Datasheet ADP5301 (Analog Devices) - 6
| Hersteller | Analog Devices |
| Beschreibung | 50 mA/500 mA, High Efficiency, Ultralow Power Step-Down Regulator |
| Seiten / Seite | 21 / 6 — ADP5301. Data Sheet. ABSOLUTE MAXIMUM RATINGS Table 2. THERMAL … |
| Revision | C |
| Dateiformat / Größe | PDF / 729 Kb |
| Dokumentensprache | Englisch |
ADP5301. Data Sheet. ABSOLUTE MAXIMUM RATINGS Table 2. THERMAL RESISTANCE. Parameter Rating. Table 3. Thermal Resistance
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ADP5301 Data Sheet ABSOLUTE MAXIMUM RATINGS Table 2. THERMAL RESISTANCE Parameter Rating
θJA is specified for the worst case conditions, that is, a device PVIN to PGND −0.3 V to +7 V soldered in a circuit board for surface-mount packages. SW to PGND −0.3 V to PVIN + 0.3 V
Table 3. Thermal Resistance
FB to AGND −0.3 V to +7 V
Package Type θ
VID to AGND −0.3 V to +7 V
JA Unit
EN to AGND −0.3 V to +7 V 9-Ball WLCSP 132 °C/W VOUTOK to AGND −0.3 V to +7 V SYNC/MODE to AGND −0.3 V to +7 V
ESD CAUTION
PGND to AGND −0.3 V to +0.3 V Storage Temperate Range −65°C to +150°C Operational Junction Temperature Range −40°C to +125°C Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. B | Page 6 of 21 Document Outline FEATURES APPLICATIONS TYPICAL APPLICATION CIRCUIT GENERAL DESCRIPTION REVISION HISTORY FUNCTIONAL BLOCK DIAGRAM SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION BUCK REGULATOR OPERATION MODES PWM Mode Hysteresis Mode Mode Selection OSCILLATOR AND SYNCHRONIZATION ADJUSTABLE AND FIXED OUTPUT VOLTAGES UNDERVOLTAGE LOCKOUT (UVLO) ENABLE/DISABLE CURRENT LIMIT SHORT-CIRCUIT PROTECTION SOFT START STARTUP WITH A PRECHARGED OUTPUT 100% DUTY CYCLE OPERATION ACTIVE DISCHARGE VOUTOK FUNCTION THERMAL SHUTDOWN APPLICATIONS INFORMATION EXTERNAL COMPONENT SELECTION SELECTING THE INDUCTOR OUTPUT CAPACITOR INPUT CAPACITOR EFFICIENCY Power Switch Conduction Losses Inductor Losses Driver Losses Transition Losses PRINTED CIRCUIT BOARD (PCB) LAYOUT RECOMMENDATIONS TYPICAL APPLICATION CIRCUITS FACTORY PROGRAMMABLE OPTIONS OUTLINE DIMENSIONS ORDERING GUIDE
θJA is specified for the worst case conditions, that is, a device PVIN to PGND −0.3 V to +7 V soldered in a circuit board for surface-mount packages. SW to PGND −0.3 V to PVIN + 0.3 V
Table 3. Thermal Resistance
FB to AGND −0.3 V to +7 V
Package Type θ
VID to AGND −0.3 V to +7 V
JA Unit
EN to AGND −0.3 V to +7 V 9-Ball WLCSP 132 °C/W VOUTOK to AGND −0.3 V to +7 V SYNC/MODE to AGND −0.3 V to +7 V
ESD CAUTION
PGND to AGND −0.3 V to +0.3 V Storage Temperate Range −65°C to +150°C Operational Junction Temperature Range −40°C to +125°C Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. B | Page 6 of 21 Document Outline FEATURES APPLICATIONS TYPICAL APPLICATION CIRCUIT GENERAL DESCRIPTION REVISION HISTORY FUNCTIONAL BLOCK DIAGRAM SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION BUCK REGULATOR OPERATION MODES PWM Mode Hysteresis Mode Mode Selection OSCILLATOR AND SYNCHRONIZATION ADJUSTABLE AND FIXED OUTPUT VOLTAGES UNDERVOLTAGE LOCKOUT (UVLO) ENABLE/DISABLE CURRENT LIMIT SHORT-CIRCUIT PROTECTION SOFT START STARTUP WITH A PRECHARGED OUTPUT 100% DUTY CYCLE OPERATION ACTIVE DISCHARGE VOUTOK FUNCTION THERMAL SHUTDOWN APPLICATIONS INFORMATION EXTERNAL COMPONENT SELECTION SELECTING THE INDUCTOR OUTPUT CAPACITOR INPUT CAPACITOR EFFICIENCY Power Switch Conduction Losses Inductor Losses Driver Losses Transition Losses PRINTED CIRCUIT BOARD (PCB) LAYOUT RECOMMENDATIONS TYPICAL APPLICATION CIRCUITS FACTORY PROGRAMMABLE OPTIONS OUTLINE DIMENSIONS ORDERING GUIDE