Datasheet LTC3563 (Analog Devices) - 3
| Hersteller | Analog Devices |
| Beschreibung | 500mA, Synchronous Step-Down DC/DC Converter with Selectable Output Voltage |
| Seiten / Seite | 16 / 3 — The. ELECTRICAL CHARACTERISTICS. denotes the specifi cations which apply … |
| Dateiformat / Größe | PDF / 288 Kb |
| Dokumentensprache | Englisch |
The. ELECTRICAL CHARACTERISTICS. denotes the specifi cations which apply over the full operating
Modelllinie für dieses Datenblatt
Textversion des Dokuments
LTC3563
The ELECTRICAL CHARACTERISTICS
●
denotes the specifi cations which apply over the full operating temperature range, otherwise specifi cations are at TA = 25°C. VIN = 3.6V unless otherwise noted. SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
VUVLO Undervoltage Lockout Threshold VIN Rising 2.0 2.3 V VIN Falling 1.8 1.9 V VRUN RUN Threshold ● 0.3 1.2 V IRUN RUN Leakage Current ● ±0.01 ±1 µA VSEL VSEL Threshold ● 0.3 1 1.2 V RSEL VSEL Pull-Up Resistance Resistance Between VSEL and VIN 1.3 2.2 3 MΩ
Note 1:
Stresses beyond those listed under Absolute Maximum Ratings
Note 4:
The converter is tested in a proprietary test mode that connects may cause permanent damage to the device. Exposure to any Absolute the output of the error amplifi er to the SW pin, which is connected to an Maximum Rating condition for extended periods may affect device external servo loop. reliability and lifetime. No pin should exceed 6V.
Note 5:
Dynamic supply current is higher due to the internal gate charge
Note 2:
The LTC3563 is guaranteed to meet performance specifi cations being delivered at the switching frequency. from 0°C to 85°C. Specifi cations over the –40°C to 85°C operating
Note 6:
The DFN switch on resistance is guaranteed by correlation to wafer temperature range are assured by design, characterization and correlation level measurements. with statistical process controls.
Note 7:
TJ is calculated from the ambient temperature TA and power
Note 3:
Failure to solder the Exposed Pad of the package to the PC board dissipation PD according to the following formula: will result in a thermal resistance much higher than 40°C/W. TJ = TA + (PD) • (θJA).
W U TYPICAL PERFOR A CE CHARACTERISTICS TA = 25°C unless otherwise specifi ed. Burst Mode Operation Start-Up from Shutdown Start-Up from Shutdown
RUN RUN SW 2V/DIV 2V/DIV 2V/DIV VOUT VOUT VOUT 50mV/DIV 1V/DIV 1V/DIV AC COUPLED IL IL 100mA/DIV IL 200mA/DIV 500mA/DIV VIN = 3.6V 2µs/DIV 3563 G01 VIN = 3.6V 400µs/DIV 3542 G02 VIN = 3.6V 400µs/DIV 3563 G03 VOUT = 1.87V VOUT = 1.87V VOUT = 1.87V ILOAD = 30mA ILOAD = 0A ILOAD = 500mA 3563f 3
The ELECTRICAL CHARACTERISTICS
●
denotes the specifi cations which apply over the full operating temperature range, otherwise specifi cations are at TA = 25°C. VIN = 3.6V unless otherwise noted. SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
VUVLO Undervoltage Lockout Threshold VIN Rising 2.0 2.3 V VIN Falling 1.8 1.9 V VRUN RUN Threshold ● 0.3 1.2 V IRUN RUN Leakage Current ● ±0.01 ±1 µA VSEL VSEL Threshold ● 0.3 1 1.2 V RSEL VSEL Pull-Up Resistance Resistance Between VSEL and VIN 1.3 2.2 3 MΩ
Note 1:
Stresses beyond those listed under Absolute Maximum Ratings
Note 4:
The converter is tested in a proprietary test mode that connects may cause permanent damage to the device. Exposure to any Absolute the output of the error amplifi er to the SW pin, which is connected to an Maximum Rating condition for extended periods may affect device external servo loop. reliability and lifetime. No pin should exceed 6V.
Note 5:
Dynamic supply current is higher due to the internal gate charge
Note 2:
The LTC3563 is guaranteed to meet performance specifi cations being delivered at the switching frequency. from 0°C to 85°C. Specifi cations over the –40°C to 85°C operating
Note 6:
The DFN switch on resistance is guaranteed by correlation to wafer temperature range are assured by design, characterization and correlation level measurements. with statistical process controls.
Note 7:
TJ is calculated from the ambient temperature TA and power
Note 3:
Failure to solder the Exposed Pad of the package to the PC board dissipation PD according to the following formula: will result in a thermal resistance much higher than 40°C/W. TJ = TA + (PD) • (θJA).
W U TYPICAL PERFOR A CE CHARACTERISTICS TA = 25°C unless otherwise specifi ed. Burst Mode Operation Start-Up from Shutdown Start-Up from Shutdown
RUN RUN SW 2V/DIV 2V/DIV 2V/DIV VOUT VOUT VOUT 50mV/DIV 1V/DIV 1V/DIV AC COUPLED IL IL 100mA/DIV IL 200mA/DIV 500mA/DIV VIN = 3.6V 2µs/DIV 3563 G01 VIN = 3.6V 400µs/DIV 3542 G02 VIN = 3.6V 400µs/DIV 3563 G03 VOUT = 1.87V VOUT = 1.87V VOUT = 1.87V ILOAD = 30mA ILOAD = 0A ILOAD = 500mA 3563f 3