Datasheet AS6500 (AustriaMicroSystems) - 9

Document Feedback AS6500 Absolute Maximum Ratings
4 Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings“ may cause permanent damage to the device. These are stress ratings only. Functional operation of the device at these or any other conditions beyond those indicated under “Operating Conditions” is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Figure 5: Absolute Maximum Ratings of AS6500 Symbol Parameter Min Max Unit Comments Electrical Parameters
VDD33 3.3V Supply Voltage to Ground -0.5 4.0 V Pin: DVDD33, TVDD33, RVDD33 VDD18 1.8V Supply Voltage to Ground -0.5 2.2 V Pin: DVDD18, TVDD18, CVDD18 Voltage between ground pins -0.3 +0.3 V Pin: DGND, TGND, RGND Vosc Voltage at input of oscillator -0.3 VDD18 + V Pin: REFOSCIN cell 0.3
Electrostatic Discharge
ESDHBM Electrostatic Discharge HBM ± 1000 V JS-001-2014
Temperature Ranges and Storage Conditions
Operating Junction TJ -40 125 °C Temperature TSTRG Storage Temperature Range - 65 150 °C TBODY Package Body Temperature 260 °C IPC/JEDEC J-STD-020 (1) Relative Humidity (non- RHNC 5 85 % condensing) Maximum floor life time of MSL Moisture Sensitivity Level 3 168h (1) The reflow peak soldering temperature (body temperature) is specified according to IPC/JEDEC J-STD-020 “Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices.” The lead finish for Pb-free leaded packages is “Matte Tin” (100 % Sn) Datasheet • PUBLIC DS000640 • v3-00 • 2019-Feb-21 56 │ 9 Document Outline Content Guide 1 General Description 1.1 Key Benefits & Features 1.2 Applications 1.3 Block Diagram 2 Ordering Information 3 Pin Assignment 3.1 Pin Diagram 3.2 Pin Description 4 Absolute Maximum Ratings 5 Recommended Operation Conditions 6 Typical Characteristics 6.1 Converter Characteristics 6.2 Power Supply Characteristics 6.3 Reference Clock and Stop Input Requirements 6.4 Serial Communication Interface 6.5 Typical Operating Characteristics 7 Register Description 7.1 Register Overview 7.2 Detailed Register Description 7.2.1 CFG0 Register (Address 0) 7.2.2 CFG1 Register (Address 1) 7.2.3 CFG2 Register (Address 2) 7.2.4 CFG3, CFG4, CFG5 Registers (Addresses 3 to 5) 7.2.5 CFG6 Register (Address 6) 7.2.6 CFG7 Register (Address 7) 7.2.7 CFG8 to CFG15 Register (Addresses 8 to 15) 7.2.8 CFG16 Register (Address 16) 7.2.9 CHANNEL1 Result Register (Addresses 8 to 13) 7.2.10 CHANNEL2 Result Register (Addresses 14 to 19) 7.2.11 CHANNEL3 Result Register (Addresses 20 to 25) 7.2.12 CHANNEL4 Result Register (Addresses 26 to 31) 8 Detailed Description 8.1 Time Measurements and Results 8.1.1 Measurements of AS6500 8.1.2 Output Results 8.1.3 Calculation of Time Differences GENERAL APPROACH 8.2 Resolution 8.2.1 RMS-Resolution versus Effective Resolution 8.2.2 High Resolution 8.3 Combining Two Stop Channels 8.3.1 Channel Combination for Low Pulse-to-Pulse Spacing 8.3.2 Channel Combination for Pulse Width Measurement 8.4 Input Pins for Time Measurement 8.4.1 REFCLK: Reference Clock Input 8.4.2 RSTIDX: Reference Index Counter Reset 8.4.3 STOP1 to STOP4: Stop Channels 8.4.4 DISABLE: Stop Disable SOFTWARE ENABLE (HIT_ENA_STOP1…4) PIN ENABLE (PIN_ENA_XXX) 8.5 SPI Communication Interface 8.5.1 General 8.5.2 Detailed Pin Description 8.5.3 Communication Commands (Opcodes) 8.5.4 Data Readout via SPI Interface 8.6 Coding of Results 8.6.1 Configuration of LSB by REFCLK_DIVISIONS 8.6.2 Examples for Codes of Time Measurements Results 8.6.3 Maximum Time Differences 8.7 Conversion Latency and Conversion Rate Converter Latency 8.8 Conversion Rate 8.8.1 Peak Conversion Rate 8.8.2 Read-Out Rate 8.8.3 Average Conversion Rate 8.8.4 FIFOs for Adapting Peak and Average Conversion Rate 9 Application Information 9.1 Configuration Examples 9.2 Example C++ Code 9.3 Schematic 9.4 External Components 10 Package Drawings & Markings 11 Reel Information 12 Soldering & Storage Information 13 Revision Information 14 Legal Information