Datasheet LTC6255, LTC6256, LTC6257 (Analog Devices) - 2

HerstellerAnalog Devices
Beschreibung6.5MHz, 65µA Power Efficient Rail-to-Rail I/O Op Amps
Seiten / Seite26 / 2 — ABSOLUTE MAXIMUM RATINGS. (Note 1). PIN CONFIGURATION. OBSOLETE PACKAGE
RevisionE
Dateiformat / GrößePDF / 815 Kb
DokumentenspracheEnglisch

ABSOLUTE MAXIMUM RATINGS. (Note 1). PIN CONFIGURATION. OBSOLETE PACKAGE

ABSOLUTE MAXIMUM RATINGS (Note 1) PIN CONFIGURATION OBSOLETE PACKAGE

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LTC6255/LTC6256/LTC6257
ABSOLUTE MAXIMUM RATINGS (Note 1)
Supply Voltage: V+ – V– ...5.5V Specified Temperature Range (Note 5) Input Voltage ... V– – 0.2 to V+ + 0.2 LTC6255C/LTC6256C/LTC6257C ... 0°C to 70°C Input Current: +IN, –IN, SHDN (Note 2) ... ±10mA LTC6255I/LTC6256I/LTC6257I ..–40°C to 85°C Output Current: OUT ... ±20mA LTC6255H/LTC6256H/LTC6257H .. –40°C to 125°C Output Short-Circuit Duration (Note 3) .. Indefinite Maximum Junction Temperature .. 150°C Operating Temperature Range (Note 4) Storage Temperature Range .. –65°C to 150°C LTC6255C/LTC6256C/LTC6257C ...–40°C to 85°C Lead Temperature (Soldering, 10 sec) LTC6255I/LTC6256I/LTC6257I ..–40°C to 85°C S6, TS8, MS8, MS only ...300°C LTC6255H/LTC6256H/LTC6257H .. –40°C to 125°C
PIN CONFIGURATION
TOP VIEW OUTA 1 8 V+ TOP VIEW –INA 2 – 7 OUTB + 9 OUT 1 6 V+ +INA 3 – 6 V– –INB + V– 2 5 SHDN + – V– 4 5 +INB +IN 3 4 –IN KC PACKAGE S6 PACKAGE 8-LEAD (2mm × 2mm × 0.6mm) PLASTIC UTDFN 6-LEAD PLASTIC TSOT-23 T T JMAX = 125°C, qJA = 89°C/W (NOTE 6) JMAX = 150°C, θJA = 192°C/W (NOTE 6) EXPOSED PAD (PIN 9) IS V–, MUST BE SOLDERED TO PCB
OBSOLETE PACKAGE
TOP VIEW TOP VIEW OUTA 1 8 V+ OUTA 1 8 V+ –INA 2 – 7 OUTB –INA 2 – 7 OUTB + + +INA 3 – 6 –INB +INA 3 – 6 –INB + V– + 4 5 +INB V– 4 5 +INB TS8 PACKAGE MS8 PACKAGE 8-LEAD PLASTIC TSOT-23 8-LEAD PLASTIC MSOP T TJMAX = 150°C, θJA = 163°C/W (NOTE 6) JMAX = 150°C, θJA = 195°C/W (NOTE 6) TOP VIEW TOP VIEW OUTA 1 16 OUTD OUTA 1 10 V+ –INA 2 – – 15 –IND + + –INA 2 – 9 OUTB +INA 3 14 +IND +INA 3 + – 8 –INB V+ 4 13 V– V– 4 + 7 +INB +INB 5 + + 12 +INC – – SHDNA 5 6 SHDNB –INB 6 11 –INC OUTB 7 10 OUTC MS PACKAGE NC 8 9 NC 10-LEAD PLASTIC MSOP MS PACKAGE T 16-LEAD PLASTIC MSOP JMAX = 150°C, θJA = 160°C/W (NOTE 6) TJMAX = 150°C, θJA = 125°C/W (NOTE 6) TOP VIEW TOP VIEW OUTA 1 8 V+ V+ 1 6 OUT –INA 2 7 OUTB 9 +IN 2 7 5 –IN +INA 3 V– 6 –INB V– V– 3 4 SHDN V– 4 5 +INB DC PACKAGE DC PACKAGE 8-LEAD (2mm × 2mm × 0.8mm) PLASTIC DFN 6-LEAD (2mm × 2mm) PLASTIC DFN TJMAX = 125°C, θJA = 102°C/W (NOTE 6) TJMAX = 125°C, θJA = 102°C/W (NOTE 6) EXPOSED PAD (PIN 9) IS V–, MUST BE SOLDERED TO PCB EXPOSED PAD (PIN 7) IS V–, MUST BE SOLDERED TO PCB Rev E 2 For more information www.analog.com Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Pin Configuration Order Information 5V Electrical Characteristics 1.8V Electrical Characteristics Typical Performance Characteristics Pin Functions Simplified Schematic Operation Applications Information Typical Applications Package Description Typical Application Related Parts