LTM2887 PRODUCT SELECTION GUIDELTM2887 CY-3I#PBFLEAD FREE DESIGNATOR PBF = Lead Free LOGIC OPTION I = Inter-IC (I2C) Bus S = Serial Peripheral Interface (SPI) Bus INPUT VOLTAGE RANGE 3 = 3V to 3.6V 5 = 4.5V to 5.5V PACKAGE TYPE Y = Ball Grid Array (BGA) TEMPERATURE GRADE C = Commercial Temperature Range (0°C to 70°C) I = Industrial Temperature Range (–40°C to 85°C) H = Automotive Temperature Range (–40°C to 125°C) PRODUCT PART NUMBERORDER INFORMATION http://www.linear.com/product/LTM2887#orderinfoPART MARKINGPAD OR BALLPACKAGE MSL INPUT VOLTAGELOGICTEMPERATUREPART NUMBERFINISHDEVICEFINISH CODETYPERATING RANGEOPTIONRANGE LTM2887CY-3I#PBF 0°C to 70°C LTM2887IY-3I#PBF LTM2887Y-3I I2C –40°C to 85°C LTM2887HY-3I#PBF –40°C to 125°C 3V to 3.6V LTM2887CY-3S#PBF 0°C to 70°C LTM2887IY-3S#PBF LTM2887Y-3S SPI –40°C to 85°C LTM2887HY-3S#PBF –40°C to 125°C SAC305 (RoHS) e1 BGA 3 LTM2887CY-5I#PBF 0°C to 70°C LTM2887IY-5I#PBF LTM2887Y-5I I2C –40°C to 85°C LTM2887HY-5I#PBF –40°C to 125°C 4.5V to 5.5V LTM2887CY-5S#PBF 0°C to 70°C LTM2887IY-5S#PBF LTM2887Y-5S SPI –40°C to 85°C LTM2887HY-5S#PBF –40°C to 125°C • Device temperature grade is indicated by a label on the • Recommended BGA PCB Assembly and Manufacturing Procedures: shipping container. www.linear.com/BGA-assy • Pad or ball finish code is per IPC/JEDEC J-STD-609. • BGA Package and Tray Drawings: www.linear.com/packaging • Terminal Finish Part Marking: www.linear.com/leadfree • This product is moisture sensitive. For more information, go to: • This product is not recommended for second side reflow. For www.linear.com/BGA-assy more information, go to www.linear.com/BGA-assy 2887fb For more information www.linear.com/LTM2887 3 Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Pin Configuration Product Selection Guide Order Information Electrical Characteristics Switching Characteristics Isolation Characteristics Typical Performance Characteristics Pin Functions Block Diagrams Test Circuits Applications Information Typical Applications Package Description Revision History Typical Application Related Parts