Datasheet VERSA-PAC (Eaton) - 9
| Hersteller | Eaton |
| Beschreibung | Inductors and Transformers (Surface Mount) |
| Seiten / Seite | 9 / 9 — Solder Reflow Profile. ure at. per. Tem. Reference JDEC J-STD-020. Eaton. … |
| Dateiformat / Größe | PDF / 1.4 Mb |
| Dokumentensprache | Englisch |
Solder Reflow Profile. ure at. per. Tem. Reference JDEC J-STD-020. Eaton. Electronics Division
Modelllinie für dieses Datenblatt
- VP1-0059-R VP1-0076-R VP1-0102-R VP1-0190-R VP1-1400-R VP2-0066-R VP2-0083-R VP2-0116-R VP2-0216-R VP2-1600-R VP3-0047-R VP3-0055-R VP3-0084-R VP3-0138-R VP3-0780-R VP4-0047-R VP4-0060-R VP4-0075-R VP4-0140-R VP4-0860-R VP5-0053-R VP5-0067-R VP5-0083-R VP5-0155-R VP5-1200-R VPH1-0059-R VPH1-0076-R VPH1-0102-R VPH1-0190-R VPH1-1400-R VPH2-0066-R VPH2-0083-R VPH2-0116-R VPH2-0216-R VPH2-1600-R VPH3-0047-R VPH3-0055-R VPH3-0084-R VPH3-0138-R VPH3-0780-R VPH4-0047-R VPH4-0060-R VPH4-0075-R VPH4-0140-R VPH4-0860-R VPH5-0053-R VPH5-0067-R VPH5-0083-R VPH5-0155-R VPH5-1200-R
Textversion des Dokuments
VP Technical Data 4301 Effective August 2017 VERSA-PAC® Inductors and Transformers (Surface Mount)
Solder Reflow Profile
TP Table 1 - Standard SnPb Solder (T T c) C -5°C tP Max. Ramp Up Rate = 3°C/s Volume Volume Max. Ramp Down Rate = 6°C/s Package mm3 mm3 T Thickness <350 _ >350 L Preheat t <2.5mm 235°C 220°C A _ >2.5mm 220°C 220°C Tsmax
ure at
Table 2 - Lead (Pb) Free Solder (Tc)
per
Volume Volume Volume Tsmin
Tem
ts Package mm3 mm3 mm3 Thickness <350 350 35 350 - >2000 <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C 25°C Time 25°C to Peak Time
Reference JDEC J-STD-020
Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak • e T mperature min. (Tsmin) 100°C 150°C • Temperature max. (Tsmax) 150°C 200°C • Time (Tsmin to Tsmax) (ts) 60-120 Seconds 60-120 Seconds Average ramp up rate T 3°C/ Second Max. 3°C/ Second Max. smax to Tp Liquidous temperature (TL) 183°C 217°C Time at liquidous (t 60-150 Seconds 60-150 Seconds L) Peak package body temperature (T Table 1 ab T le 2 P)* Time (t 20 Seconds** 30 Seconds** p)** within 5 °C of the specified classification temperature (Tc) Average ramp-down rate (T 6°C/ Second Max. 6°C/ Second Max. p to Tsmax) Time 25°C to Peak Temperature Minut 6 es Max. 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin.
Eaton Electronics Division
1000 Eaton Boulevard Cleveland, OH 44122 United States www.eaton.com/electronics © 2017 Eaton All Rights Reserved Eaton is a registered trademark. Printed in USA Publication No. 4301 All other trademarks are property August 2017 of their respective owners.
Solder Reflow Profile
TP Table 1 - Standard SnPb Solder (T T c) C -5°C tP Max. Ramp Up Rate = 3°C/s Volume Volume Max. Ramp Down Rate = 6°C/s Package mm3 mm3 T Thickness <350 _ >350 L Preheat t <2.5mm 235°C 220°C A _ >2.5mm 220°C 220°C Tsmax
ure at
Table 2 - Lead (Pb) Free Solder (Tc)
per
Volume Volume Volume Tsmin
Tem
ts Package mm3 mm3 mm3 Thickness <350 350 35 350 - >2000 <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C 25°C Time 25°C to Peak Time
Reference JDEC J-STD-020
Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak • e T mperature min. (Tsmin) 100°C 150°C • Temperature max. (Tsmax) 150°C 200°C • Time (Tsmin to Tsmax) (ts) 60-120 Seconds 60-120 Seconds Average ramp up rate T 3°C/ Second Max. 3°C/ Second Max. smax to Tp Liquidous temperature (TL) 183°C 217°C Time at liquidous (t 60-150 Seconds 60-150 Seconds L) Peak package body temperature (T Table 1 ab T le 2 P)* Time (t 20 Seconds** 30 Seconds** p)** within 5 °C of the specified classification temperature (Tc) Average ramp-down rate (T 6°C/ Second Max. 6°C/ Second Max. p to Tsmax) Time 25°C to Peak Temperature Minut 6 es Max. 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin.
Eaton Electronics Division
1000 Eaton Boulevard Cleveland, OH 44122 United States www.eaton.com/electronics © 2017 Eaton All Rights Reserved Eaton is a registered trademark. Printed in USA Publication No. 4301 All other trademarks are property August 2017 of their respective owners.