Datasheet LTM2173-14 (Analog Devices) - 2
| Hersteller | Analog Devices |
| Beschreibung | 14-Bit, 80Msps Low Power Quad ADC |
| Seiten / Seite | 28 / 2 — ABSOLUTE MAXIMUM RATINGS. PIN CONFIGURATION. (Notes 1, 2). ORDER … |
| Revision | A |
| Dateiformat / Größe | PDF / 414 Kb |
| Dokumentensprache | Englisch |
ABSOLUTE MAXIMUM RATINGS. PIN CONFIGURATION. (Notes 1, 2). ORDER INFORMATION LEAD FREE FINISH. TRAY. PART MARKING*
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LTM2173-14
ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION (Notes 1, 2)
Supply Voltages TOP VIEW VDD, OVDD .. –0.3V to 2V Analog Input Voltage (A + – IN , AIN , A PAR/SER, SENSE) (Note 3) .. –0.3V to (VDD + 0.2V) B Digital Input Voltage (ENC+, ENC–, CS, C SDI, SCK) (Note 4) .. –0.3V to 3.9V D SDO (Note 4) ... –0.3V to 3.9V E Digital Output Voltage .. –0.3V to (OVDD + 0.3V) F Operating Temperature Range G LTM2173 .. –40°C to 105°C H Storage Temperature Range .. –55°C to 125°C J K L M N P 1 2 3 4 5 6 7 8 9 10 BGA PACKAGE 140-LEAD (11.25mm × 9.00mm × 2.72mm) TJMAX = 150°C, θJA = 30°C/W, θJC = 25°C/W, θJB = 15°C/W, θJCbottom = 12°C/W
ORDER INFORMATION LEAD FREE FINISH TRAY PART MARKING* PACKAGE DESCRIPTION TEMPERATURE RANGE
LTM2173HY-14#PBF LTM2173HY-14#PBF LTM2173-14 140-Lead (11.25mm × 9mm × 2.72mm) BGA –40°C to 105°C • Device temperature grade is indicated by a label on the shipping • This product is not recommended for second side reflow. container. This product is moisture sensitive. For more information, go to • Pad or ball finish code is per IPC/JEDEC J-STD-609. Recommended BGA PCB Assembly and Manufacturing Procedures. • BGA Package and Tray Drawings Rev. A 2 For more information www.analog.com Document Outline Features Description Applications Typical Application Absolute Maximum Ratings Pin Configuration Order Information Converter Characteristics Analog Input Dynamic Accuracy Internal Reference Characteristics Digital Inputs And Outputs Power Requirements Timing Characteristics Timing Diagrams Pin Functions Pin Configuration Table Functional Block Diagram Applications Information Package Description Related Parts Features Applications Typical Application Description Absolute Maximum Ratings Order Information Pin Configuration Converter Characteristics Analog Input Dynamic Accuracy Internal Reference Characteristics Digital Inputs And Outputs Power Requirements Timing Characteristics Timing Diagrams Typical Performance Characteristics Pin Functions Pin Configuration Table Functional Block Diagram Applications Information Converter Operation Analog Input Input Drive Circuits Digital Outputs Data Format Device Programming Modes Grounding and Bypassing Heat Transfer Package Description Revision History Typical Application Related Parts
ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION (Notes 1, 2)
Supply Voltages TOP VIEW VDD, OVDD .. –0.3V to 2V Analog Input Voltage (A + – IN , AIN , A PAR/SER, SENSE) (Note 3) .. –0.3V to (VDD + 0.2V) B Digital Input Voltage (ENC+, ENC–, CS, C SDI, SCK) (Note 4) .. –0.3V to 3.9V D SDO (Note 4) ... –0.3V to 3.9V E Digital Output Voltage .. –0.3V to (OVDD + 0.3V) F Operating Temperature Range G LTM2173 .. –40°C to 105°C H Storage Temperature Range .. –55°C to 125°C J K L M N P 1 2 3 4 5 6 7 8 9 10 BGA PACKAGE 140-LEAD (11.25mm × 9.00mm × 2.72mm) TJMAX = 150°C, θJA = 30°C/W, θJC = 25°C/W, θJB = 15°C/W, θJCbottom = 12°C/W
ORDER INFORMATION LEAD FREE FINISH TRAY PART MARKING* PACKAGE DESCRIPTION TEMPERATURE RANGE
LTM2173HY-14#PBF LTM2173HY-14#PBF LTM2173-14 140-Lead (11.25mm × 9mm × 2.72mm) BGA –40°C to 105°C • Device temperature grade is indicated by a label on the shipping • This product is not recommended for second side reflow. container. This product is moisture sensitive. For more information, go to • Pad or ball finish code is per IPC/JEDEC J-STD-609. Recommended BGA PCB Assembly and Manufacturing Procedures. • BGA Package and Tray Drawings Rev. A 2 For more information www.analog.com Document Outline Features Description Applications Typical Application Absolute Maximum Ratings Pin Configuration Order Information Converter Characteristics Analog Input Dynamic Accuracy Internal Reference Characteristics Digital Inputs And Outputs Power Requirements Timing Characteristics Timing Diagrams Pin Functions Pin Configuration Table Functional Block Diagram Applications Information Package Description Related Parts Features Applications Typical Application Description Absolute Maximum Ratings Order Information Pin Configuration Converter Characteristics Analog Input Dynamic Accuracy Internal Reference Characteristics Digital Inputs And Outputs Power Requirements Timing Characteristics Timing Diagrams Typical Performance Characteristics Pin Functions Pin Configuration Table Functional Block Diagram Applications Information Converter Operation Analog Input Input Drive Circuits Digital Outputs Data Format Device Programming Modes Grounding and Bypassing Heat Transfer Package Description Revision History Typical Application Related Parts