Datasheet LTM4650 (Analog Devices) - 2

HerstellerAnalog Devices
BeschreibungDual 25A or Single 50A DC/DC μModule Regulator
Seiten / Seite34 / 2 — ABSOLUTE MAXIMUM RATINGS. PIN CONFIGURATION. (Note 1). ORDER INFORMATION. …
RevisionC
Dateiformat / GrößePDF / 831 Kb
DokumentenspracheEnglisch

ABSOLUTE MAXIMUM RATINGS. PIN CONFIGURATION. (Note 1). ORDER INFORMATION. PART MARKING*. PACKAGE. MSL. TEMPERATURE RANGE. PART NUMBER

ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION (Note 1) ORDER INFORMATION PART MARKING* PACKAGE MSL TEMPERATURE RANGE PART NUMBER

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LTM4650
ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION (Note 1)
VIN ..–0.3V to 16V TOP VIEW V TEMP EXTV SW1, VSW2 ..–1V to 16V CC PGOOD1, PGOOD2, RUN1, RUN2, M INTVCC, EXTVCC .. –0.3V to 6V L MODE_PLLIN, fSET, TRACK1, TRACK2, K DIFFOUT, PHASMD ... –0.3V to INTVCC J V INTV OUT1, VOUT2, VOUTS1, VOUTS2 ... –0.3V to 6V CLKOUT H CC SW1 SW2 DIFFP, DIFFN ... –0.3V to INTVCC G PGOOD1 PHASMD RUN1 SGND PGOOD2 COMP1, COMP2, V RUN2 FB1, VFB2 (Note 5) .. –0.3V to 2.7V F MODE_PLLIN GND COMP1 COMP2 DIFFOUT INTV DIFFP CC Peak Output Current ..100mA E DIFFN TRACK1 SGND VFB2 TRACK2 GND Internal Operating Temperature Range (Note 2) VFB1 D f V SET SGND OUTS2 LTM4650E, LTM4650I ... –40°C to 125°C C VOUTS1 LTM4650MP .. –55°C to 125°C B V GND OUT2 Storage Temperature Range .. –55°C to 125°C A Peak Package Body Temperature .. 245°C 1 2 3 4 5 6 7 8 9 10 11 12 BGA PACKAGE 144-LEAD (16mm × 16mm × 5.01mm) TJMAX = 125°C, θJA = 7°C/W, θJCbottom = 1.5°C/W, θJCtop = 3.7°C/W, θJB + θJBA ≅ 7°C/W θ VALUES DEFINED PER JESD 51-12 WEIGHT = 3.2g
ORDER INFORMATION PART MARKING* PACKAGE MSL TEMPERATURE RANGE PART NUMBER PAD OR BALL FINISH DEVICE FINISH CODE TYPE RATING (Note 2)
LTM4650EY#PBF SAC305 (RoHS) LTM4650Y e1 BGA 3 –40°C to 125°C LTM4650IY#PBF SAC305 (RoHS) LTM4650Y e1 BGA 3 –40°C to 125°C LTM4650IY SnPb (63/37) LTM4650Y e0 BGA 3 –40°C to 125°C LTM4650MPY#PBF SAC305 (RoHS) LTM4650Y e1 BGA 3 –55°C to 125°C LTM4650MPY SnPb (63/37) LTM4650Y e0 BGA 3 –55°C to 125°C Contact the factory for parts specified with wider operating temperature ranges. *Device temperature grade is indicated by a label on the shipping container. Pad or ball finish code is per IPC/JEDEC J-STD-609. • Recommended LGA and BGA PCB Assembly and Manufacturing Procedures • LGA and BGA Package and Tray Drawings Rev. C 2 For more information www.analog.com Document Outline Description Typical Application Absolute Maximum Ratings Pin Configuration Electrical Characteristics Typical Performance Characteristics Pin Functions Operation Applications Information Related Parts Features Applications Typical Application Description Absolute Maximum Ratings Order Information Pin Configuration Electrical Characteristics Typical Performance Characteristics Pin Functions Simplified Block Diagram Decoupling Requirements Operation Applications Information Typical Applications Package Description Revision History Package Photo Design Resources Related Parts