Datasheet ADE7953 (Analog Devices) - 68

HerstellerAnalog Devices
BeschreibungSingle Phase Multifunction Metering IC with Neutral Current Measurement
Seiten / Seite72 / 68 — ADE7953. Data Sheet. LAYOUT GUIDELINES. 0.1µF. 10µF. 2 RESET. ZX 1. …
RevisionC
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DokumentenspracheEnglisch

ADE7953. Data Sheet. LAYOUT GUIDELINES. 0.1µF. 10µF. 2 RESET. ZX 1. 4.7µF. 5 IAP. LL_. VINTD 3. 6 IAN. 9 IBP. VINTA 15. 10 IBN. CLKOUT 19. 20pF. 11 VN

ADE7953 Data Sheet LAYOUT GUIDELINES 0.1µF 10µF 2 RESET ZX 1 4.7µF 5 IAP LL_ VINTD 3 6 IAN 9 IBP VINTA 15 10 IBN CLKOUT 19 20pF 11 VN

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ADE7953 Data Sheet LAYOUT GUIDELINES
Figure 78 presents a basic schematic of the ADE7953 together with its surrounding circuitry, decoupling capacitors at pins VDD, VINTA, VINTD, and REF, and the 3.58 MHz crystal and its load capacitors. The rest of the pins are dependent on the particular application and are not shown here. Figure 77 presents a proposed layout of a printed circuit board (PCB) with two layers that have the components placed only on the top of the board. Following these layout guidelines will help in creating a low noise design with higher immunity to EMC influences. The VDD, VINTA, VINTD, and REF pins each have two decoupling capacitors, one of μF order and a ceramic one of 220 nF or 100 nF. These ceramic capacitors need to be placed closest to the ADE7953 as they decouple high frequency noises, while the μF ones need to be place in close proximity. The exposed pad of the ADE7953 is soldered to an equivalent pad on the PCB. The AGND, DGND, and PULL_LOW pins traces of the ADE7953 are then routed directly in to the PCB pad. 8 17 0- The bottom layer is composed mainly of a ground plane 932 0 surrounding as much as possible the through hole crystal pins. Figure 77. ADE7953 Top Layer Printed Circuit Board
C6 C5 0.1µF 10µF C3 7 8 17 0.1µF H H D IG IG 2 RESET C4 H H VD ZX 1 4.7µF 5 IAP LL_ LL_ VINTD 3 U U 6 IAN P P C1 9 IBP VINTA 15 0.1µF C7 10 IBN CLKOUT 19 20pF Y1 U1 C2 11 VN 4.7µF 3.58MHz 12 C8 ADE7953 IRQ 22 12 VP 20pF ZX_I 21 18 CLKIN REVP 20 25 SCLK CF1 23 27 MOSI/SCL/Rx 28 CS CF2 24 C9 13 REF MISO/SDA/Tx 26 0.1µF W LO C10 4.7µF ND ND D LL_ U DG AG PA P 4 16 14
77 1 0- 932 0 Figure 78. ADE7953 Crystal and Capacitors Connections Rev. C | Page 68 of 72 Document Outline FEATURES GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM REVISION HISTORY SPECIFICATIONS TIMING CHARACTERISTICS SPI Interface Timing SPI Interface Timing Diagram I2C Interface Timing I2C Interface Timing Diagram ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS TEST CIRCUIT TERMINOLOGY ADE7953 POWER-UP PROCEDURE REQUIRED REGISTER SETTING THEORY OF OPERATION ANALOG INPUTS Current Channel A Current Channel B Voltage Channel ANALOG-TO-DIGITAL CONVERSION Oversampling Noise