT. When the critical flag is asserted, Buck1 is shut down immediately.
Table 12: Thermal Protection Control Registers Category Register name Description
TEMP_WARN Asserted as long as the thermal warning threshold is reached Status TEMP_CRIT Asserted as long as the thermal shutdown threshold is reached E_TEMP_WARN TEMP_WARN caused event IRQ event E_TEMP_CRIT TEMP_CRIT caused event M_TEMP_WARN TEMP_WARN event IRQ mask IRQ mask M_TEMP_CRIT TEMP_CRIT event IRQ mask M_VR_HOT TEMP_WARN status IRQ mask
Buck1 Shutdown IRQ IRQ
TCRIT TWARN Junction Temperature Warning Flag Critical Flag I2C Bus Write 1 to CH<x>_EN Buck Enable
Figure 15: Thermal Protection Operation Datasheet Revision 2.0 18-Jul-2019
CFR0011-120-00 20 of 47 © 2019 Dialog Semiconductor Document Outline General Description Key Features Applications System Diagrams Contents 1 Terms and Definitions 2 Pinout 3 Characteristics 3.1 Absolute Maximum Ratings 3.2 Recommended Operating Conditions 3.3 Thermal Characteristics 3.3.1 Thermal Ratings 3.3.2 Power Dissipation 3.4 ESD Characteristics 3.5 Buck Characteristics 3.6 Performance and Supervision Characteristics 3.7 Digital IO Characteristics 3.8 Timing Characteristics 3.9 Typical Performance 4 Functional Description 4.1 DC-DC Buck Converter 4.1.1 Switching Frequency 4.1.2 Operation Modes and Phase Selection 4.1.3 Output Voltage Selection 4.1.4 Soft Start-Up and Shutdown 4.1.5 Current Limit 4.1.6 Thermal Protection 4.2 Internal Circuits 4.2.1 IC_EN/Chip Enable/Disable 4.2.2 nIRQ/Interrupt 4.2.3 GPIO 4.2.3.1 GPIO Pin Assignment 4.2.3.2 GPIO Function 4.2.3.3 Chip Configuration Select (CONF) 4.3 Operating Modes 4.3.1 ON 4.3.2 OFF 4.4 I2C Communication 4.4.1 I2C Protocol 5 Register Definitions 5.1 Register Map 5.1.1 System 5.1.2 Buck1 5.1.3 Serialization 6 Package Information 6.1 Package Outlines 6.2 Moisture Sensitivity Level 6.3 WLCSP Handling 6.4 Soldering Information 7 Ordering Information 8 Application Information 8.1 Capacitor Selection 8.2 Inductor Selection