Datasheet TDC-GPX2 (AustriaMicroSystems) - 7

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TDC-GPX2 −
Absolute Maximum Ratings Stresses beyond the Absolute Maximum Ratings may cause
Absolute Maximum Ratings
permanent damages to the device. Exposure to any Absolute Maximum Rating condition for extended periods may also affect device reliability and lifetime.
Figure 6: Absolute Maximum Ratings Symbol Parameter Min Max Units Comments Electrical Parameters
VDD33 3.3V Supply Voltage to Ground -0.5 4.0 V Pins DVDD33, TVDD33, RVDD33 VDD18 1.8V Supply Voltage to Ground -0.5 2.2 V Pins DVDD18, TVDD18, CVDD18 Voltage between ground pins -0.3 +0.3 V Pins DGND, TGND, RGND, CGND Pins STOP1, STOP2, STOP3, VDD33 STOP4, ViLVDS Voltage at differential input pins -0.3 V + 0.3 REFCLK, REFRES, DISABLE, LCLKIN VDD18 Vosc Voltage at input of oscillator cell -0.3 V Pin REFOSCIN +0.3
Electrostatic Discharge
ESDHBM Electrostatic Discharge HBM ± 1000 V JS-001-2014
Temperature Ranges and Storage Conditions
TJ Operating Junction Temperature -40 125 °C TSTRG Storage Temperature Range -65 150 °C The reflow peak soldering temperature (body temperature) is specified according to IPC/JEDEC J-STD-020 “Moisture/Reflow Sensitivity TBODY Package Body Temperature 260 °C Classification for Non-hermetic Solid State Surface Mount Devices.” The lead finish for Pb-free leaded packages is “Matte Tin” (100% Sn) Relative Humidity RHNC 5 85 % (non-condensing) Maximum floor life time of 168 MSL Moisture Sensitivity Level 3 hours
ams Datasheet Page 7
[v1-03] 2017-Dec-18 Document Feedback Document Outline General Description Key Benefits & Features Applications Block Diagram Pin Assignments Pin Diagram Pin Description Absolute Maximum Ratings Recommended Operation Conditions Converter Characteristics Power Supply Characteristic Reference Clock and Stop Input Requirements LVDS Data Interface Characteristics Serial Communication Interface Typical Operating Characteristics Histograms Integral Non-Linearity Register Description Configuration Register Overview Detailed Configuration Register Description Read Register Overview Detailed Description Time Measurements and Results Measurements of TDC-GPX2 Output Results Calculation of Time Differences Resolution RMS-Resolution Versus Effective Resolution High Resolution Combining Two Stop Channels Channel Combination for Low Pulse-to-Pulse Spacing Channel Combination for Pulse Width Measurement Input Pins for Time Measurement REFCLKP/N: Reference Clock Input REFOSCI/O: Quartz Driver as Reference Clock RSTIDXP/N: Reference Index Counter Reset STOP1…STOP4P/N: Stop Channels DISABLE/N: Stop Disable Input Levels, CMOS or LVDS LVDS Output Interface Digital Output Interface Output Setup and Configuration: LVDS Output Buffers Differential LCLKIN Input LVDS Single Data Read Output Interface (SDR) LVDS Double Data Read Output Interface (DDR) LVDS Output Test Pattern SPI Communication Interface General Detailed Pin Description Communication Commands (Opcodes) Detailed Command Description Initialization Reset Write / Incremental Write Read / Incremental Read Using SPI Interface for Read-Out of Stop Results Coding of Results Configuration of LSB by REFCLK_DIVISIONS Examples for Codes of Time Measurements Results Maximum Time Differences Conversion Latency and Conversion Rate Converter Latency LVDS Synchronization Latency Conversion Rate Peak Conversion Rate Read-Out Rate Average Conversion Rate Examples for Read-Out Rate with LVDS FIFOs for Adapting Peak and Average Conversion Rate Application Information Configuration Examples Typical Configuration for LVDS Example C++ Code Schematic External Components PCB Layout Package Drawings & Markings Mechanical Data QFN64 QFN64 Tray Information QFP64 QFP64 Tape & Reel Information Soldering & Storage Information Ordering & Contact Information RoHS Compliant & ams Green Statement Copyrights & Disclaimer Document Status Revision Information Content Guide