Datasheet LTM8026 (Analog Devices) - 2
| Hersteller | Analog Devices |
| Beschreibung | 36VIN, 5A CVCC Step-Down µModule Regulator |
| Seiten / Seite | 28 / 2 — ABSOLUTE MAXIMUM RATINGS. (Note 1). PIN CONFIGURATION … |
| Dateiformat / Größe | PDF / 432 Kb |
| Dokumentensprache | Englisch |
ABSOLUTE MAXIMUM RATINGS. (Note 1). PIN CONFIGURATION http://www.linear.com/product/LTM8026#orderinfo
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LTM8026
ABSOLUTE MAXIMUM RATINGS (Note 1)
VIN ..40V Current Into RUN Pin ..100µA ADJ, RT, COMP, CTL_I, CTL_T, VREF ...3V Internal Operating Temperature Range .. –40°C to 125°C VOUT ..25V Peak Solder Reflow Body Temperature ... 245°C RUN, SYNC, SS ...6V Storage Temperature.. –55°C to 125°C
PIN CONFIGURATION http://www.linear.com/product/LTM8026#orderinfo
TOP VIEW TOP VIEW T_T T_I T_T T_I CL CL V REF RT COMP SS ADJ CL CL V REF RT COMP SS ADJ 8 8 7 SYNC 7 SYNC BANK 2 GND BANK 2 GND 6 RUN 6 RUN 5 5 4 4 BANK 1 BANK 1 3 3 VOUT BANK 3 VOUT BANK 3 2 2 VIN VIN 1 1 A B C D E F G H J K L A B C D E F G H J K L LGA PACKAGE BGA PACKAGE 81-LEAD (15mm × 11.25mm × 2.82mm) 81-LEAD (15mm × 11.25mm × 3.42mm) TJMAX = 125°C, θJA = 18.6°C/W, θJC(bottom) = 5.4°C/W, θJB = 5.6°C/W, θJC(top) = 10.8°C/W TJMAX = 125°C, θJA = 18.6°C/W, θJC(bottom) = 5.4°C/W, θJB = 5.6°C/W, θJC(top) = 10.8°C/W WEIGHT = 1.4g, θ VALUES DERIVED FROM A 4-LAYER 7.62cm × 7.62cm WEIGHT = 1.4g, θ VALUES DERIVED FROM A 4-LAYER 7.62cm × 7.62cm
ORDER INFORMATION PART NUMBER PAD OR BALL FINISH PART MARKING* PACKAGE MSL TEMPERATURE RANGE TYPE RATING (Note 2) DEVICE FINISH CODE
LTM8026EV#PBF Au (RoHS) LTM8026V e4 LGA 3 –40°C to 125°C LTM8026IV#PBF Au (RoHS) LTM8026V e4 LGA 3 –40°C to 125°C LTM8026MPV#PBF Au (RoHS) LTM8026V e4 LGA 3 –55°C to 125°C LTM8026EY#PBF SAC305 (RoHS) LTM8026Y e1 BGA 3 –40°C to 125°C LTM8026IY#PBF SAC305 (RoHS) LTM8026Y e1 BGA 3 –40°C to 125°C LTM8026IY SnPb (63/37) LTM8026Y e0 BGA 3 –40°C to 125°C LTM8026MPY#PBF SAC305 (RoHS) LTM8026Y e1 BGA 3 –55°C to 125°C LTM8026MPY SnPb (63/37) LTM8026Y e0 BGA 3 –55°C to 125°C Consult Marketing for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Device temperature grade is indicated by a label on the shipping Procedures: container. Pad or ball finish code is per IPC/JEDEC J-STD-609. www.linear.com/umodule/pcbassembly • Terminal Finish Part Marking: • LGA and BGA Package and Tray Drawings: www.linear.com/leadfree www.linear.com/packaging 8026fd 2 For more information www.linear.com/LTM8026 Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Pin Configuration Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Typical Applications Package Description Package Photo Package Description Revision History Typical Application Design Resources Related Parts
ABSOLUTE MAXIMUM RATINGS (Note 1)
VIN ..40V Current Into RUN Pin ..100µA ADJ, RT, COMP, CTL_I, CTL_T, VREF ...3V Internal Operating Temperature Range .. –40°C to 125°C VOUT ..25V Peak Solder Reflow Body Temperature ... 245°C RUN, SYNC, SS ...6V Storage Temperature.. –55°C to 125°C
PIN CONFIGURATION http://www.linear.com/product/LTM8026#orderinfo
TOP VIEW TOP VIEW T_T T_I T_T T_I CL CL V REF RT COMP SS ADJ CL CL V REF RT COMP SS ADJ 8 8 7 SYNC 7 SYNC BANK 2 GND BANK 2 GND 6 RUN 6 RUN 5 5 4 4 BANK 1 BANK 1 3 3 VOUT BANK 3 VOUT BANK 3 2 2 VIN VIN 1 1 A B C D E F G H J K L A B C D E F G H J K L LGA PACKAGE BGA PACKAGE 81-LEAD (15mm × 11.25mm × 2.82mm) 81-LEAD (15mm × 11.25mm × 3.42mm) TJMAX = 125°C, θJA = 18.6°C/W, θJC(bottom) = 5.4°C/W, θJB = 5.6°C/W, θJC(top) = 10.8°C/W TJMAX = 125°C, θJA = 18.6°C/W, θJC(bottom) = 5.4°C/W, θJB = 5.6°C/W, θJC(top) = 10.8°C/W WEIGHT = 1.4g, θ VALUES DERIVED FROM A 4-LAYER 7.62cm × 7.62cm WEIGHT = 1.4g, θ VALUES DERIVED FROM A 4-LAYER 7.62cm × 7.62cm
ORDER INFORMATION PART NUMBER PAD OR BALL FINISH PART MARKING* PACKAGE MSL TEMPERATURE RANGE TYPE RATING (Note 2) DEVICE FINISH CODE
LTM8026EV#PBF Au (RoHS) LTM8026V e4 LGA 3 –40°C to 125°C LTM8026IV#PBF Au (RoHS) LTM8026V e4 LGA 3 –40°C to 125°C LTM8026MPV#PBF Au (RoHS) LTM8026V e4 LGA 3 –55°C to 125°C LTM8026EY#PBF SAC305 (RoHS) LTM8026Y e1 BGA 3 –40°C to 125°C LTM8026IY#PBF SAC305 (RoHS) LTM8026Y e1 BGA 3 –40°C to 125°C LTM8026IY SnPb (63/37) LTM8026Y e0 BGA 3 –40°C to 125°C LTM8026MPY#PBF SAC305 (RoHS) LTM8026Y e1 BGA 3 –55°C to 125°C LTM8026MPY SnPb (63/37) LTM8026Y e0 BGA 3 –55°C to 125°C Consult Marketing for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Device temperature grade is indicated by a label on the shipping Procedures: container. Pad or ball finish code is per IPC/JEDEC J-STD-609. www.linear.com/umodule/pcbassembly • Terminal Finish Part Marking: • LGA and BGA Package and Tray Drawings: www.linear.com/leadfree www.linear.com/packaging 8026fd 2 For more information www.linear.com/LTM8026 Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Pin Configuration Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Typical Applications Package Description Package Photo Package Description Revision History Typical Application Design Resources Related Parts