Datasheet HMC900LP5E (Analog Devices) - 7

HerstellerAnalog Devices
Beschreibung50 MHz Dual Baseband Programmable Low Pass Filter
Seiten / Seite26 / 7 — HMC900LP5E. 50 MHz DUAL PROGRAMMABLE. LOW PASS FILTER with DRIVER. Table …
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HMC900LP5E. 50 MHz DUAL PROGRAMMABLE. LOW PASS FILTER with DRIVER. Table 3. Absolute Maximum Ratings. Outline Drawing

HMC900LP5E 50 MHz DUAL PROGRAMMABLE LOW PASS FILTER with DRIVER Table 3 Absolute Maximum Ratings Outline Drawing

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HMC900LP5E
v04.0811
50 MHz DUAL PROGRAMMABLE LOW PASS FILTER with DRIVER Table 3. Absolute Maximum Ratings
Nominal 5V supply to gND Reflow soldering VDDCal, VDDI, VDDQ, VDDBg, -0.3 to 5.5V Peak Temperature 260 °C DVDD Time at Peak Temperature 40 µs Common Mode Inputs Pins esD sensitivity (HBM) 1kV Class 1C -0.3 to 5.5V (CMI, CMQ) Input and Output Pins stresses above those listed under absolute Maximum Ratings may IIP, IIN, IQP, IQN, OIP, OIN, OQP, -0.3 to 5.5V cause permanent damage to the device. This is a stress rating only; OQN functional operation of the device at these or any other conditions Digital Pins above those indicated in the operational section of this specification seN, sDI, sCK, sDO, CalCK -0.3 to 5.5V is not implied. exposure to absolute maximum rating conditions for sDO min load impedance 1kΩ extended periods may affect device reliability. Operating Temperature Range -40 to +85 °C storage Temperature -65 to +125 °C eleCTROsTaTIC seNsITIVe DeVICe 3 Maximum Junction Temperature 125 °C OBseRVe HaNDlINg PReCaUTIONs Thermal Resistance (RTH) 10 °C/W (junction to ground paddle) g
Outline Drawing
IN s s e C O R l P a N Ig s D N NOTes: a [1] PaCKage BODY MaTeRIal: lOW sTRess INJeCTION MOlDeD PlasTIC B sIlICa aND sIlICON IMPRegNaTeD. [2] leaD aND gROUND PaDDle MaTeRIal: COPPeR allOY. e [3] leaD aND gROUND PaDDle PlaTINg: 100% MaTTe TIN. [4] DIMeNsIONs aRe IN INCHes [MIllIMeTeRs]. s [5] leaD sPaCINg TOleRaNCe Is NON-CUMUlaTIVe. a [6] PaD BURR leNgTH sHall Be 0.15mm MaX. PaD BURR HeIgHT sHall Be 0.25m MaX. [7] PaCKage WaRP sHall NOT eXCeeD 0.05mm [8] all gROUND leaDs aND gROUND PaDDle MUsT Be sOlDeReD TO PCB RF gOUND. [9] ReFeR TO HITTITe aPPlICaTION NOTe FOR sUggesTeD PCB laND IF / B PaTTeRN.
Table 4. Package Information
Part Number Package Body Material lead Finish Msl Rating [1] Package Marking [2] H900 HMC900lP5e RoHs-compliant low stress Injection Molded Plastic 100% matte sn Msl1 XXXX [1] Max peak reflow temperature of 260 °C [2] 4-Digit lot number XXXX Information furnish F e o d r b y pArnic alo e g , D d evi ecleis vie s rby eli, ea ve n d d to tbo e apl cc a ur c at e e ao n r d d releiars ble ,. p Ho le we a vesr, en c o For price, delivery, and to place orders: Analog Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other ontact Hittite Microwave Corporation: One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 2 Elizabeth Drive, Chelmsford, MA 01824 Phon rights of third parties that may result from its use. Specifications subject to change without notice. No e: 9 Ph 7 o 8 n - e 2 : 750 81- - 3 3 2 3 9- 4 4 3 7 0 Fax 0 • O : rd 9 e 7 r o8 nl-i2 n 50 e at -33 ww 7 w. 3
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