Datasheet HMC8121 (Analog Devices) - 2

HerstellerAnalog Devices
Beschreibung81 GHz to 86 GHz, E-Band Variable Gain Amplifier
Seiten / Seite16 / 2 — HMC8121. Data Sheet. TABLE OF CONTENTS. REVISION HISTORY 4/2017—Rev. A to …
RevisionB
Dateiformat / GrößePDF / 352 Kb
DokumentenspracheEnglisch

HMC8121. Data Sheet. TABLE OF CONTENTS. REVISION HISTORY 4/2017—Rev. A to Rev. B. 2/2016—Revision A: Initial Version

HMC8121 Data Sheet TABLE OF CONTENTS REVISION HISTORY 4/2017—Rev A to Rev B 2/2016—Revision A: Initial Version

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HMC8121 Data Sheet TABLE OF CONTENTS
Features .. 1 Typical Performance Characteristics ..7 Applications ... 1 Theory of Operation .. 12 General Description ... 1 Typical Application Circuit ... 13 Functional Block Diagram .. 1 Assembly Diagram ... 14 Revision History ... 2 Mounting and Bonding Techniques for Millimeterwave GaAs Specifications ... 3 MMICs ... 15 Absolute Maximum Ratings .. 4 Handling Precautions .. 15 Thermal Resistance .. 4 Mounting ... 15 ESD Caution .. 4 Wire Bonding .. 15 Pin Configuration and Function Descriptions ... 5 Outline Dimensions ... 16 Interface Schematics... 6 Ordering Guide .. 16
REVISION HISTORY 4/2017—Rev. A to Rev. B
Updated Outline Dimensions ... 16
2/2016—Revision A: Initial Version
Rev. B | Page 2 of 16 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS HANDLING PRECAUTIONS Storage Cleanliness Static Sensitivity Transients General Handling MOUNTING Eutectic Die Attach Epoxy Die Attach WIRE BONDING OUTLINE DIMENSIONS ORDERING GUIDE