Datasheet LTM4632 (Analog Devices) - 2
| Hersteller | Analog Devices |
| Beschreibung | Ultrathin, Triple Output, Step-Down μModule Regulator for DDR-QDR4 Memory |
| Seiten / Seite | 28 / 2 — ABSOLUTE MAXIMUM RATINGS. PIN CONFIGURATION. (Note 1). (See Pin … |
| Revision | D |
| Dateiformat / Größe | PDF / 2.5 Mb |
| Dokumentensprache | Englisch |
ABSOLUTE MAXIMUM RATINGS. PIN CONFIGURATION. (Note 1). (See Pin Functions, Pin Configuration Table). ORDER INFORMATION
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LTM4632
ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION (Note 1) (See Pin Functions, Pin Configuration Table)
VIN ... –0.3V to 16V TOP VIEW VOUT ... –0.3V to 6V SYNC/ PGOOD1, PGOOD2 ... –0.3V to 16V COMP2 GND MODE GND COMP1 RUN1, RUN2 .. –0.3V to V 5 IN+0.3V PGOOD2 GND INTV VDDQIN PGOOD1 CC, TRACK/SS1, VDDQIN, VTTR ... –0.3V to 3.6V 4 FB1 INTVCC SYNC/MODE, COMP1, COMP2, VTTR VIN 3 TRACK/SS1 VIN FB1, FB2 ..–0.3V to INTV RUN1 CC RUN2 2 VIN Operating Internal Temperature Range VIN GND V 1 OUT2 VOUT1 (Notes 2, 3, 5) .. –40°C to 125°C A B C D E Storage Temperature Range .. –55°C to 125°C LGA PACKAGE 25-LEAD (6.25mm × 6.25mm × 1.82mm) Peak Solder Reflow Body Temperature ...260°C BGA PACKAGE 25-LEAD (6.25mm × 6.25mm × 2.42mm) TJMAX = 125°C, θJCtop = 17°C/W, θJCbottom = 11°C/W, θJB +θBA = 22°C/W, θJA = 20°C/W WEIGHT = 0.21g
ORDER INFORMATION PART MARKING* PACKAGE MSL TEMPERATURE RANGE PART NUMBER PAD OR BALL FINISH DEVICE FINISH CODE TYPE RATING (SEE NOTE 2)
LTM4632EV#PBF Au (RoHS) LTM4632V e4 LGA 3 –40°C to 125°C LTM4632IV#PBF Au (RoHS) LTM4632V e4 LGA 3 –40°C to 125°C LTM4632EY#PBF SAC305 (RoHS) LTM4632Y e1 BGA 3 –40°C to 125°C LTM4632IY#PBF SAC305 (RoHS) LTM4632Y e1 BGA 3 –40°C to 125°C LTM4632IY SnPb (63/37) LTM4632Y e0 BGA 3 –40°C to 125°C • Contact the factory for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Pad or ball finish code is per IPC/JEDEC J-STD-609. Procedures • LGA and BGA Package and Tray Drawings Rev. D 2 For more information www.analog.com Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Decoupling Requirements Operation Applications Information Package Description Revision History Package Photo Design Resources Related Parts
ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION (Note 1) (See Pin Functions, Pin Configuration Table)
VIN ... –0.3V to 16V TOP VIEW VOUT ... –0.3V to 6V SYNC/ PGOOD1, PGOOD2 ... –0.3V to 16V COMP2 GND MODE GND COMP1 RUN1, RUN2 .. –0.3V to V 5 IN+0.3V PGOOD2 GND INTV VDDQIN PGOOD1 CC, TRACK/SS1, VDDQIN, VTTR ... –0.3V to 3.6V 4 FB1 INTVCC SYNC/MODE, COMP1, COMP2, VTTR VIN 3 TRACK/SS1 VIN FB1, FB2 ..–0.3V to INTV RUN1 CC RUN2 2 VIN Operating Internal Temperature Range VIN GND V 1 OUT2 VOUT1 (Notes 2, 3, 5) .. –40°C to 125°C A B C D E Storage Temperature Range .. –55°C to 125°C LGA PACKAGE 25-LEAD (6.25mm × 6.25mm × 1.82mm) Peak Solder Reflow Body Temperature ...260°C BGA PACKAGE 25-LEAD (6.25mm × 6.25mm × 2.42mm) TJMAX = 125°C, θJCtop = 17°C/W, θJCbottom = 11°C/W, θJB +θBA = 22°C/W, θJA = 20°C/W WEIGHT = 0.21g
ORDER INFORMATION PART MARKING* PACKAGE MSL TEMPERATURE RANGE PART NUMBER PAD OR BALL FINISH DEVICE FINISH CODE TYPE RATING (SEE NOTE 2)
LTM4632EV#PBF Au (RoHS) LTM4632V e4 LGA 3 –40°C to 125°C LTM4632IV#PBF Au (RoHS) LTM4632V e4 LGA 3 –40°C to 125°C LTM4632EY#PBF SAC305 (RoHS) LTM4632Y e1 BGA 3 –40°C to 125°C LTM4632IY#PBF SAC305 (RoHS) LTM4632Y e1 BGA 3 –40°C to 125°C LTM4632IY SnPb (63/37) LTM4632Y e0 BGA 3 –40°C to 125°C • Contact the factory for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Pad or ball finish code is per IPC/JEDEC J-STD-609. Procedures • LGA and BGA Package and Tray Drawings Rev. D 2 For more information www.analog.com Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Decoupling Requirements Operation Applications Information Package Description Revision History Package Photo Design Resources Related Parts