Datasheet LTC2320-12 (Analog Devices) - 10

LTC2320-12
PIN FUNCTIONS
Pins that are the same for all digital I/O modes.
VDD (Pins 15, 21, 44, 52):
Power Supply. Bypass VDD to
A + –
GND with a 10µF ceramic capacitor and a 0.1µF ceramic
IN6 , AIN6 (Pins 2, 1):
Analog Differential Input Pins. Full-scale range (A + – capacitor close to the part. The VDD pins should be shorted IN6 – AIN6 ) is ±REFOUT3 voltage. These pins can be driven from V together and driven from the same supply. DD to GND.
+ – GND (Pins 3, 7, 12, 18, 26, 32, 38, 46, 49):
Ground.
AIN2 , AIN2 (Pins 17, 16):
Analog Differential Input Pins. + – These pins and exposed pad (Pin 53) must be tied directly Full-scale range (AIN2 – AIN2 ) is ±REFOUT1 voltage. to a solid ground plane. These pins can be driven from VDD to GND.
+ – A + – AIN1 , AIN1 (Pins 20, 19):
Analog Differential Input Pins.
IN5 , AIN5 (Pins 5, 4):
Analog Differential Input Pins. + – Full-scale range (A + – Full-scale range (AIN1 – AIN1 ) is ±REFOUT1 voltage. IN5 – AIN5 ) is ±REFOUT3 voltage. These pins can be driven from V These pins can be driven from VDD to GND. DD to GND.
REFOUT3 (Pin 6):
Reference Buffer 3 Output. An onboard
REFOUT1 (Pin 22):
Reference Buffer 1 Output. An onboard buffer nominally outputs 4.096V to this pin. This pin is buffer nominally outputs 4.096V to this pin. This pin is referred to GND and should be decoupled closely to the referred to GND and should be decoupled closely to the pin with a 10µF (X5R, 0805 size) ceramic capacitor. The pin with a 10µF (X5R, 0805 size) ceramic capacitor. The internal buffer driving this pin may be disabled by ground- internal buffer driving this pin may be disabled by ground- ing the REFBUFEN pin. If the buffer is disabled, an external ing the REFBUFEN pin. If the buffer is disabled, an external reference may drive this pin in the range of 1.25V to 5V. reference may drive this pin in the range of 1.25V to 5V.
REF (Pin 8):
Common 4.096V reference output. Decouple
SDR
/
DDR (Pin 23):
Double Data Rate Input. Controls the to GND with a 1μF low ESR ceramic capacitor. May be frequency of SCK and CLKOUT. Tie to GND for the falling overdriven with a single external reference to establish a edge of SCK to shift each serial data output (Single Data common reference for ADC cores 1 through 4. Rate, SDR). Tie to OVDD to shift serial data output on each edge of SCK (Double Data Rate, DDR). CLKOUT will be a
REFOUT2 (Pin 9):
Reference Buffer 2 Output. An onboard delayed version of SCK for both pin states. buffer nominally outputs 4.096V to this pin. This pin is referred to GND and should be decoupled closely to the
CNV (Pin 24):
Convert Input. This pin, when high, defines pin with a 10µF (X5R, 0805 size) ceramic capacitor. The the acquisition phase. When this pin is driven low, the internal buffer driving this pin may be disabled by ground- conversion phase is initiated and output data is clocked ing the REFBUFEN pin. If the buffer is disabled, an external out. This input must be driven at OVDD levels with a low reference may drive this pin in the range of 1.25V to 5V. jitter pulse. This pin is unaffected by the CMOS/LVDS pin.
A + – CMOS/LVDS (Pin 25):
I/O Mode Select. Ground this pin
IN4 , AIN4 (Pins 11, 10):
Analog Differential Input Pins. Full-scale range (A + – to enable CMOS mode, tie to OVDD to enable LVDS mode. IN4 – AIN4 ) is ±REFOUT2 voltage. These pins can be driven from V Float this pin to enable low power LVDS mode. DD to GND.
A + – OVDD (Pins 31, 37):
I/O Interface Digital Power. The range
IN3 , AIN3 (Pins 14, 13):
Analog Differential Input Pins. Full-scale range (A + – of OVDD is 1.71V to 2.63V. This supply is nominally set IN3 – AIN3 ) is ±REFOUT2 voltage. These pins can be driven from V to the same supply as the host interface (CMOS: 1.8V or DD to GND. 2.5V, LVDS: 2.5V). Bypass OVDD to GND (Pins 32 and 38) with 0.1µF capacitors. Rev B 10 For more information www.analog.com Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Converter Characteristics Internal Reference Characteristics Digital Inputs And Digital Outputs Power Requirements ADC Timing Characteristics Typical Performance Characteristics Pin Functions Functional Block Diagram Timing Diagram Applications Information Package Description Related Parts Features Applications Typical Application Description Absolute Maximum Ratings Order Information Pin Configuration Electrical Characteristics Converter Characteristics Dynamic Accuracy Internal Reference Characteristics Digital Inputs And Digital Outputs Power Requirements ADC Timing Characteristics ADC Timing Characteristics ADC Timing Characteristics Typical Performance Characteristics Pin Functions CMOS data output option (CMOS/LVDS = low) LVDS data output option (CMOS/LVDS = high or FLOAT) Functional Block Diagram Timing Diagram Applications Information OVERVIEW CONVERTER OPERATION TRANSFER FUNCTION INPUT DRIVE CIRCUITS ADC REFERENCE DYNAMIC PERFORMANCE POWER CONSIDERATIONS TIMING AND CONTROL DIGITAL INTERFACE BOARD LAYOUT Package Description Revision History Typical Application Related Parts