Datasheet BAT41 (STMicroelectronics)
| Hersteller | STMicroelectronics |
| Beschreibung | 100 V, 200 mA Surface Mount General Purpose Signal Schottky Diode |
| Seiten / Seite | 12 / 1 — BAT41. Features. BAT41ZFILM. (Single). SOD-123. BAT41JFILM. Description. … |
| Dateiformat / Größe | PDF / 149 Kb |
| Dokumentensprache | Englisch |
BAT41. Features. BAT41ZFILM. (Single). SOD-123. BAT41JFILM. Description. SOD-323. BAT41KFILM. SOD-523. BAT41WFILM (Single)
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BAT41
Low capacitance small signal Schottky diodes
Features
■ Low leakage current losses
BAT41ZFILM
■
(Single)
Negligible switching losses ■ Low forward and reverse recovery times
SOD-123
■ Extremely fast switching ■ Surface mount device
BAT41JFILM
■ Low capacitance diode
(Single) Description SOD-323
The BAT41 series uses 100 V Schottky barrier diodes packaged in SOD-123, SOD-323,
BAT41KFILM
SOD-523, SOT-323, or SOT-666. This series is
(Single)
specially suited for switching mode with low IR losses
SOD-523 BAT41WFILM (Single) BAT41CWFILM (Common cathode) SOT-323 BAT41AWFILM (Common anode) BAT41SWFILM (Series) BAT41-07P6FILM Table 1. Device summary (2 parallel diodes) Symbol Value BAT41-09P6FILM
I
SOT-666
F 200 mA
(2 opposite diodes)
VRRM 100 V C(typ) 3 pF
Configurations in top view
Tj (max) 150 °C October 2009 Doc ID 12633 Rev 2 1/12 www.st.com 12 Document Outline Table 1. Device summary 1 Characteristics Table 2. Absolute ratings (limiting values at Tj = 25 ˚C, unless otherwise specified) Table 3. Thermal parameters Table 4. Static electrical characteristics Table 5. Dynamic characteristics Figure 1. Average forward power dissipation versus average forward current Figure 2. Average forward current versus ambient temperature (d = 1) Figure 3. Reverse leakage current versus reverse applied voltage (typical values) Figure 4. Reverse leakage current versus junction temperature (typical values) Figure 5. Junction capacitance versus reverse applied voltage (typical values) Figure 6. Forward voltage drop versus forward current (typical values) Figure 7. Forward voltage drop versus forward current (typical values) Figure 8. Variation of thermal impedance junction to ambient versus pulse duration Figure 9. Relative variation of thermal impedance junction to ambient versus pulse duration Figure 10. Relative variation of thermal impedance junction to ambient versus pulse duration Figure 11. Thermal resistance junction to ambient versus copper surface under each lead 2 Ordering information scheme Figure 12. Ordering information scheme 3 Package information Table 6. SOD-123 dimensions Figure 13. SOD-123 footprint (dimensions in mm) Table 7. SOD-323 dimensions Figure 14. SOD-323 footprint (dimensions in mm) Table 8. SOD-523 dimensions Figure 15. SOD-523 footprint (dimensions in mm) Table 9. SOT-323 dimensions Figure 16. SOT-323 footprint (dimensions in mm) Table 10. SOT-666 dimensions Figure 17. SOT-666 footprint (dimensions in mm) 4 Ordering information Table 11. Ordering information 5 Revision history Table 12. Document revision history
Low capacitance small signal Schottky diodes
Features
■ Low leakage current losses
BAT41ZFILM
■
(Single)
Negligible switching losses ■ Low forward and reverse recovery times
SOD-123
■ Extremely fast switching ■ Surface mount device
BAT41JFILM
■ Low capacitance diode
(Single) Description SOD-323
The BAT41 series uses 100 V Schottky barrier diodes packaged in SOD-123, SOD-323,
BAT41KFILM
SOD-523, SOT-323, or SOT-666. This series is
(Single)
specially suited for switching mode with low IR losses
SOD-523 BAT41WFILM (Single) BAT41CWFILM (Common cathode) SOT-323 BAT41AWFILM (Common anode) BAT41SWFILM (Series) BAT41-07P6FILM Table 1. Device summary (2 parallel diodes) Symbol Value BAT41-09P6FILM
I
SOT-666
F 200 mA
(2 opposite diodes)
VRRM 100 V C(typ) 3 pF
Configurations in top view
Tj (max) 150 °C October 2009 Doc ID 12633 Rev 2 1/12 www.st.com 12 Document Outline Table 1. Device summary 1 Characteristics Table 2. Absolute ratings (limiting values at Tj = 25 ˚C, unless otherwise specified) Table 3. Thermal parameters Table 4. Static electrical characteristics Table 5. Dynamic characteristics Figure 1. Average forward power dissipation versus average forward current Figure 2. Average forward current versus ambient temperature (d = 1) Figure 3. Reverse leakage current versus reverse applied voltage (typical values) Figure 4. Reverse leakage current versus junction temperature (typical values) Figure 5. Junction capacitance versus reverse applied voltage (typical values) Figure 6. Forward voltage drop versus forward current (typical values) Figure 7. Forward voltage drop versus forward current (typical values) Figure 8. Variation of thermal impedance junction to ambient versus pulse duration Figure 9. Relative variation of thermal impedance junction to ambient versus pulse duration Figure 10. Relative variation of thermal impedance junction to ambient versus pulse duration Figure 11. Thermal resistance junction to ambient versus copper surface under each lead 2 Ordering information scheme Figure 12. Ordering information scheme 3 Package information Table 6. SOD-123 dimensions Figure 13. SOD-123 footprint (dimensions in mm) Table 7. SOD-323 dimensions Figure 14. SOD-323 footprint (dimensions in mm) Table 8. SOD-523 dimensions Figure 15. SOD-523 footprint (dimensions in mm) Table 9. SOT-323 dimensions Figure 16. SOT-323 footprint (dimensions in mm) Table 10. SOT-666 dimensions Figure 17. SOT-666 footprint (dimensions in mm) 4 Ordering information Table 11. Ordering information 5 Revision history Table 12. Document revision history