Datasheet BC546, BC846 (NXP) - 10
| Hersteller | NXP |
| Beschreibung | NPN general-purpose transistors in Surface Mounted Device (SMD) plastic packages |
| Seiten / Seite | 14 / 10 — NXP Semiconductors. BC846/BC546 series. 65 V, 100 mA NPN general-purpose … |
| Dateiformat / Größe | PDF / 382 Kb |
| Dokumentensprache | Englisch |
NXP Semiconductors. BC846/BC546 series. 65 V, 100 mA NPN general-purpose transistors. 10. Soldering
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BC546
Textversion des Dokuments
NXP Semiconductors BC846/BC546 series 65 V, 100 mA NPN general-purpose transistors 10. Soldering
2.90 2.50 solder lands solder resist
2 1
0.85 3.00 1.30 2.70 occupied area 0.85
3
solder paste 0.60 (3x) 0.50 (3x) 0.60 (3x) 1.00 3.30 MSA439 Dimensions in mm
Fig 15. Reflow soldering footprint SOT23 (TO-236AB)
3.40 1.20 (2x) solder lands solder resist occupied area
2 1
4.60 4.00 1.20
3
preferred transport direction during soldering 2.80 MSA427 4.50 Dimensions in mm
Fig 16. Wave soldering footprint SOT23 (TO-236AB)
BC846_BC546_SER_7 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 07 — 17 November 2009 10 of 14
Document Outline 1. Product profile 1.1 General description 1.2 Features 1.3 Applications 1.4 Quick reference data 2. Pinning information 3. Ordering information 4. Marking 5. Limiting values 6. Thermal characteristics 7. Characteristics 8. Package outline 9. Packing information 10. Soldering 11. Revision history 12. Legal information 12.1 Data sheet status 12.2 Definitions 12.3 Disclaimers 12.4 Trademarks 13. Contact information 14. Contents
2.90 2.50 solder lands solder resist
2 1
0.85 3.00 1.30 2.70 occupied area 0.85
3
solder paste 0.60 (3x) 0.50 (3x) 0.60 (3x) 1.00 3.30 MSA439 Dimensions in mm
Fig 15. Reflow soldering footprint SOT23 (TO-236AB)
3.40 1.20 (2x) solder lands solder resist occupied area
2 1
4.60 4.00 1.20
3
preferred transport direction during soldering 2.80 MSA427 4.50 Dimensions in mm
Fig 16. Wave soldering footprint SOT23 (TO-236AB)
BC846_BC546_SER_7 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 07 — 17 November 2009 10 of 14
Document Outline 1. Product profile 1.1 General description 1.2 Features 1.3 Applications 1.4 Quick reference data 2. Pinning information 3. Ordering information 4. Marking 5. Limiting values 6. Thermal characteristics 7. Characteristics 8. Package outline 9. Packing information 10. Soldering 11. Revision history 12. Legal information 12.1 Data sheet status 12.2 Definitions 12.3 Disclaimers 12.4 Trademarks 13. Contact information 14. Contents