Datasheet A80603, A80603-1 (Allegro) - 8

A80603 and LED Driver with Pre-Emptive Boost A80603-1 for Ultra-High Dimming Ratio and Low Output Ripple ELECTRICAL CHARACTERISTICS [1] (continued): Unless otherwise noted, specifications are valid at VIN = 16 V, TJ = 25°C, • indi- cates specifications guaranteed over the full operating temperature range with TJ = –40°C to 125°C, typical specifications are at TJ = 25°C Characteristics Symbol Test Conditions Min. Typ. Max. Unit LED CURRENT SINKS
LEDx Accuracy [4] Err iISET = 120 µA (RISET = 8.33 kΩ), LED RFSET = 10 kΩ, VAPWM = 0 V ● − 0.7 3 % LEDx Matching ΔLEDx iISET = 120 µA, RFSET = 10 kΩ, VAPWM = 0 V ● − 0.8 2 % LEDx Regulation Voltage V Measured individually with all other LED pins LED tied to ≥1 V, iISET = 120 µA, VAPWM = 0 V ● 600 700 800 mV IISET to ILEDx Current Gain AISET iISET = 120 µA, VAPWM = 0 V ● 812 832 852 A/A ISET Pin Voltage VISET 0.97 1 1.03 V Allowable ISET Current iISET ● 20 − 144 µA LED String Partial-Short-Detect Sensed from each LED pin to GND while its current Voltage VLEDSC sink is in regulation; all other LED pins tied to 1 V ● 4.5 5.2 6 V LED String Partial-Short-Detect Time required to confirm LED string partial- Duration tLEDSC short and pull FAULT = L − − 6.6 µs LED Pin Shorted-to-GND Check Wait time before proceeding with Soft-Start (if Duration tLEDSTG no LED pin is shorted to GND) − 1.5 − ms A80603 6.5 8 9.5 ms Soft-Start Ramp Up Time tSSRU A80603-1 13 16 19 ms Enable Pin Shut Down Delay t EN goes from High to Low; exceeding tEN(OFF) EN(OFF) results in IC shutdown ● 10 16 22 ms Minimum PWM Dimming On-Time tPWMH First and subsequent PWM pulses ● − 0.3 0.4 µs
GATE PIN
Gate Pin Sink Current IGSINK VGS = VIN, no input OCP fault − −113 − µA Gate Pin Source Current IGSOURCE VGS = VIN – 6 V, input OCP fault tripped − 6 − mA Gate Shutdown Delay When Over- Current Fault Is Tripped [2] tFAULTT VIN – VSENSE = 200 mV; monitored at FAULT pin − − 3 µs Gate Voltage V Measured between GATE and VIN when gate GS is fully on − −6.7 − V
VSENSE PIN
VSENSE Pin Sink Current iADJ ● 16 20 24 µA VSENSE Trip Point VSENSETRIP Measured between VIN and VSENSE, RADJ = 0 Ω ● 88 100 110 mV
PEB PIN
PEB Delay Time tPEB iPEB = 60 µA 2.4 3.2 4.0 µs
FAULT PIN
FAULT Pull Down Voltage VFAULT IFAULT = 1 mA − − 0.5 V FAULT Pin Leakage Current iFAULT-LKG VFAULT = 5 V − − 1 µA
THERMAL PROTECTION (TSD)
Thermal Shutdown Threshold [2] TSD Temperature rising 155 170 − °C Thermal Shutdown Hysteresis [2] TSDHYS − 20 − °C [1] For input and output current specifications, negative current is defined as coming out of the node or pin (sourcing); positive current is defined as going into the node or pin (sinking). [2] Ensured by design and characterization; not production tested. [3] Minimum VIN = 4.5 V is only required at startup. After startup is completed, IC can continue to operate down to VIN = 4 V. [4] LED current is trimmed to cancel variations in both Gain and ISET voltage. Allegro MicroSystems, LLC 8 955 Perimeter Road Manchester, NH 03103-3353 U.S.A. www.allegromicro.com Document Outline Features and Benefits Description Applications Package Selection Guide Absolute Maximum Ratings Thermal Characteristics Typical Application – SEPIC Functional Block Diagram Pinout Diagram and Terminal List Electrical Characteristics Functional Description Enabling the IC Powering Up: LED Detection Phase Powering Up: Boost Output Undervoltage Soft Start Function Frequency Selection Synchronization Loss of External Sync Signal Switching Frequency Dithering Clock Out Function LED Current Setting PWM Dimming Pre-Emptive Boost (PEB) Analog Dimming with APWM Pin Extending LED Dimming Ratio Analog Dimming with External Voltage VDD Shutdown Fault Detection and Protection LED String Partial-Short Detect Overvoltage Protection Boost Switch Overcurrent Protection Input Overcurrent Protection and Disconnect Switch Setting the Current Sense Resistor Input UVLO Fault Protection During Operation Fault Recovery Mechanism Package Outline Drawing