Datasheet ADL5611 (Analog Devices) - 7

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Data Sheet ADL5611 ABSOLUTE MAXIMUM RATINGS Table 3. THERMAL RESISTANCE Parameter Rating
Table 4 lists the junction-to-air thermal resistance (θJA) and the Supply Voltage, VPOS 6.5 V junction-to-case thermal resistance (θJC) for the ADL5611. Input Power (50 Ω Impedance) 20 dBm Internal Power Dissipation (Pad Soldered to 800 mW
Table 4. Thermal Resistance
Ground)
Package Type θ 1 2 JA θJC Unit
ESD Human Body Model (HBM) Rating (ESDA/ ±1.5 kV 3-Lead SOT-89 (RK-3) 52 9 °C/W JEDEC JS-001-2011) 1 Measured on the ADL5611 evaluation board. For more information about Maximum Junction Temperature 150°C board layout, see the Soldering Information and Recommended PCB Land Operating Temperature Range −40°C to +105°C Pattern section. 2 Based on simulation with a standard JEDEC board per JESD51. Storage Temperature Range −65°C to +150°C Stresses at or above those listed under Absolute Maximum
ESD CAUTION
Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. B | Page 7 of 16 Document Outline FEATURES FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION REVISION HISTORY SPECIFICATIONS TYPICAL SCATTERING PARAMETERS (S-PARAMETERS) ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS 500 MHz TO 6 GHz FREQUENCY BAND 30 MHz TO 500 MHz FREQUENCY BAND GENERAL APPLICATIONS INFORMATION BASIC CONNECTIONS SOLDERING INFORMATION AND RECOMMENDED PCB LAND PATTERN W-CDMA ACPR PERFORMANCE EVALUATION BOARD OUTLINE DIMENSIONS ORDERING GUIDE