Datasheet ADM3053 (Analog Devices) - 9
| Hersteller | Analog Devices |
| Beschreibung | Signal and Power Isolated CAN Transceiver with Integrated Isolated DC-to-DC Converter |
| Seiten / Seite | 18 / 9 — Data Sheet. ADM3053. TYPICAL PERFORMANCE CHARACTERISTICS. 160. 180. 140. … |
| Revision | E |
| Dateiformat / Größe | PDF / 527 Kb |
| Dokumentensprache | Englisch |
Data Sheet. ADM3053. TYPICAL PERFORMANCE CHARACTERISTICS. 160. 180. 140. VCC = 4.5V, VIO = 5V. 175. 120. S (m. (mA). ESI. 170. 100. , I CC
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Data Sheet ADM3053 TYPICAL PERFORMANCE CHARACTERISTICS 160 180 140 VCC = 4.5V, VIO = 5V V) 175 120 S (m (mA) ESI 170 100 , I CC VCC = 5.5V, VIO = 5V ER NT VCC = 5V, VIO = 5V YST 80 165 T H 60 INPU PLY CURRE 160 40 VER SUP EI VCC = 5V, VIO = 5V 155 20 REC VCC = 5V, VIO = 3.3V 0 150 100 1000
100
–40 –15 10 35 60 85
103
DATA RATE (kbps)
09293-
TEMPERATURE (°C)
09293- Figure 5. Supply Current, ICC vs. Data Rate Figure 8. Receiver Input Hysteresis vs. Temperature
50 53 45 IVE, ACT 52 40 35 BUS O µs) 51 30 N T VCC = 5V, VIO = 3.3V TE (V/ xD O (ns) A 25 T D 50 R 20 EW LAY t onTx SL 49 15 N DE IO VCC = 5V, VIO = 5V 10 AT 48 5 PAG 0 PRO 47 0 10 20 30 40 50 60 70 80
101
–40 –15 10 35 60 85
104
RESISTANCE, RS (kΩ) TEMPERATURE (°C)
09293- 09293- Figure 6. Driver Slew Rate vs. Resistance, R Figure 9. Propagation Delay from TxD On to Bus Active vs. Temperature S
5.5 96 S 94 U 4.5 92 VCC = 5V, VIO = 3.3V (mA) OFF TO B 90 (ns) , I IO D 3.5 D NT fTx 88 Y Tx ELA 86 IVE,t of 2.5 D VCC = 5V, VIO = 5V PLY CURRE 84 TION INACT V GA SUP IO = 5V A 82 1.5 OP V PR 80 IO = 3.3V 0.5 78 100 1000
102
–40 –15 10 35 60 85
105
DATA RATE (kbps) TEMPERATURE (°C)
09293- 09293- Figure 7. Supply Current, I Figure 10. Propagation Delay from TxD Off to Bus Inactive vs. Temperature IO vs. Data Rate Rev. E | Page 9 of 18 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS TIMING SPECIFICATIONS SWITCHING CHARACTERISTICS REGULATORY INFORMATION INSULATION AND SAFETY-RELATED SPECIFICATIONS VDE 0884 INSULATION CHARACTERISTICS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS TEST CIRCUITS CIRCUIT DESCRIPTION CAN TRANSCEIVER OPERATION SIGNAL ISOLATION POWER ISOLATION TRUTH TABLES THERMAL SHUTDOWN DC CORRECTNESS AND MAGNETIC FIELD IMMUNITY APPLICATIONS INFORMATION PCB LAYOUT EMI CONSIDERATIONS RS PIN INSULATION LIFETIME TYPICAL APPLICATIONS OUTLINE DIMENSIONS ORDERING GUIDE
100
–40 –15 10 35 60 85
103
DATA RATE (kbps)
09293-
TEMPERATURE (°C)
09293- Figure 5. Supply Current, ICC vs. Data Rate Figure 8. Receiver Input Hysteresis vs. Temperature
50 53 45 IVE, ACT 52 40 35 BUS O µs) 51 30 N T VCC = 5V, VIO = 3.3V TE (V/ xD O (ns) A 25 T D 50 R 20 EW LAY t onTx SL 49 15 N DE IO VCC = 5V, VIO = 5V 10 AT 48 5 PAG 0 PRO 47 0 10 20 30 40 50 60 70 80
101
–40 –15 10 35 60 85
104
RESISTANCE, RS (kΩ) TEMPERATURE (°C)
09293- 09293- Figure 6. Driver Slew Rate vs. Resistance, R Figure 9. Propagation Delay from TxD On to Bus Active vs. Temperature S
5.5 96 S 94 U 4.5 92 VCC = 5V, VIO = 3.3V (mA) OFF TO B 90 (ns) , I IO D 3.5 D NT fTx 88 Y Tx ELA 86 IVE,t of 2.5 D VCC = 5V, VIO = 5V PLY CURRE 84 TION INACT V GA SUP IO = 5V A 82 1.5 OP V PR 80 IO = 3.3V 0.5 78 100 1000
102
–40 –15 10 35 60 85
105
DATA RATE (kbps) TEMPERATURE (°C)
09293- 09293- Figure 7. Supply Current, I Figure 10. Propagation Delay from TxD Off to Bus Inactive vs. Temperature IO vs. Data Rate Rev. E | Page 9 of 18 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS TIMING SPECIFICATIONS SWITCHING CHARACTERISTICS REGULATORY INFORMATION INSULATION AND SAFETY-RELATED SPECIFICATIONS VDE 0884 INSULATION CHARACTERISTICS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS TEST CIRCUITS CIRCUIT DESCRIPTION CAN TRANSCEIVER OPERATION SIGNAL ISOLATION POWER ISOLATION TRUTH TABLES THERMAL SHUTDOWN DC CORRECTNESS AND MAGNETIC FIELD IMMUNITY APPLICATIONS INFORMATION PCB LAYOUT EMI CONSIDERATIONS RS PIN INSULATION LIFETIME TYPICAL APPLICATIONS OUTLINE DIMENSIONS ORDERING GUIDE