Datasheet HMC589AST89E (Analog Devices) - 4
| Hersteller | Analog Devices |
| Beschreibung | InGaP HBT GAIN BLOCK MMIC AMPLIFIER, DC - 4 GHz |
| Seiten / Seite | 6 / 4 — HMC589AST89E. InGaP HBT GAIN BLOCK. MMIC AMPLIFIER, DC - 4 GHz. Absolute … |
| Dateiformat / Größe | PDF / 914 Kb |
| Dokumentensprache | Englisch |
HMC589AST89E. InGaP HBT GAIN BLOCK. MMIC AMPLIFIER, DC - 4 GHz. Absolute Maximum Ratings. Outline Drawing. Package Information
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HMC589AST89E
v02.0617
InGaP HBT GAIN BLOCK MMIC AMPLIFIER, DC - 4 GHz Absolute Maximum Ratings
Collector Bias Voltage (Vcc) +5.5 Vdc +10 dBm up to 1 GHz ELECTROSTATIC SENSITIVE DEVICE RF Input Power (RFIN)(Vcc = +5 Vdc) +8 dBm from 1-4 GHz T OBSERVE HANDLING PRECAUTIONS Junction Temperature 150 °C M Continuous Pdiss (T = 85 °C) 0.51 W (derate 7.84 mW/°C above 85 °C) Thermal Resistance 127.6 °C/W K - S (junction to ground paddle) C Storage Temperature -65 to +150 °C Operating Temperature -40 to +85 °C LO ESD Sensitivity (HBM) Class 2 IN B A
Outline Drawing
S & G R IE LIF P M A NOTES: 1. PACKAGE BODY MATERIAL: MOLDING COMPOUND MP-180S OR EQUIVALENT. 2. LEAD MATERIAL: Cu w/ Ag SPOT PLATING. 3. LEAD PLATING: 100% MATTE TIN. 4. DIMENSIONS ARE IN INCHES [MILLIMETERS] 5. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE. 6. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE. 7. ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND.
Package Information
Part Number Package Body Material Lead Finish MSL Rating Package Marking [2] HMC589AST89E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL1 [1] H589A XXXX [1] Max peak reflow temperature of 260 °C [2] 4-Digit lot number XXXX For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com Application Support: Phone: 1-800-ANALOG-D
4
v02.0617
InGaP HBT GAIN BLOCK MMIC AMPLIFIER, DC - 4 GHz Absolute Maximum Ratings
Collector Bias Voltage (Vcc) +5.5 Vdc +10 dBm up to 1 GHz ELECTROSTATIC SENSITIVE DEVICE RF Input Power (RFIN)(Vcc = +5 Vdc) +8 dBm from 1-4 GHz T OBSERVE HANDLING PRECAUTIONS Junction Temperature 150 °C M Continuous Pdiss (T = 85 °C) 0.51 W (derate 7.84 mW/°C above 85 °C) Thermal Resistance 127.6 °C/W K - S (junction to ground paddle) C Storage Temperature -65 to +150 °C Operating Temperature -40 to +85 °C LO ESD Sensitivity (HBM) Class 2 IN B A
Outline Drawing
S & G R IE LIF P M A NOTES: 1. PACKAGE BODY MATERIAL: MOLDING COMPOUND MP-180S OR EQUIVALENT. 2. LEAD MATERIAL: Cu w/ Ag SPOT PLATING. 3. LEAD PLATING: 100% MATTE TIN. 4. DIMENSIONS ARE IN INCHES [MILLIMETERS] 5. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE. 6. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE. 7. ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND.
Package Information
Part Number Package Body Material Lead Finish MSL Rating Package Marking [2] HMC589AST89E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL1 [1] H589A XXXX [1] Max peak reflow temperature of 260 °C [2] 4-Digit lot number XXXX For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com Application Support: Phone: 1-800-ANALOG-D
4