Datasheet LTC6268-10, LTC6269-10 (Analog Devices) - 2
Hersteller | Analog Devices |
Beschreibung | Dual 4GHz Ultra-Low Bias Current FET Input Op Amp |
Seiten / Seite | 22 / 2 — ABSOLUTE MAXIMUM RATINGS (Note 1). PIN CONFIGURATION |
Dateiformat / Größe | PDF / 775 Kb |
Dokumentensprache | Englisch |
ABSOLUTE MAXIMUM RATINGS (Note 1). PIN CONFIGURATION
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Textversion des Dokuments
LTC6268-10/LTC6269-10
ABSOLUTE MAXIMUM RATINGS (Note 1)
Supply Voltage V+ to V– ...5.5V Specified Temperature Range (Note 4) Input Voltage ...V– – 0.2V to V+ + 0.2V LTC6268-10I/LTC6269-10I ...–40°C to 85°C Input Current (+IN, –IN) (Note 2) ... ±1mA LTC6268-10H/LTC6269-10H .. –40°C to 125°C Input Current (SHDN) .. ±1mA Maximum Junction Temperature .. 150°C Output Current (IOUT) (Note 8, 9) ...135mA Storage Temperature Range .. –65°C to 150°C Output Short-Circuit Duration (Note 3) ...Thermally Limited Lead Temperature S8, S6 and Operating Temperature Range MS8E (Soldering, 10 sec) ...300°C LTC6268-10I/LTC6269-10I ...–40°C to 85°C LTC6268-10H/LTC6269-10H .. –40°C to 125°C
PIN CONFIGURATION
TOP VIEW TOP VIEW NC 1 8 SHDN OUT 1 6 V+ –IN 2 7 V+ V– 2 5 SHDN +IN 3 6 OUT +IN 3 4 –IN NC 4 5 V– S6 PACKAGE S8 PACKAGE 6-LEAD PLASTIC TSOT-23 8-LEAD PLASTIC SO TJMAX = 150°C, θJA = 192°C/W (NOTE 5) TJMAX = 150°C, θJA = 120°C/W (NOTE 5) TOP VIEW TOP VIEW OUTA 1 10 V+ OUTA 1 8 V+ –INA 2 9 OUTB –INA 2 9 7 OUTB 11 +INA 3 V– 6 –INB +INA 3 8 –INB V– V– 4 5 +INB V– 4 7 +INB MS8E PACKAGE SDA 5 6 SDB 8-LEAD PLASTIC MSOP T DD PACKAGE JMAX = 150°C, θJA = 40°C/W (NOTE 5) EXPOSED PAD (PIN 9) IS V–, IT IS RECOMMENDED TO SOLDER TO PCB 10-LEAD (3mm × 3mm) PLASTIC DFN TJMAX = 150°C, θJA = 43°C/W (NOTE 5) EXPOSED PAD (PIN 11) IS V–, IT IS RECOMMENDED TO SOLDER TO PCB 626810f 2 For more information www.linear.com/LTC6268-10 Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Pin Configuration Order Information 5.0V Electrical Characteristics Typical Performance Characteristics Pin Functions Simplified Schematic Operation Applications Information Package Description Typical Application Related Parts