Datasheet Teseo-LIV3R (STMicroelectronics) - 7

HerstellerSTMicroelectronics
BeschreibungTeseo ROM GNSS module
Seiten / Seite30 / 7 — Teseo-LIV3R. General description. Table 3. Teseo-LIV3R pin out …
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DokumentenspracheEnglisch

Teseo-LIV3R. General description. Table 3. Teseo-LIV3R pin out description (continued). Name I/O. Description

Teseo-LIV3R General description Table 3 Teseo-LIV3R pin out description (continued) Name I/O Description

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Teseo-LIV3R General description Table 3. Teseo-LIV3R pin out description (continued) No Name I/O Description
17 SCL I/O I2C Clock (if not used, must be left floating) 18 Reserved I Reserved (must be left floating) 1. Can be used to supply external active antenna. DS12821 Rev 2 7/30 29 Document Outline Table 1. Device summary 1 General description 1.1 GNSS performance Table 2. GNSS performance 1.2 Block diagram Figure 1. Teseo-LIV3R block schematic 1.3 Pin configuration Figure 2. Teseo-LIV3R pin layout 1.4 Pin out description Table 3. Teseo-LIV3R pin out description 2 Supported GNSS constellations 2.1 GPS 2.2 GLONASS 2.3 BeiDou 3 Augmentation systems 3.1 Satellite-Based augmentation system 3.2 QZSS 3.3 Differential GPS Table 4. Supported RTCM message on Teseo-LIV3R 4 Assisted GNSS 4.1 RealTime AGNSS 5 Clock generation 5.1 Temperature-Compensated Crystal Oscillator (TCXO) 5.2 Real Time Clock (RTC) 6 I/O interfaces 6.1 UART 6.2 I2C 7 FW configuration 8 Power mode 8.1 Hardware standby 8.2 Software standby 9 Geofencing 10 Odometer 11 Regulatory compliance 11.1 CE certification for Teseo-LIV3R Figure 3. CE marking 12 Electrical characteristics 12.1 Parameter conditions 12.2 Minimum and maximum values 12.3 Typical values 12.4 Absolute maximum ratings Table 5. Voltage characteristics Table 6. Thermal characteristics Table 7. Power consumption 12.5 Recommended DC operating conditions Table 8. Recommended DC operating conditions 13 Mechanical specifications Figure 4. Teseo-LIV3R mechanical specification 14 Shipping information 14.1 Reels Figure 5. Carrier tape Figure 6. Teseo-LIV3R orientation Figure 7. Cover tape Figure 8. Plastic reel Figure 9. PB band 14.2 Packing cartons for reels 14.3 ESD handling precautions 14.4 Moisture sensitivity levels 15 Labeling information Figure 10. Labeling information of Teseo-LIV3R Table 9. Labeling information description 16 Reflow soldering profile Table 10. Soldering profile values Figure 11. Soldering profiles 17 ECOPACK® Appendix A Reference document Revision history Table 11. Revision history