Datasheet LTM4649 (Analog Devices) - 2
| Hersteller | Analog Devices |
| Beschreibung | 10A Step-Down DC/DC µModule Regulator |
| Seiten / Seite | 30 / 2 — ABSOLUTE MAXIMUM RATINGS. PIN CONFIGURATION. (Note 1). ORDER INFORMATION … |
| Dateiformat / Größe | PDF / 1.4 Mb |
| Dokumentensprache | Englisch |
ABSOLUTE MAXIMUM RATINGS. PIN CONFIGURATION. (Note 1). ORDER INFORMATION http://www.linear.com/product/LTM4649#orderinfo
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LTM4649
ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION (Note 1)
TOP VIEW VIN ... –0.3V to 18V A B C D E F G VOUT .. –0.3V to 3.6V GND V GND IN RUN INTV 1 CC, PGOOD, RUN .. –0.3V to 6V CLKOUT MODE, CLKIN, TRACK/SS, DIFFP, DIFFN, 2 CLKIN NC FREQ DIFFOUT, PHMODE ...–0.3V to INTV 3 CC PHMODE INTVCC V 4 FB .. –0.3V to 2.7V MODE TRACK/SS COMP (Note 3) .. –0.3V to 2.7V 5 SW COMP INTV TEMP 6 CC Peak Output Current ..100mA NC VFB DIFFN Internal Operating Temperature Range 7 PGOOD DIFFP (Note 2) .. –55°C to 125°C 8 DIFFOUT Storage Temperature Range .. –55°C to 125°C 9 VOUT_LCL Peak Solder Reflow Package Body Temperature ... 245°C 10 11 GND VOUT BGA PACKAGE 68-LEAD (9mm × 15mm × 4.92mm) TJMAX = 125°C, θJA = 14°C/W, θJCbottom = 5°C/W, θJCtop = 20°C/W θJB + θBA = 14°C/W, WEIGHT = 1.7g
ORDER INFORMATION http://www.linear.com/product/LTM4649#orderinfo PART NUMBER PAD OR BALL FINISH PART MARKING* PACKAGE MSL TEMPERATURE RANGE TYPE RATING (Note 2) DEVICE FINISH CODE
LTM4649EY#PBF SAC305 (RoHS) LTM4649Y e1 BGA 3 –40°C to 125°C LTM4649IY#PBF SAC305 (RoHS) LTM4649Y e1 BGA 3 –40°C to 125°C LTM4649IY SnPb (63/37) LTM4649Y e0 BGA 3 –40°C to 125°C Consult Marketing for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Device temperature grade is indicated by a label on the shipping Procedures: container. Pad or ball finish code is per IPC/JEDEC J-STD-609. www.linear.com/umodule/pcbassembly • Pb-free and Non-Pb-free Part Markings: • LGA and BGA Package and Tray Drawings: www.linear.com/leadfree www.linear.com/packaging 4649fc 2 For more information www.linear.com/LTM4649 Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Typical Applications Package Description Package Photo Revision History Typical Application Design Resources Related Parts
ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION (Note 1)
TOP VIEW VIN ... –0.3V to 18V A B C D E F G VOUT .. –0.3V to 3.6V GND V GND IN RUN INTV 1 CC, PGOOD, RUN .. –0.3V to 6V CLKOUT MODE, CLKIN, TRACK/SS, DIFFP, DIFFN, 2 CLKIN NC FREQ DIFFOUT, PHMODE ...–0.3V to INTV 3 CC PHMODE INTVCC V 4 FB .. –0.3V to 2.7V MODE TRACK/SS COMP (Note 3) .. –0.3V to 2.7V 5 SW COMP INTV TEMP 6 CC Peak Output Current ..100mA NC VFB DIFFN Internal Operating Temperature Range 7 PGOOD DIFFP (Note 2) .. –55°C to 125°C 8 DIFFOUT Storage Temperature Range .. –55°C to 125°C 9 VOUT_LCL Peak Solder Reflow Package Body Temperature ... 245°C 10 11 GND VOUT BGA PACKAGE 68-LEAD (9mm × 15mm × 4.92mm) TJMAX = 125°C, θJA = 14°C/W, θJCbottom = 5°C/W, θJCtop = 20°C/W θJB + θBA = 14°C/W, WEIGHT = 1.7g
ORDER INFORMATION http://www.linear.com/product/LTM4649#orderinfo PART NUMBER PAD OR BALL FINISH PART MARKING* PACKAGE MSL TEMPERATURE RANGE TYPE RATING (Note 2) DEVICE FINISH CODE
LTM4649EY#PBF SAC305 (RoHS) LTM4649Y e1 BGA 3 –40°C to 125°C LTM4649IY#PBF SAC305 (RoHS) LTM4649Y e1 BGA 3 –40°C to 125°C LTM4649IY SnPb (63/37) LTM4649Y e0 BGA 3 –40°C to 125°C Consult Marketing for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Device temperature grade is indicated by a label on the shipping Procedures: container. Pad or ball finish code is per IPC/JEDEC J-STD-609. www.linear.com/umodule/pcbassembly • Pb-free and Non-Pb-free Part Markings: • LGA and BGA Package and Tray Drawings: www.linear.com/leadfree www.linear.com/packaging 4649fc 2 For more information www.linear.com/LTM4649 Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Typical Applications Package Description Package Photo Revision History Typical Application Design Resources Related Parts