Datasheet ADP5065 (Analog Devices) - 7

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Data Sheet ADP5065 ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Table 4. Parameter Rating
θJA is specified for the worst-case conditions, that is, a device VIN1, VIN2 to PGND1, PGND2 −0.5 V to +20 V soldered in a circuit board for surface-mount packages. All Other Pins to AGND −0.3 V to +6 V
Table 5. Thermal Resistance
Continuous Drain Current, Battery Supple-
Package Type θ
mentary Mode, from ISO_Bx to ISO_Sx
JA θJC θJB Unit
20-Lead WLCSP1 46.8 0.7 9.2 °C/W TJ ≤ 85°C 2.2 A T 1 5 × 4 array, 0.5 mm pitch (2.75 mm × 2.08 mm); based on a JEDEC, 2S2P, J = 125°C 1.1 A 4-layer board with 0 m/sec airflow. Storage Temperature Range −65°C to +150°C
Maximum Power Dissipation
Operating Junction Temperature Range −40°C to +125°C Soldering Conditions JEDEC J-STD-020 The maximum safe power dissipation in the ADP5065 package Stresses above those listed under Absolute Maximum Ratings is limited by the associated rise in junction temperature (TJ) on may cause permanent damage to the device. This is a stress the die. At approximately 150°C, which is the glass transition temperature, the plastic changes its properties. Even temporarily rating only; functional operation of the device at these or any exceeding this temperature limit may change the stresses that other conditions above those indicated in the operational the package exerts on the die, permanently shifting the para- section of this specification is not implied. Exposure to absolute metric performance of the ADP5065. Exceeding a junction maximum rating conditions for extended periods may affect temperature of 175°C for an extended period of time can result device reliability. in changes in the silicon devices that potentially cause failure.
ESD CAUTION
Rev. D | Page 7 of 40 Document Outline Features Applications Functional Block Diagram General Description Revision History Specifications Recommended Input and Output Capacitance I2C-Compatible Interface Timing Specifications Timing Diagram Absolute Maximum Ratings Thermal Resistance Maximum Power Dissipation ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Temperature Characteristics Typical Waveforms Theory of Operation Introduction Charger Modes Input Current Limit USB Compatibility Trickle Charge Mode Trickle Charge Mode Timer Weak Charge Mode (Constant Current) Fast Charge Mode (Constant Current) Fast Charge Mode (Constant Voltage) Fast Charge Mode Timer Watchdog Timer Safety Timer Charge Complete Recharge Battery Charging Enable/Disable Thermal Management Isothermal Charging Thermal Shutdown and Thermal Early Warning Fault Recovery Battery Isolation FET Battery Detection Battery Level Detection Battery (ISO_Bx) Short Detection Battery Pack Temperature Sensing Battery Thermistor Input JEITA Li-Ion Battery Temperature Charging Specification External Resistor for V_WEAK_SET I2C Interface Charger Operational Flowchart I2C Register Map Register Bit Descriptions Applications Information External Components Inductor Selection ISO_Sx (VOUT) and ISO_Bx Capacitor Selection VINx Capacitor Selection CFILT Capacitor Selection PCB Layout Guidelines Power Dissipation and Thermal Considerations Charger Power Dissipation Junction Temperature Factory-Programmable Options Packaging and Ordering Information Outline Dimensions Ordering Guide