HMC628LP4 / 628LP4E v07.0410 BiCMOS MMIC 5-Bit DIGITALVARIABLE GAIN AMPLIFIER, 50 - 800 MHzOutline Drawing 12 T NOTES: 1. LEADFRAME MATERIAL: COPPER ALLOY L - SM 2. DIMENSIONS ARE IN INCHES [MILLIMETERS] A 3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE. 4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM. IT PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM. 5. PACKAGE WARP SHALL NOT EXCEED 0.05mm. IG 6. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF GROUND. 7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED - D LAND PATTERN. S R IE IF Package Information L Part Number Package Body Material Lead Finish MSL Rating Package Marking [3] P [1] H628 M HMC628LP4 Low Stress Injection Molded Plastic Sn/Pb Solder MSL1 XXXX A [2] H628 HMC628LP4E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL1 XXXX IN [1] Max peak refl ow temperature of 235 °C A [2] Max peak refl ow temperature of 260 °C [3] 4-Digit lot number XXXX G E L B IA R A V Inf F or o m r pr ation ifc ur e, de nished lbiv y e Anry alo a g n D d to p evices is la beclie o eved rde to b r e sa: H ccur iattti e tae M nd reliicr abl ow e. H a o v wee C ver, o n rp o o F roar tiporin c ,e 2 , 0 de A liv lepha R ry, an o d t ad, C o plac h e eolm rdesrfo s: rd, MA 01 Analog Devi 8 c 2 e 4 s, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 978-250-3343 Fax: 978-250-3373 O rights of third parties that may result from its use. Specifications subject to change without notice. No rde Phon r O e: 7 n- 81 li 3 n 2 e a 9-4 t w 70 ww 0 • O . rdh e itt r o ite nli .c n o e a m license is granted by implication or otherwise under any patent or patent rights of Analog Devices. t www.analog.com 12 - 43 Application Support: Phon Trademarks and registered trademarks are the property of their respective owners. e: 978-250-334 A 3 o pplic r app ation S s u @ p h por ittti : Pte ho.c n o e m : 1-800-ANALOG-D