Datasheet VM3000 (Vesper) - 8

HerstellerVesper
BeschreibungLow Noise PDM Digital Bottom Port Piezoelectric MEMS Microphone
Seiten / Seite12 / 8 — VM3000. PRELIMINARY DATASHEET. Parameter. Conditions. Min. Typ. Max. …
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DokumentenspracheEnglisch

VM3000. PRELIMINARY DATASHEET. Parameter. Conditions. Min. Typ. Max. Units. TYPICAL PERFORMANCE CHARACTERISTICS. SOLDER REFLOW PROFILE

VM3000 PRELIMINARY DATASHEET Parameter Conditions Min Typ Max Units TYPICAL PERFORMANCE CHARACTERISTICS SOLDER REFLOW PROFILE

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VM3000
Low Noise PDM Digital Bottom Port Piezoelectric MEMS Microphone
PRELIMINARY DATASHEET Parameter Conditions Min. Typ. Max. Units
TCLK CLK period 303 3636 nS TRISE CLK Rise Time (10%-90% level) 25 nS TFALL CLK Fall Time (90%-10% level) 25 nS TLOUTEN DATA L driven after fal ing CLK edge 31 48 80 nS TLOUTDIS DATA L disabled after rising CLK edge 9 17 30 nS TROUTEN DATA R driven after rising CLK edge 31 48 80 nS TROUTDIS DATA L disabled after fal ing CLK edge 9 17 30 nS
TYPICAL PERFORMANCE CHARACTERISTICS
Normalized Frequency Response
SOLDER REFLOW PROFILE
Figure 6: Solder Reflow Profile Document Name: VM3000_Datasheet Page 8 of 12 Vesper reserves the right to alter the datasheet specifications Revision: U0.0.0 without notification. Vesper assumes no liability for the use of engineering samples and offers no warranty for this product. info@vespermems.com Document Outline GENERAL DESCRIPTION FEATURES APPLICATIONS ORDERING INFORMATION BLOCK DIAGRAM TYPICAL APPLICATION CIRCUIT TABLE OF CONTENTS SPECIFICATIONS PDM DIGITAL SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ENVIRONMENTAL ROBUSTNESS RELIABILITY SPECIFCATIONS MICROPHONE OPERATION MICROPHONE MODES TIMING SPECIFICATIONS TYPICAL PERFORMANCE CHARACTERISTICS SOLDER REFLOW PROFILE HANDLING INSTRUCTIONS DIMENSIONS AND PIN LAYOUT PCB DESIGN AND LAND PATTERN LAYOUT TAPE AND REEL SPECIFICATIONS LID MARKING SUPPORTING DOCUMENTS COMPLIANCE INFORMATION CONTACT DETAILS LEGAL INFORMATION REVISION HISTORY