Datasheet ADL5240 (Analog Devices) - 8
| Hersteller | Analog Devices |
| Beschreibung | 100 MHz TO 4000 MHz RF/IF Digitally Controlled VGA |
| Seiten / Seite | 28 / 8 — ADL5240. Data Sheet. ABSOLUTE MAXIMUM RATINGS. Table 2. ESD CAUTION. … |
| Revision | A |
| Dateiformat / Größe | PDF / 1.2 Mb |
| Dokumentensprache | Englisch |
ADL5240. Data Sheet. ABSOLUTE MAXIMUM RATINGS. Table 2. ESD CAUTION. Parameter. Rating
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ADL5240 Data Sheet ABSOLUTE MAXIMUM RATINGS Table 2. ESD CAUTION Parameter Rating
Supply Voltage (VDD, VCC) 6.5 V Input Power AMPIN 16 dBm DSAIN 30 dBm Internal Power Dissipation 0.5 W θJA (Exposed Pad Soldered Down) 36.8°C/W θJC (Exposed Pad is the Contact) 6.9°C/W Maximum Junction Temperature 150°C Lead Temperature (Soldering, 60 sec) 240°C Operating Temperature Range −40°C to +85°C Storage Temperature Range −65°C to +150°C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Rev. A | Page 8 of 28 Document Outline Features Applications General Description Functional Block Diagram Revision History Specifications Absolute Maximum Ratings ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Applications Information Basic Layout Connections Amplifier Bias Digital Step Attenuator Bias Amplifier RF Input Interface Amplifier RF Output Interface DSA RF Input Interface DSA RF Output Interface DSA SPI Interface SPI Timing SPI Timing Sequence Loop Performance Amplifier Drive Level for Optimum ACLR Thermal Considerations Evaluation Board Outline Dimensions Ordering Guide
Supply Voltage (VDD, VCC) 6.5 V Input Power AMPIN 16 dBm DSAIN 30 dBm Internal Power Dissipation 0.5 W θJA (Exposed Pad Soldered Down) 36.8°C/W θJC (Exposed Pad is the Contact) 6.9°C/W Maximum Junction Temperature 150°C Lead Temperature (Soldering, 60 sec) 240°C Operating Temperature Range −40°C to +85°C Storage Temperature Range −65°C to +150°C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Rev. A | Page 8 of 28 Document Outline Features Applications General Description Functional Block Diagram Revision History Specifications Absolute Maximum Ratings ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Applications Information Basic Layout Connections Amplifier Bias Digital Step Attenuator Bias Amplifier RF Input Interface Amplifier RF Output Interface DSA RF Input Interface DSA RF Output Interface DSA SPI Interface SPI Timing SPI Timing Sequence Loop Performance Amplifier Drive Level for Optimum ACLR Thermal Considerations Evaluation Board Outline Dimensions Ordering Guide