Datasheet ADL5569 (Analog Devices) - 6

ADL5569 Data Sheet ABSOLUTE MAXIMUM RATINGS Table 2. THERMAL RESISTANCE Parameter Rating
Thermal performance is directly linked to PCB design and Output Voltage Swing × Bandwidth Product 5 V-GHz operating environment. Careful attention to PCB thermal Supply Voltage (VS) at VCC and VCC2 5.25 V design is required. VIP, VIP2, VIN, and VIN2 VS + 0.5 V θJA is the natural convection junction to ambient thermal PDB, PDB2 3.6 V resistance measured in a one cubic foot sealed enclosure. θJC Maximum Output Current, IOUT (VIP, VIP2, ±30 mA is the junction to case thermal resistance. VIN, and VIN2 Pins) Internal Power Dissipation 1 W
Table 3. Thermal Resistance
Maximum Junction Temperature 125°C
Package Type θ 1 2 JA θJC Unit
Operating Temperature Range −40°C to +85°C CP-16-44 90.5 20.9 °C/W Storage Temperature Range −65°C to +150°C 1 Measured on an Analog Devices evaluation board. Stresses at or above those listed under Absolute Maximum 2 Based on simulation with JEDEC standard JESD51. Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these
ESD CAUTION
or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. A | Page 6 of 23 Document Outline Features Applications Functional Block Diagram General Description Revision History Specifications Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Theory of Operation Applications Information Basic Connections Input and Output Interfacing Single-Ended Input to Differential Output Gain Adjustment and Interfacing Effect of Load Capacitance GSPS ADC Interfacing Soldering Information and Recommended Land Pattern Evaluation Board Outline Dimensions Ordering Guide