Datasheet setP (Littelfuse) - 2

PolySwitch® Temperature Indicators
Surface Mount > setP™ Series
Electrical Characteristics I 1 I 2 V 3 I 4 Maximum Time-To-Trip Resistance Part Number hold trip max max P 5 typ. (W) (A) (A) (Vdc) (A) d Current (A) Time (Sec.) R 6 7 min (Ω) R1max (Ω)
SETP0805-100-SE 0.06 0.25 6 1 0.6 0.3 1 0.5 12 SETP0805-100-CC 0.075 0.30 6 1 0.6 0.3 5 0.5 6
Notes:
1. Ihold = Hold current: maximum current device will pass without tripping in 20°C still air 2. Itrip = Trip current: minimum current at which the device will trip in 20°C still air 3. Vmax = Maximum voltage device can withstand without damage at rated current (Imax) 4. Imax = Maximum fault current device can withstand without damage at rated voltage (Vmax) 5. Pd = Power dissipated from device when in the tripped state at 20°C still air 6. Rmin = Minimum resistance of device in initial (un-soldered) state 7. R1max = Maximum resistance of device at 20°C measured one hour after tripping or reflow Soldering of 260°C for 20 seconds (Values specified were determined using PCBs with 0.115in x 1.0in ounce copper traces)
Caution:
Operation beyond the specified rating may result in damage and possible arcing and flame
Resistance Vs. Temperature Curve Environmental Specifications Operating Temperature
-40°C to +85°C 1.E+09
Maximum Device Surface
110°C
Temperature in Tripped State
1.E+08 SETP0805-100-SE +70°C 1000 hours
Passive Aging
≤ R1max after test 1.E+07 +60°C, 90% R.H., 1000 hours
Humidity Aging
SETP0805-100-CC ≤ R1max after test 1.E+06
) Ω
MIL–STD–202, Method 215
Thermal Shock
No change -40°C to +85°C, 10 Cycles 1.E+05 MIL–STD–202, Method 215
Solvent Resistance
No change 1.E+04 MIL–STD–883, Method 2007,
Vibration Resistance, (
Condition A No change 1.E+03
Moisture Sensitivity Level
Level 2a, J–STD–020 1.E+02 1.E+01
Physical Specifications
1.E+00 Solder-Plated Copper
Terminal Material
20 40 60 80 100 120 140 (Solder Material: Matte Tin (Sn))
Temperature, ºC
Meets EIA Specification RS186-9E,
Lead Solderability
ANSI/J-STD-002, Category 3.
Soldering Parameters Profile Feature
Pb-Free Assembly
t T
P P
Average Ramp-Up Rate (T to T )
3°C/second max
Critical Zone S(max) P t Ramp-u R p amp-up
L
to t
P
Temperature Min (T )
150°C
s(min) T
L
t Pre Heat: Temperature Max (T )
200°C
s(max) T
L S(max)
Time (Min to Max) (t )
60 – 120 secs
e Ramp-dow Ramp-do n s Preheat Preheat Time Maintained Temperature (T )
217°C
L T
S(min)
Above: Temperature (t )
60 – 150 seconds
t L mperatur
S
e Peak / Classification Temperature (T )
260+0/-5 °C
P T 25 Time within 5°C of actual peak Temperature time to peak temperature
30 seconds max
Time (t ) p Ramp-down Rate
2°C/second max -- All temperature refer to topside of the package, measured on the package body surface -- If reflow temperature exceeds the recommended profile, devices may not meet the
Time 25°C to peak Temperature (T )
8 minutes Max.
P
performance requirements -- Recommended reflow methods: IR, vapor phase oven, hot air oven, N environment for lead 2 -- Recommended maximum paste thickness is 0.25mm (0.010 inch) -- Devices can be cleaned using standard industry methods and solvents -- Devices can be reworked using the standard industry practices © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/14/19