Datasheet LTC7150S, LTC7150S-4 (Analog Devices) - 2

HerstellerAnalog Devices
Beschreibung20V, 20A Synchronous Step-Down Regulator
Seiten / Seite22 / 2 — ABSOLUTE MAXIMUM RATINGS. PIN CONFIGURATION. (Note 1). ORDER INFORMATION. …
RevisionB
Dateiformat / GrößePDF / 2.4 Mb
DokumentenspracheEnglisch

ABSOLUTE MAXIMUM RATINGS. PIN CONFIGURATION. (Note 1). ORDER INFORMATION. PART MARKING*. PACKAGE. MSL. TEMPERATURE RANGE. PART NUMBER

ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION (Note 1) ORDER INFORMATION PART MARKING* PACKAGE MSL TEMPERATURE RANGE PART NUMBER

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LTC7150S/LTC7150S-4
ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION (Note 1)
PVIN, SVIN ... –0.3V to 22V RUN Voltage... –0.3V to SV TOP VIEW IN MODE/SYNC, TRACK/SS Voltage ...–0.3V to INTV 1 2 3 4 5 6 CC RT ITH FB V – PGOOD ITH, RT, PGOOD Voltage ... –0.3V to 3.6V OUT PHMODE A PHMODE, CLK Voltage .. –0.3V to 3.6V CLKOUT RUN M/S TRACK/SS SGND INTVCC B V – SVIN PVIN SW SW PVIN PVIN OUT Voltage ... –0.3V to 0.3V C FB Voltage ... –0.3V to 3.6V PVIN PVIN SW SW PVIN PVIN D Operating Junction Temperature Range PGND PGND SW SW PGND PGND LTC7150SE .. –40°C to 125°C E PGND PGND SW SW PGND PGND LTC7150SI ... –40°C to 125°C F PGND PGND SW SW PGND PGND LTC7150S-4J ... –40°C to 150°C G Storage Temperature Range .. –65°C to 150°C Maximum Internal Temperature .. 125°C BGA PACKAGE 42-LEAD (6mm × 5mm × 1.30mm) Peak Reflow Solder Body Temperature ...260°C θJA = 21°C/W
ORDER INFORMATION PART MARKING* PACKAGE MSL TEMPERATURE RANGE PART NUMBER PAD OR BALL FINISH DEVICE FINISH CODE TYPE RATING (SEE NOTE 2)
LTC7150SEY#PBF 7150S –40°C to 125°C LTC7150SIY#PBF SAC305 (RoHS) e1 BGA 3 LTC7150SJY-4#PBF 7150S4 –40°C to 150°C
AUTOMOTIVE PRODUCTS**
LTC7150SJY-4#WPBF SAC305 (RoHS) 7150S4 e1 BGA 3 –40°C to 150°C • Contact the factory for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Pad or ball finish code is per IPC/JEDEC J-STD-609. Procedures • This product is not recommended for second side reflow. see BGA • LGA and BGA Package and Tray Drawings Assembly and Manufacturing Procedures) • This product is moisture sensitive (see BGA Assembly and Manufacturing Procedures).
**
Versions of this part are available with controlled manufacturing to support the quality and reliability requirements of automotive applications. These models are designated with a #W suffix. Only the automotive grade products shown are available for use in automotive applications. Contact your local Analog Devices account representative for specific product ordering information and to obtain the specific Automotive Reliability reports for these models. Rev. B 2 For more information www.analog.com Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Pin Configuration Electrical Characteristics Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Typical Applications Package Photo Revision History Typical Application Related Parts