Datasheet ADSP-BF606, ADSP-BF607, ADSP-BF608, ADSP-BF609 (Analog Devices)
Hersteller | Analog Devices |
Beschreibung | Blackfin Dual Core Embedded Processor |
Seiten / Seite | 112 / 1 — FEATURES. MEMORY. Dual-core symmetric high-performance Blackfin processor, |
Revision | A |
Dateiformat / Größe | PDF / 3.4 Mb |
Dokumentensprache | Englisch |
FEATURES. MEMORY. Dual-core symmetric high-performance Blackfin processor,
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link to page 52 Blackfin Dual Core Embedded Processor ADSP-BF606/ADSP-BF607/ADSP-BF608/ADSP-BF609
FEATURES MEMORY Dual-core symmetric high-performance Blackfin processor, Each core contains 148K bytes of L1 SRAM memory (proces- up to 500 MHz per core sor core-accessible) with multi-parity bit protection Each core contains two 16-bit MACs, two 40-bit ALUs, and a Up to 256K bytes of L2 SRAM memory with ECC protection 40-bit barrel shifter Dynamic memory controller provides 16-bit interface to a RISC-like register and instruction model for ease of single bank of DDR2 or LPDDR DRAM devices programming and compiler-friendly support Static memory controller with asynchronous memory inter- Advanced debug, trace, and performance monitoring face that supports 8-bit and 16-bit memories Pipelined Vision Processor provides hardware to process sig- 4 Memory-to-memory DMA streams, 2 of which feature CRC nal and image algorithms used for pre- and co-processing protection of video frames in ADAS or other video processing Flexible booting options from flash, SD EMMC, and SPI mem- applications ories and from SPI, link port and UART hosts Accepts a range of supply voltages for I/O operation. See Memory management unit provides memory protection Operating Conditions on Page 52 Off-chip voltage regulator interface 349-ball BGA package (19 mm × 19 mm), RoHS compliant SYSTEM CONTROL BLOCKS PERIPHERALS EMULATOR PLL & POWER FAULT EVENT DUAL TEST & CONTROL MANAGEMENT MANAGEMENT CONTROL WATCHDOG 2× TWI 8× TIMER 1× COUNTER L2 MEMORY 2× PWM CORE 0 CORE 1 32K BYTE ROM
B B
3× SPORT 256K BYTE 148K BYTE 148K BYTE 1× ACM PARITY BIT PROTECTED PARITY BIT PROTECTED ECC- L1 SRAM L1 SRAM PROTECTED INSTRUCTION/DATA INSTRUCTION/DATA SRAM 2× UART 112 GP I/O EMMC/RSI DMA SYSTEM 1× CAN 2× EMAC EXTERNAL WITH BUS 2× IEEE 1588 INTERFACES 2× SPI PIPELINED CRC STATIC VISION PROCESSOR 4× LINK PORT DYNAMIC MEMORY MEMORY CONTROLLER CONTROLLER VIDEO SUBSYSTEM HARDWARE 3× PPI FUNCTIONS PIXEL COMPOSITOR LPDDR 16 FLASH 16 USB 2.0 HS OTG DDR2 SRAM
Figure 1. Processor Block Diagram Blackfin and the Blackfin logo are registered trademarks of Analog Devices, Inc.
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Document Outline Blackfin Dual Core Embedded Processor Features Memory Table Of Contents Revision History General Description Blackfin Processor Core Instruction Set Description Processor Infrastructure DMA Controllers CRC Protection Event Handling Trigger Routing Unit (TRU) Pin Interrupts General-Purpose I/O (GPIO) Pin Multiplexing Memory Architecture Internal (Core-Accessible) Memory Static Memory Controller (SMC) Dynamic Memory Controller (DMC) I/O Memory Space Booting Video Subsystem Video Interconnect (VID) Pipelined Vision Processor (PVP) Pixel Compositor (PIXC) Parallel Peripheral Interface (PPI) Processor Safety Features Dual Core Supervision Multi-Parity-Bit-Protected L1 Memories ECC-Protected L2 Memories CRC-Protected Memories Memory Protection System Protection Watchpoint Protection Dual Watchdog Bandwidth Monitor Signal Watchdogs Up/Down Count Mismatch Detection Fault Management Additional Processor Peripherals Timers 3-Phase PWM Units Link Ports Serial Ports (SPORTs) ACM Interface General-Purpose Counters Serial Peripheral Interface (SPI) Ports UART Ports TWI Controller Interface Removable Storage Interface (RSI) Controller Area Network (CAN) 10/100 Ethernet MAC USB 2.0 On-the-Go Dual-Role Device Controller Power and Clock Management Crystal Oscillator (SYS_XTAL) USB Crystal Oscillator Clock Generation Clock Out/External Clock Power Management Reset Control Unit Voltage Regulation System Debug System Watchpoint Unit System Debug Unit Development Tools Integrated Development Environments (IDEs) EZ-KIT Lite Evaluation Board EZ-KIT Lite Evaluation Kits Software Add-Ins for CrossCore Embedded Studio Board Support Packages for Evaluation Hardware Middleware Packages Algorithmic Modules Designing an Emulator-Compatible DSP Board (Target) Additional Information Related Signal Chains ADSP-BF60x Detailed Signal Descriptions 349-Ball CSP_BGA Signal Descriptions GP I/O Multiplexing for 349-Ball CSP_BGA ADSP-BF60x Designer Quick Reference Specifications Operating Conditions Clock Related Operating Conditions Electrical Characteristics Total Internal Power Dissipation Processor — Absolute Maximum Ratings ESD Sensitivity Processor — Package Information Timing Specifications Clock and Reset Timing Power-Up Reset Timing Asynchronous Read Asynchronous Flash Read Asynchronous Page Mode Read Synchronous Burst Flash Read Asynchronous Write Asynchronous Flash Write All Accesses Bus Request/Bus Grant DDR2 SDRAM Clock and Control Cycle Timing DDR2 SDRAM Read Cycle Timing DDR2 SDRAM Write Cycle Timing Mobile DDR SDRAM Clock and Control Cycle Timing Mobile DDR SDRAM Read Cycle Timing Mobile DDR SDRAM Write Cycle Timing Enhanced Parallel Peripheral Interface Timing Link Ports Serial Ports Serial Peripheral Interface (SPI) Port—Master Timing Serial Peripheral Interface (SPI) Port—Slave Timing Serial Peripheral Interface (SPI) Port—SPI_RDY Slave Timing Serial Peripheral Interface (SPI) Port—Open Drain Mode Timing Serial Peripheral Interface (SPI) Port—SPI_RDY Timing General-Purpose Port Timing Timer Cycle Timing Up/Down Counter/Rotary Encoder Timing Pulse Width Modulator (PWM) Timing ADC Controller Module (ACM) Timing Universal Asynchronous Receiver-Transmitter (UART) Ports—Receive and Transmit Timing CAN Interface Universal Serial Bus (USB) On-The-Go—Receive and Transmit Timing RSI Controller Timing 10/100 Ethernet MAC Controller Timing JTAG Test And Emulation Port Timing Output Drive Currents Test Conditions Output Enable Time Measurement Output Disable Time Measurement Example System Hold Time Calculation Capacitive Loading Environmental Conditions Thermal Diode ADSP-BF60x 349-Ball CSP_BGA Ball Assignments 349-Ball CSP_BGA Ball Assignment (Numerical by Ball Number) 349-Ball CSP_BGA Ball Assignment (Alphabetical by Pin Name) 349-Ball CSP_BGA Ball Configuration Outline Dimensions Surface-Mount Design Automotive Products Ordering Guide