Datasheet SM9233, SM9235, SM9236 (Silicon Microstructures) - 5
| Hersteller | Silicon Microstructures |
| Beschreibung | Ultra Low Gauge Pressure Digital Sensor (SM923X) |
| Seiten / Seite | 18 / 5 — SM9233/SM9235/SM9236 Series. www.si-micro.com. 9. Package Reference. … |
| Dateiformat / Größe | PDF / 1.4 Mb |
| Dokumentensprache | Englisch |
SM9233/SM9235/SM9236 Series. www.si-micro.com. 9. Package Reference. Notes:. DOC # 40DS9202.02
Modelllinie für dieses Datenblatt
Textversion des Dokuments
SM9233/SM9235/SM9236 Series www.si-micro.com
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9. Package Reference
45 SOIC-16 (C) Vertical Package Dimensions 131 167 170 175 169 0 61
Notes:
• All dimensions in units of [mm] • Moisture Sensitivity Level (MSL): Level 3 • Clean, dry air compatible with wetted materials. Wetted materials include : Wetted materials include silicon, glass, RTV (silicone), gold, aluminum, copper, epoxy and mold compound. • Tolerance on all dimensions ±0.13 mm unless otherwise specified. • [B] is tube connected to bottom side of sensor die. • [T] is tube connected to top side of sensor die. Topside pressure is positive pressure. An increase in topside pressure will result in an increase in sensor output • Bottom plate is stainless steel • Robust JEDEC SOIC-16 package for automated assembly • Manufactured according to ISO9001 , ISO14001 and ISO/TS 16949 standards Lot Number Identification Silicon Microstructures, Inc. 2001-2019. All rights reserved +1-(408) 577-0100 | sales@si-micro.com I www.si-micro.com
DOC # 40DS9202.02
Page 5
27
9. Package Reference
45 SOIC-16 (C) Vertical Package Dimensions 131 167 170 175 169 0 61
Notes:
• All dimensions in units of [mm] • Moisture Sensitivity Level (MSL): Level 3 • Clean, dry air compatible with wetted materials. Wetted materials include : Wetted materials include silicon, glass, RTV (silicone), gold, aluminum, copper, epoxy and mold compound. • Tolerance on all dimensions ±0.13 mm unless otherwise specified. • [B] is tube connected to bottom side of sensor die. • [T] is tube connected to top side of sensor die. Topside pressure is positive pressure. An increase in topside pressure will result in an increase in sensor output • Bottom plate is stainless steel • Robust JEDEC SOIC-16 package for automated assembly • Manufactured according to ISO9001 , ISO14001 and ISO/TS 16949 standards Lot Number Identification Silicon Microstructures, Inc. 2001-2019. All rights reserved +1-(408) 577-0100 | sales@si-micro.com I www.si-micro.com
DOC # 40DS9202.02
Page 5