Datasheet MBRF20100CT (ON Semiconductor) - 4

MBRF20100CTG PACKAGE DIMENSIONS TO−220 FULLPACK, 3−LEAD
CASE 221AH ISSUE F
SEATING
NOTES:
A B PLANE
1. DIMENSIONING AND TOLERANCING PER ASME
E
Y14.5M, 1994.
E/2 P A
2. CONTROLLING DIMENSION: MILLIMETERS.
H1 A1
3. CONTOUR UNCONTROLLED IN THIS AREA. 0.14 M B A M 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH AND GATE PROTRUSIONS. MOLD FLASH AND GATE PROTRUSIONS NOT TO EXCEED 0.13 PER SIDE. THESE DIMENSIONS ARE TO BE
Q
MEASURED AT OUTERMOST EXTREME OF THE PLASTIC BODY.
D
5. DIMENSION b2 DOES NOT INCLUDE DAMBAR PROTRUSION.
C
LEAD WIDTH INCLUDING PROTRUSION SHALL NOT EXCEED 2.00.
1 2 3 NOTE 3
6. CONTOURS AND FEATURES OF THE MOLDED PACKAGE BODY MAY VARY WITHIN THE ENVELOP DEFINED BY DIMENSIONS A1 AND H1 FOR MANUFACTURING PURPOSES.
MILLIMETERS L L1 DIM MIN MAX A
4.30 4.70
A1
2.50 2.90
3X b c A2
2.50 2.90
b
0.54 0.84
3X b2
0.25 M B A M C
b2
1.10 1.40
A2 c
0.49 0.79
e D
14.70 15.30
SIDE VIEW E
9.70 10.30
FRONT VIEW e
2.54 BSC
H1
6.60 7.10
L
12.50 14.73
L1
--- 2.80
P
3.00 3.40
SECTION D−D Q
2.80 3.20
A NOTE 6 NOTE 6 H1 D D A SECTION A−A ALTERNATE CONSTRUCTION
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