Datasheet BC846DS (NXP) - 9
| Hersteller | NXP |
| Beschreibung | 65 V, 100 mA NPN/NPN general-purpose transistor pair |
| Seiten / Seite | 12 / 9 — NXP Semiconductors. BC846DS. 65 V, 100 mA NPN/NPN general-purpose … |
| Dateiformat / Größe | PDF / 105 Kb |
| Dokumentensprache | Englisch |
NXP Semiconductors. BC846DS. 65 V, 100 mA NPN/NPN general-purpose transistor. 11. Soldering
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NXP Semiconductors BC846DS 65 V, 100 mA NPN/NPN general-purpose transistor 11. Soldering
3.45 1.95 0.45 0.55 solder lands 0.95 (6×) (6×) 3.3 2.825 solder resist 0.95 solder paste occupied area 0.7 Dimensions in mm (6×) 0.8 (6×) 2.4 sot457_fr
Fig 12. Reflow soldering footprint SOT457 (SC-74)
5.3 1.5 (4×) solder lands 1.475 solder resist 0.45 5.05 (2×) occupied area 1.475 Dimensions in mm preferred transport direction during soldering 1.45 (6×) 2.85 sot457_fw
Fig 13. Wave soldering footprint SOT457 (SC-74)
BC846DS_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 17 July 2009 9 of 12
Document Outline 1. Product profile 1.1 General description 1.2 Features 1.3 Applications 1.4 Quick reference data 2. Pinning information 3. Ordering information 4. Marking 5. Limiting values 6. Thermal characteristics 7. Characteristics 8. Test information 8.1 Quality information 9. Package outline 10. Packing information 11. Soldering 12. Revision history 13. Legal information 13.1 Data sheet status 13.2 Definitions 13.3 Disclaimers 13.4 Trademarks 14. Contact information 15. Contents
3.45 1.95 0.45 0.55 solder lands 0.95 (6×) (6×) 3.3 2.825 solder resist 0.95 solder paste occupied area 0.7 Dimensions in mm (6×) 0.8 (6×) 2.4 sot457_fr
Fig 12. Reflow soldering footprint SOT457 (SC-74)
5.3 1.5 (4×) solder lands 1.475 solder resist 0.45 5.05 (2×) occupied area 1.475 Dimensions in mm preferred transport direction during soldering 1.45 (6×) 2.85 sot457_fw
Fig 13. Wave soldering footprint SOT457 (SC-74)
BC846DS_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 17 July 2009 9 of 12
Document Outline 1. Product profile 1.1 General description 1.2 Features 1.3 Applications 1.4 Quick reference data 2. Pinning information 3. Ordering information 4. Marking 5. Limiting values 6. Thermal characteristics 7. Characteristics 8. Test information 8.1 Quality information 9. Package outline 10. Packing information 11. Soldering 12. Revision history 13. Legal information 13.1 Data sheet status 13.2 Definitions 13.3 Disclaimers 13.4 Trademarks 14. Contact information 15. Contents