Shaping Antialiasing Filter CURRENT CHANNEL ADCS di/dt Current Sensor and Digital Integrator VOLTAGE CHANNEL ADC REFERENCE CIRCUIT ROOT MEAN SQUARE MEASUREMENT CURRENT CHANNEL RMS CALCULATION VOLTAGE CHANNEL RMS CALCULATION ACTIVE POWER CALCULATION SIGN OF ACTIVE POWER CALCULATION ACTIVE ENERGY CALCULATION Active Energy Integration Time Under Steady Load Active Energy Line Cycle Accumulation Mode ACTIVE ENERGY ACCUMULATION MODES Signed Accumulation Mode Positive-Only Accumulation Mode Absolute Accumulation Mode REACTIVE POWER CALCULATION SIGN OF REACTIVE POWER CALCULATION REACTIVE ENERGY CALCULATION Reactive Energy Integration Time Under Steady Load Reactive Energy Line Cycle Accumulation Mode REACTIVE ENERGY ACCUMULATION MODES Signed Accumulation Mode Antitamper Accumulation Mode Absolute Accumulation Mode APPARENT POWER CALCULATION APPARENT ENERGY CALCULATION Apparent Energy Integration Time Under Steady Load Apparent Energy Line Cycle Accumulation Mode AMPERE-HOUR ACCUMULATION ENERGY-TO-FREQUENCY CONVERSION PULSE OUTPUT CHARACTERISTICS ENERGY CALIBRATION GAIN CALIBRATION Current Channel Gain Adjustment PHASE CALIBRATION OFFSET CALIBRATION Power Offsets RMS Offsets PERIOD MEASUREMENT INSTANTANEOUS POWERS AND WAVEFORM SAMPLING POWER FACTOR USING THE LINE CYCLE ACCUMULATION MODE TO DETERMINE THE POWER FACTOR POWER FACTOR WITH NO-LOAD DETECTION ANGLE MEASUREMENT NO-LOAD DETECTION SETTING THE NO-LOAD THRESHOLDS ACTIVE ENERGY NO-LOAD DETECTION Active Energy No-Load Interrupt Active Energy No-Load Status Bits REACTIVE ENERGY NO-LOAD DETECTION Reactive Energy No-Load Interrupt Reactive Energy No-Load Status Bits APPARENT ENERGY NO-LOAD DETECTION Apparent Energy No-Load Interrupt Apparent Energy No-Load Status Bits ZERO-CROSSING DETECTION ZERO-CROSSING OUTPUT PINS Voltage Channel Zero Crossing Current Channel Zero Crossing ZERO-CROSSING INTERRUPTS ZERO-CROSSING TIMEOUT ZERO-CROSSING THRESHOLD VOLTAGE SAG DETECTION SETTING THE SAGCYC REGISTER SETTING THE SAGLVL REGISTER VOLTAGE SAG INTERRUPT PEAK DETECTION INDICATION OF POWER DIRECTION REVERSE POWER SIGN INDICATION OVERCURRENT AND OVERVOLTAGE DETECTION SETTING THE OVLVL AND OILVL REGISTERS OVERVOLTAGE AND OVERCURRENT INTERRUPTS ALTERNATIVE OUTPUT FUNCTIONS ADE7953 INTERRUPTS PRIMARY INTERRUPTS (VOLTAGE CHANNEL AND CURRENT CHANNEL A) CURRENT CHANNEL B INTERRUPTS COMMUNICATING WITH THE ADE7953 COMMUNICATION AUTODETECTION LOCKING THE COMMUNICATION INTERFACE SPI INTERFACE I2C INTERFACE I2C Write Operations I2C Read Operations UART INTERFACE UART Read UART Write COMMUNICATION VERIFICATION AND SECURITY WRITE PROTECTION COMMUNICATION VERIFICATION CHECKSUM REGISTER ADE7953 REGISTERS ADE7953 REGISTER DESCRIPTIONS Interrupt Enable and Interrupt Status Registers Current Channel A and Voltage Channel Registers Current Channel B Registers LAYOUT GUIDELINES OUTLINE DIMENSIONS ORDERING GUIDE