Datasheet NCD2400M (IXYS) - 7

HerstellerIXYS
BeschreibungWide Capacitance Range, Non-volatileDigital Programmable Capacitor
Seiten / Seite22 / 7 — NCD2400M. Figure 2: Series Capacitance vs. Frequency for Code 64 to Code …
Dateiformat / GrößePDF / 414 Kb
DokumentenspracheEnglisch

NCD2400M. Figure 2: Series Capacitance vs. Frequency for Code 64 to Code 511. Capacitance vs. Frequency. Code 64 to Code 511

NCD2400M Figure 2: Series Capacitance vs Frequency for Code 64 to Code 511 Capacitance vs Frequency Code 64 to Code 511

Modelllinie für dieses Datenblatt

Textversion des Dokuments

INTEGRATED CIRCUITS DIVISION
NCD2400M Figure 2: Series Capacitance vs. Frequency for Code 64 to Code 511 Capacitance vs. Frequency Code 64 to Code 511
250 C511 200 150 C256 100 C
Capacitance (pF)
128 50 C64 0 0 20 40 60 80 100 120
Frequency (MHz) Figure 3: Series Capacitance vs. Frequency for Code 0 to Code 64 Capacitance vs. Frequency Code 0 to Code 64
30 C64 20 C32 C16 10 C8
Capacitance (pF)
C4 C2 C1 C0 0 0 20 40 60 80 100 120
Frequency (MHz)
R01
www.ixysic.com
7 Document Outline Features Applications Description 1. Specifications 1.1 Package Pinout 1.2 Pin Descriptions 1.3 Absolute Maximum Ratings 1.4 Recommended Operating Conditions 1.5 ESD Rating 1.6 General Conditions for Electrical Characteristics 1.7 Capacitor Electrical Characteristics 1.8 Digital Interface: Electrical Characteristics of SDA and SCL 1.9 Digital Interface: AC Characteristics 1.10 Power Supply 2. Performance Data 3. Functional Description 3.1 Introduction 3.2 Capacitive Digital to Analog Converter (CDAC) 3.3 Non-Volatile Memory Configuration 3.4 Device Address 3.5 Operating Modes 3.5.1 Volatile Mode 3.5.2 Non-Volatile Mode 3.6 I2C Serial Interface 3.6.1 Write Commands 3.6.2 Write Volatile Register Operation 3.6.3 Write Non-Volatile Memory Operation 3.6.4 Read Operation 3.6.5 Set Non-Volatile Mode Operation 3.6.6 Electrical and Timing Considerations 3.6.7 Application Diagrams 3.7 Capacitor Interface Electrical and Biasing Considerations 4. Capacitance Determination and Programming Procedure 5. Manufacturing Information 5.1 Moisture Sensitivity 5.2 ESD Sensitivity 5.3 Soldering Profile 5.4 Board Wash 5.5 Mechanical Dimensions 5.5.1 Package Dimensions 5.5.2 Tape & Reel Specification