Datasheet ZSSC4175D-01 (IDT) - 10

link to page 10 ZSSC4175D-01 Datasheet
No. Symbol Parameter Conditions Min Typ Max Unit 5.6 System Response
DP_010 tSTARTUP[a] Startup time Time to first valid output after power-on; 5 20 ms VDDE slew rate > 0.1V/µs. DP_011 OUR [a] Output update rate ZSSC4175D-01 internal output update, 2 3 ms asynchronous to SENT transmission. DP_012 ORT [a] Output response time 100% input step, tTICK = 3µs, 2 10 ms SENT pause = on, minimum. DP_013 DTI [a] Diagnostic testing interval 16 20 ms DP_014 FRT [a] Failure reaction time Time between failure detection and reaction 25 ms inside the IC. DP_015 FMT [a] Failure messaging time Time between occurrence of an failure 15 70 ms event and reporting on SENT output (with one failure confirmation and 3µs tick time). [a] No measurement in mass production; parameter is guaranteed by design and/or quality observation. [b] The temperature sensor range is the calibration target for the SENT output of the SDM temperature channels. This target can be adjusted. [c] Compliant to SENT – SAEJ2716 APR2016 (Rev. 4). Sent – SAEJ2716 JAN2010 (Rev. 3) specifies maximum jitter of 50ns at tick time = 3µs and maximum jitter of 250ns at tick time = 10µs without any sigma limitation. [d] Refer National Institute of Standards and Technology (NIST) for calibration table for n-type thermocouples as an example. [e] RISO is measured indirectly by current and has a limited SENT output update rate. © 2019 Integrated Device Technology, Inc. 10 June 7, 2019 Document Outline 1. Pin Assignments 2. Pin Descriptions 3. Absolute Maximum Ratings 4. Operating Conditions 5. Electrical Characteristics 6. Interface Characteristics and Nonvolatile Memory 7. Circuit Description 7.1 General Operation Description 7.2 Signal Path 7.3 Signal Conditioning 7.3.1 Thermocouple Sensor Signal Conditioning 7.3.2 Internal Temperature Sensor Signal Conditioning 7.4 Analog Front-End 7.4.1 Overview 7.4.2 SCCM 7.4.3 Input Multiplexer 7.4.4 Programmable Gain Amplifier 7.4.5 Analog-to-Digital Converter 7.5 Signal Measurement 7.5.1 Thermocouple Element Measurement 7.5.2 Internal Temperature Measurement 7.5.3 Isolation Conductance Measurement (Giso) 7.5.4 Thermocouple Resistor Measurement (Ropen) 7.5.5 Measurement Cycle 7.6 SENT Output 7.6.1 Overview 7.6.2 SENT Fast Channel Modes and Frame Format 7.6.3 SENT SDM Channel Modes 7.6.4 SENT Output Operation Modes 7.6.5 SENT Pulse Shaping 7.7 NVM OEM Data Memory 7.8 Over-Voltage and Short-Circuit Protection 8. Fault-Safe Operation 8.1 Fault-Safe Operation Modes 8.2 Fault Messaging 8.2.1 Overview 8.2.2 SENT Fast Channel Fault Codes 8.2.3 SENT Status Bits 8.2.4 SENT SDM Channel Status Codes 8.2.5 Timing Definitions 9. Fault Checks 9.1 Overview 9.2 Hardware Fault Checks 9.3 Application Monitors 9.4 Transmission Fault Checks 10. Application Circuit and External Components 11. ESD Protection and EMC Specification 11.1 ESD Protection 11.2 Electromagnetic Emission 11.3 Conducted Susceptibility (DPI) 12. Reliability and RoHS Conformity 13. Package Outline Drawings 14. Marking Diagram 15. Glossary 16. Ordering Information 17. Revision History