Datasheet MMBT3906 (NXP) - 6
| Hersteller | NXP |
| Beschreibung | PNP switching transistor |
| Seiten / Seite | 8 / 6 — PACKAGE OUTLINE. Plastic surface mounted package; 3 leads. SOT23. … |
| Dateiformat / Größe | PDF / 149 Kb |
| Dokumentensprache | Englisch |
PACKAGE OUTLINE. Plastic surface mounted package; 3 leads. SOT23. DIMENSIONS (mm are the original dimensions). UNIT. max
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NXP Semiconductors Product data sheet PNP switching transistor MMBT3906
PACKAGE OUTLINE Plastic surface mounted package; 3 leads SOT23
D B E A X HE v M A
3
Q A A1
1 2
c e1 bp w M B Lp e detail X 0 1 2 mm scale
DIMENSIONS (mm are the original dimensions) A1 UNIT A b e v max. p c D E e1 HE Lp Q w
1.1 0.48 0.15 3.0 1.4 2.5 0.45 0.55 mm 0.1 1.9 0.95 0.2 0.1 0.9 0.38 0.09 2.8 1.2 2.1 0.15 0.45
REFERENCES OUTLINE EUROPEAN ISSUE DATE VERSION PROJECTION IEC JEDEC EIAJ
97-02-28 SOT23 TO-236AB 99-09-13 2003 Mar 18 6 Document Outline Features Applications Description Marking Pinning Quick reference data Limiting values Thermal characteristics Characteristics Package outline Data sheet status Disclaimers
PACKAGE OUTLINE Plastic surface mounted package; 3 leads SOT23
D B E A X HE v M A
3
Q A A1
1 2
c e1 bp w M B Lp e detail X 0 1 2 mm scale
DIMENSIONS (mm are the original dimensions) A1 UNIT A b e v max. p c D E e1 HE Lp Q w
1.1 0.48 0.15 3.0 1.4 2.5 0.45 0.55 mm 0.1 1.9 0.95 0.2 0.1 0.9 0.38 0.09 2.8 1.2 2.1 0.15 0.45
REFERENCES OUTLINE EUROPEAN ISSUE DATE VERSION PROJECTION IEC JEDEC EIAJ
97-02-28 SOT23 TO-236AB 99-09-13 2003 Mar 18 6 Document Outline Features Applications Description Marking Pinning Quick reference data Limiting values Thermal characteristics Characteristics Package outline Data sheet status Disclaimers