Datasheet LT8705 (Analog Devices) - 2
Hersteller | Analog Devices |
Beschreibung | 80V VIN and VOUT Synchronous 4-Switch Buck-Boost DC/DC Controller |
Seiten / Seite | 44 / 2 — absoluTe MaxiMuM raTings (Note 1). pin conFiguraTion |
Dateiformat / Größe | PDF / 508 Kb |
Dokumentensprache | Englisch |
absoluTe MaxiMuM raTings (Note 1). pin conFiguraTion
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LT8705
absoluTe MaxiMuM raTings (Note 1)
VCSP-VCSN, VCSPIN-VCSNIN, CSNIN, CSPIN, CSPOUT, CSNOUT Voltage ..–0.3V to 80V VCSPOUT-VCSNOUT.. –0.3V to 0.3V VIN, EXTVCC Voltage .. –0.3V to 80V SS, CLKOUT, CSP, CSN Voltage ... –0.3V to 3V SW1, SW2 Voltage ..81V (Note 7) VC Voltage (Note 2) ... –0.3V to 2.2V BOOST1, BOOST2 Voltage ... –0.3V to 87V RT, LDO33, FBOUT Voltage .. –0.3V to 5V BG1, BG2, TG1, TG2 ... (Note 6) IMON_IN, IMON_OUT Voltage ... –0.3V to 5V Operating Junction Temperature Range SYNC Voltage .. –0.3V to 5.5V LT8705E (Notes 3, 8) ... –40°C to 125°C INTVCC, GATEVCC Voltage .. –0.3V to 7V LT8705I (Notes 3, 8) .. –40°C to 125°C VBOOST1-VSW1, VBOOST2-VSW2 ... –0.3V to 7V LT8705H (Notes 3, 8)... –40°C to 150°C SWEN, MODE Voltage .. –0.3V to 7V LT8705MP (Notes 3, 8) .. –55°C to 150°C SRVO_FBIN, SRVO_FBOUT Voltage ... –0.3V to 30V Storage Temperature Range .. –65°C to 150°C SRVO_I N, SRVO_IOUT Voltage ... –0.3V to 30V Lead Temperature (Soldering, 10 sec) FBIN, SHDN Voltage ... –0.3V to 30V FE Package ...300°C
pin conFiguraTion
TOP VIEW TOP VIEW INTVCC 1 38 VIN MODE 2 37 CSPIN CC IMON_IN 3 36 CSNIN IMON_IN MODE SWEN INTV V IN CSPIN CSNIN 38 37 36 35 34 33 32 SHDN 4 SHDN 1 31 CSPOUT CSN 5 34 CSPOUT CSN 2 30 CSNOUT CSP 6 CSP 3 29 EXTVCC LDO33 7 32 CSNOUT LDO33 4 28 SRVO_FBOUT FBIN 8 FBIN 5 27 SRVO_IOUT FBOUT 9 30 EXTVCC FBOUT 6 39 26 SRVO_IIN IMON_OUT 10 39 IMON_OUT 7 GND 25 SRVO_FBIN GND VC 11 28 BOOST1 VC 8 24 NC SS 12 SS 9 23 BOOST1 CLKOUT 13 26 TG1 CLKOUT 10 22 TG1 SYNC 14 SYNC 11 21 SW1 RT 15 24 SW1 RT 12 20 NC GND 16 13 14 15 16 17 18 19 BG1 17 22 SW2 CC GND BG1 BG2 TG2 SW2 GATEV 18 CC 21 TG2 GATEV BOOST2 BG2 19 20 BOOST2 UHF PACKAGE 38-LEAD (5mm × 7mm) PLASTIC QFN FE PACKAGE TJMAX = 125°C, θJA = 34°C/W VARIATION: FE38(31) EXPOSED PAD (PIN 39) IS GND, MUST BE SOLDERED TO PCB 38-LEAD PLASTIC TSSOP TJMAX = 125°C, θJA = 25°C/W EXPOSED PAD (PIN 39) IS GND, MUST BE SOLDERED TO PCB 8705ff 2 For more information www.linear.com/LT8705 Document Outline Features Description Applications Typical Application Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Typical Applications Package Description Revision History Typical Application Related Parts