Datasheet LT1222 (Analog Devices) - 9
| Hersteller | Analog Devices |
| Beschreibung | 500MHz, 3nV/√Hz, AV ≥ 10 Operational Amplifier |
| Seiten / Seite | 12 / 9 — PACKAGE DESCRIPTION. H Package. 8-Lead TO-5 Metal Can (.200 Inch PCD). J8 … |
| Dateiformat / Größe | PDF / 262 Kb |
| Dokumentensprache | Englisch |
PACKAGE DESCRIPTION. H Package. 8-Lead TO-5 Metal Can (.200 Inch PCD). J8 Package. 8-Lead CERDIP (Narrow .300 Inch, Hermetic)
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LT1222
U PACKAGE DESCRIPTION H Package 8-Lead TO-5 Metal Can (.200 Inch PCD)
(Reference LTC DWG # 05-08-1320) 0.335 – 0.370 (8.509 – 9.398) DIA 0.027 – 0.045 0.305 – 0.335 (0.686 – 1.143) (7.747 – 8.509) 45°TYP 0.040 PIN 1 0.028 – 0.034 (1.016) 0.050 MAX (1.270) 0.165 – 0.185 (0.711 – 0.864) MAX (4.191 – 4.699) 0.200 REFERENCE (5.080) SEATING PLANE PLANE GAUGE TYP PLANE 0.500 – 0.750 (12.700 – 19.050) 0.010 – 0.045* H8(TO-5) 0.200 PCD 1197 (0.254 – 1.143) 0.110 – 0.160 0.016 – 0.021** (2.794 – 4.064) (0.406 – 0.533) INSULATING STANDOFF *LEAD DIAMETER IS UNCONTROLLED BETWEEN THE REFERENCE PLANE AND 0.045" BELOW THE REFERENCE PLANE 0.016 – 0.024 **FOR SOLDER DIP LEAD FINISH, LEAD DIAMETER IS (0.406 – 0.610)
J8 Package 8-Lead CERDIP (Narrow .300 Inch, Hermetic)
(Reference LTC DWG # 05-08-1110) CORNER LEADS OPTION 0.405 (4 PLCS) (10.287) 0.005 MAX (0.127) MIN 8 7 6 5 0.023 – 0.045 (0.584 – 1.143) HALF LEAD OPTION 0.025 0.220 – 0.310 0.045 – 0.068 (0.635) (5.588 – 7.874) (1.143 – 1.727) RAD TYP FULL LEAD OPTION 1 2 3 4 0.200 0.300 BSC (5.080) (0.762 BSC) MAX 0.015 – 0.060 (0.381 – 1.524) 0.008 – 0.018 0° – 15° (0.203 – 0.457) 0.045 – 0.065 0.125 NOTE: LEAD DIMENSIONS APPLY TO SOLDER DIP/PLATE (1.143 – 1.651) 3.175 OR TIN PLATE LEADS MIN 0.014 – 0.026 0.100 (0.360 – 0.660) (2.54) BSC J8 1298
OBSOLETE PACKAGES
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U PACKAGE DESCRIPTION H Package 8-Lead TO-5 Metal Can (.200 Inch PCD)
(Reference LTC DWG # 05-08-1320) 0.335 – 0.370 (8.509 – 9.398) DIA 0.027 – 0.045 0.305 – 0.335 (0.686 – 1.143) (7.747 – 8.509) 45°TYP 0.040 PIN 1 0.028 – 0.034 (1.016) 0.050 MAX (1.270) 0.165 – 0.185 (0.711 – 0.864) MAX (4.191 – 4.699) 0.200 REFERENCE (5.080) SEATING PLANE PLANE GAUGE TYP PLANE 0.500 – 0.750 (12.700 – 19.050) 0.010 – 0.045* H8(TO-5) 0.200 PCD 1197 (0.254 – 1.143) 0.110 – 0.160 0.016 – 0.021** (2.794 – 4.064) (0.406 – 0.533) INSULATING STANDOFF *LEAD DIAMETER IS UNCONTROLLED BETWEEN THE REFERENCE PLANE AND 0.045" BELOW THE REFERENCE PLANE 0.016 – 0.024 **FOR SOLDER DIP LEAD FINISH, LEAD DIAMETER IS (0.406 – 0.610)
J8 Package 8-Lead CERDIP (Narrow .300 Inch, Hermetic)
(Reference LTC DWG # 05-08-1110) CORNER LEADS OPTION 0.405 (4 PLCS) (10.287) 0.005 MAX (0.127) MIN 8 7 6 5 0.023 – 0.045 (0.584 – 1.143) HALF LEAD OPTION 0.025 0.220 – 0.310 0.045 – 0.068 (0.635) (5.588 – 7.874) (1.143 – 1.727) RAD TYP FULL LEAD OPTION 1 2 3 4 0.200 0.300 BSC (5.080) (0.762 BSC) MAX 0.015 – 0.060 (0.381 – 1.524) 0.008 – 0.018 0° – 15° (0.203 – 0.457) 0.045 – 0.065 0.125 NOTE: LEAD DIMENSIONS APPLY TO SOLDER DIP/PLATE (1.143 – 1.651) 3.175 OR TIN PLATE LEADS MIN 0.014 – 0.026 0.100 (0.360 – 0.660) (2.54) BSC J8 1298
OBSOLETE PACKAGES
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